945 resultados para Ti-Mo alloys
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The electronic properties of wide energy gap zinc-blende structure GaN, AlN and their alloys Ga1-xAlxN are investigated using the empirical pseudopotential method. Electron and hole Effective mass parameters, hydrostatic and shear deformation potential constants of the valence band at Gamma and those of the conduction band at Gamma and X are obtained. The energies of Gamma, X, L conduction valleys of Ga1-xAlxN alloy versus Al fraction x are also calculated. The information will be useful for the design of lattice mismatched heterostructure optoelectronic devices in the blue light range.
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In this article, the MCs(+)-SIMS technique has been used to characterize Ti/Al2O3 metal/insulator interfaces. Our experiment shows that by detecting MCs(+) secondary ions, the matrix and interface effects are reduced, and good depth profiles have been obtained. The experimental result also shows that with the increase of the annealing temperature (RT, 300 degrees C, 600 degrees C, 850 degrees C), the interface gets broadened gradually, indicating diffusion and reaction take place at the interface, and the interface reaction is enhanced with the increase in annealing temperature. When the temperature increases, the AlCs+ signal forms two plateaus in the Ti layer, indicating Al from the decomposition of Al2O3 diffuses into the Ti layer and exists as two new forms (phases). Also, with the increase of the annealing temperature, oxygen diffuses into the Ti layer gradually, and makes the O signal in the Ti layer increase significantly in the 850 degrees C annealed sample.
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Homoepitaxial growth of4H-SiC on off-oriented Si-face (0001) 4H-SiC substrates was performed at 1500℃ by using the step controlled Epitaxy. Ti/4H-SiC Schottky barrier diodes (SBDs) with blocking voltage over lkV have been made on an undoped epilayer with 32μm in thick and 2-5 × 10^15 cm^-3 in carrier density. The diode rectification ratio of forward to reverse (defined at ± 1V) is over 107 at room temperature and over 10^2 at 538K. Their electrical characteristics were studied by the current-voltage measurements in the temperature range from 20 to 265 ℃. The ideality factor and Schottky barrier height obtained at room temperature are 1.33 and 0. 905eV, respectively. The SBDs have on-state current density of 150A/cm^2 at a forward voltage drop of about 2.0V. The specific on-resistance for the rectifier is found to be as 7.9mΩ · cm^2 and its variation with temperature is T^2.0.
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A novel 800nm Bragg mirror type of semiconductor saturable absorption mirror with low temperature method and surface state method combined absorber is presented.With which passive Kerr lens mode locking of Ti∶Al2O3 laser pumped by argon ion laser is realized,which produces pulses as short as 40fs.The spectrum bandwidth is 56nm,which means that it can support the modelocking of 20fs.The pulse frequency is 97.5MHz;average output power is 300mW at the pump power of 4.45W.
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在N型6H-SiC外延片上,通过热蒸发,制作Ti/6H-SiC肖特基势垒二极管(SBD)。通过化学气相淀积,进行同质外延生长,详细测量并分析了肖特基二极管的电学特性,该肖特基二极管具有较好的整流特性。反向击穿电压约为400V,室温下,反向电压V_R=200V时,反向漏电流J_R低于1×10~(-4)A/cm~2。采用Ne离子注入形成非晶层,作为边缘终端,二极管的击穿电压增加到约为800V。
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国家自然科学基金
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结果表明,在淀积过程中,最初淀积的Ti与衬底表面的氧形成Ti-O键,界面区很窄;450℃退火1h后,有少量元素态Al、Si原子析出,界面区有所展宽,但变化不大;650℃退火1h后,界面发生强烈反应,有TiO和Ti-Al、Ti-Si化合物生成。850℃退火1h后,除上述反应产物外又生成了Ti_2O。
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用X射线衍射分析、二次离子质谱、卢瑟福背散射谱、俄歇电子能谱等表面分析技术,研究了Ti膜与AlN陶瓷衬底的界面固相反应。在高真空中用电子束蒸发的方法在抛光的200℃AlN陶瓷衬底上淀积200nm的Ti膜,并在真空恒温炉中退火。实验表明,退火中Ti膜与AlN界面发生了扩散与反应。650℃,1h退火已观测到明显的界面反应。界面反应产物主要是钛铝化物及Ti-N化合物。铝化物是Ti-Al二元化合物和Ti-Al-N三元化合物,850℃,4h退火后则主要由Ti_2AlN组成。
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采用电子束蒸发的方法在抛光的200℃AlN陶瓷衬底上淀积厚度为200nm的Ti膜,并在高真空中退火。研究了从200 ̄850℃温区内Ti与AlN的固相界面反应,给出了界面组分分布随退火温度和时间的变化关系。在界面区发生了三元铝化物并观测到铝化物产生与发展过程。
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在超高真空中用电子束蒸发在抛光的(1102)取向的蓝宝石(a-Al_2O_3)衬底上蒸镀500 nm的Ti膜,在恒温炉中退火,然后用XRD(包括一般的和小角度的X射线衍射),AES和SIMS等表面分析技术详细研究了从室温至850℃,Ti与a-Al_2O_3的固相界面反应.首次系统提出了不同反应温区相应的化学反应式,讨论了采用体材料数据作热力学计算来预言Ti/a-Al_2O_3界面反应的局限性.
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4d过渡杂质Mo、Pd在GaAs中分别引入E(0.42eV)、H(0.61eV)和E(0.66eV)、H(0.69eV)等能级。根据过渡杂质Mo和Pd在GaAs中的光电行为, 推测这些杂质在GaAs中不起有效复合中心的作用。图4参3
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于2010-11-23批量导入
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Carrier recombination dynamics in AlInGaN alloy has been studied by photoluminescence (PL) and time-resolved photoluminescence (TRPL). The fast redshift of PL peak energy is observed and well fitted by a physical model considering the thermal activation and transfer processes. This result provides evidence for the exciton localization in the quantum dot (QD)-like potentials in our AlInGaN alloy. The TRPL signals are found to be described by a stretched exponential function of exp[(-t/tau)(beta)], indicating the presence of a significant disorder in the material. The disorder is attributed to a randomly distributed quantum dots or clusters caused by indium fluctuations. By studying the dependence of the dispersive exponent 8 on the temperature and emission energy, we suggest that the exciton hopping dominate the diffusion of carriers localized in the disordered quantum dots. Furthermore, the localized states are found to have OD density of states up to 250 K, since the radiative lifetime remains almost unchanged with increasing temperature.
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Using thermal evaporation, Ti/6H-SiC Schottky barrier diodes (SBD) were fabricated. They showed good rectification characteristics from room temperature to 200degreesC. At low current density. the current conduction mechanism follows the thermionic emission theory. These diodes demonstrated a low reverse leakage current of below 1 X 10(-4)Acm(-2). Using neon implantation to form the edge termination, the breakdown voltage was improved to be 800V. In addition. these SBDs showed superior switching characteristics.