基于InP/空气隙分布布拉格反射镜的微机械可调谐光滤波器

采用表面微机械技术制作了一种1310 nm基于InP/空气隙分布布拉格反射镜的微机械可调谐Fabry-Perot光滤波器.该滤波器的通光孔直径约为70 μm,在1.4 V的调谐电压下,调谐范围达到15 nm.并采用光学传输矩阵方法,分析了斜入射对这种可调谐光滤波器透射谱的峰值半高宽的影响.

利用光子晶体提高InP基LED出光效率

应用FDTD方法计算了二维无限大光子晶体的能带结构，并制备出了InP基二维平板结构的光子晶体器件．在制备过程中尝试了仅用PMMA做掩模以及PMMA和SiO2做掩模两种方法，结果表明，不使用SiO2做掩模的情况下，由于PMMA胶选择性较差，在刻蚀过程中难以保证图形的准确转移．而增加SiO2掩模后，获得了图形质量良好的光子晶体结构，成功实现了利用光子晶体结构增强LED的出光效率，与未制作光子晶体结构的LED相比，光子晶体结构LED的出光效率可在原来基础上提高1倍以上．并且随着晶格常数的增加，出光效率进一步提高。

InP基HEMT器件中二维电子气浓度及分布与沟道层厚度关系的理论分析

利用数值计算的方法研究了InP基高电子迁移率晶体管（HEMT）中沟道厚度对沟道中二维电子气（2DEG）性质的影响,并对产生这种影响的原因进行了深入探讨.计算结果表明,当沟道层厚度从10nm增加到40nm时,沟道中2DEG的密度几乎没有变化,但激发态和基态上的电子密度之比（R）先增加后减小.当沟道层厚度在20-25nm之间时,R达到最大.此结果可作为优化器件结构设计的依据.

InP/Si键合界面热应力分析

从理论上分析了键合热应力产生的原因,在此基础上,采用双层条状金属热应力模型讨论InP/Si键合过程中应力的大小及分布情况.结果表明, 由剪切应力和晶片弯矩决定的界面正应力是晶片中心区域大面积键合失败的主要原因,同时InP/Si键合合适的退火温度应该在250～300 ℃.最后在300 ℃退火条件下很好地实现了InP/Si键合,界面几乎没有气泡,有效键合面积超过90%.

键合法制备硅基1.55μm InP-InGaAsP量子阱激光器

在硅基上成功地制备出了1．55μm InP-InGaAsP量子阱激光器．设计并生长了适合于键合的量子阱激光器结构材料，通过直接键合技术，将Si衬底与InP-InGaAsP外延片键合到一起．剥离去掉InP衬底后，在5～6μm的薄膜上制备出20μm条形边发射激光器．室温下，阈值电流160mA（电流密度为2．7kA／cm^2），功率可达10mW以上（在约350mA电流下），实现了1．55μm长波长边发射激光器与Si的集成．目前，该结果国际上还未见报道．

半绝缘InP中深能级缺陷对电学性质的影响和缺陷的控制

综合深能级缺陷和电学性质的测试结果，证明了半绝缘InP单晶材料的电学性能、热稳定性、均匀性等性能与材料中一些深能级缺陷的含量密切相关．通过分析深能级缺陷产生的规律与热处理及生长条件的关系，给出了抑制缺陷产生，提高材料质量的途径．对缺陷的属性与形成机理进行了分析讨论。

InAs Wires on InP （001）

The heterostructure of InAs/In0.52Al0.48As/InP is unique in that InAs wires instead of dots self-assemble in molecular beam epitaxy. These InAs wires have some distinctive features in their growth and structure. This paper summarizes the investigations of the growth and structural properties of InAs wires that have been performed in our laboratory recently.

1.3-μm uncooled 10 Gb/s directly modulated MQW AlGaInAs/InP laser diodes

In this paper, we report a novel 1.3-μm uncooled AlGaInAs/InP multiple quantum well (MQW) ridge waveguide laser diodes. By optimizing the design of MQW structure and facet coatings, together with the application of reversed-mesa ridge waveguide (RM-RWG) structure, polyimide planarization, and lift-off processes technology, an uncooled 1.3-μm, 10-Gb/s directly modulated MQW ridge waveguide laser diode was successfully fabricated. The threshold current and the slope efficiency were 7 mA and 0.48 mW/mA, respectively. The directly modulated bandwidths of 11 and 9.2 GHz were achieved at room temperature and 80 Celsius degrees, respectively.

Material Growth and Device Fabrication of GaAs Based 1.3μm GaInNAs Quantum Well Laser Diodes

Material growth and device fabrication of the first 1.3μm quantum well （QW） edge emitting laser diodes in China are reported. Through the optimization of the molecular beam epitaxy （MBE） growth conditions and the tuning of the indium and nitrogen composition of the GalnNAs QWs, the emission wavelengths of the QWs can be tuned to 1.3μm. Ridge geometry waveguide laser diodes are fabricated. The lasing wavelength is 1.3μm under continuous current injection at room temperature with threshold current of 1kA/cm^2 for the laser diode structures with the cleaved facet mirrors. The output light power over 30mW is obtained.

基于硫化物表面处理的InP/GaAs低温晶片键合

提出一种新的基于硫化物表面处理的InP/GaAs低温晶片键合技术.在360℃的退火温度下,获得了1.2MPa的键合强度.基于这种低温键合技术,可将外延生长在InP衬底上的In0.53Ga0.47As/InP多量子阱(MQW)键合并转移到GaAs衬底上.X射线衍射表明量子阱的结构未受键合过程的影响.光致发光谱分析表明键合后量子阱的晶体质量略有改善.电流电压特性的测试表明n-InP/n-InP的键合界面具有良好的导电特性;在n-InP/n-GaAs 的键合界面存在着电荷势垒,这主要是由于键合界面存在GaAs氧化物薄层所致.

MBE Growth of High Electron Mobility InP Epilayers

The molecular beam epitaxial growth of high quality epilayers on （100） InP substrate using a valve phosphorous cracker cell over a wide range of P/In BEP ratio （2.0-7.0） and growth rate （0.437 and 0. 791μm/h）. Experimental results show that electrical properties exhibit a pronounced dependence on growth parameters,which are growth rate, P/In BEP ratio, cracker zone temperature, and growth temperature. The parameters have been optimized carefully via the results of Hall measurements. For a typical sample, 77K electron mobility of 4.57 × 10^4 cm^2/（V · s） and electron concentration of 1.55×10^15 cm^-3 have been achieved with an epilayer thickness of 2.35μm at a growth temperature of 370℃ by using a cracking zone temperature of 850℃.

Material Growth and Device Fabrication of GaN-Based Blue-Violet Laser Diodes

Studies on first GaN-based blue-violet laser diodes(LDs) in China mainland are reported.High quality GaN materials as well as GaN-based quantum wells laser structures are grown by metal-organic chemical vapor deposition method.The X-ray double-crystal diffraction rocking curve measurements show the full-width half maximum of 180" and 185" for (0002) symmetric reflection and (10(-1)2) skew reflection,respectively.A room temperature mobility of 850cm2/(V·s) is obtained for a 3μm thick GaN film.Gain guided and ridge geometry waveguide laser diodes are fabricated with cleaved facet mirrors at room temperature under pulse current injection.The lasing wavelength is 405.9nm.A threshold current density of 5kA/cm2 and an output light power over 100mW are obtained for ridge geometry waveguide laser diodes.

InP基长波长光发射OEIC材料的MOCVD生长

为了生长制作器件所需的外延片,采用低压金属有机物化学气相沉积方法在半绝缘InP衬底上生长了InP/InGaAs异质结双极晶体管(HBT)结构、1.55μm多量子阱激光二极管以及两者集成的光发射光电集成电路材料结构.激光器结构的生长温度为655℃,有源区为5个周期的InGaAsP/ InGaAsP多量子阱(阱区λ＝1.6μm,垒区λ＝1.28μm);HBT结构则采用550℃低温生长,其中基区采用Zn掺杂,掺杂浓度约为2×1019cm-3.对生长的各种结构分别进行了X射线双晶衍射,光致发光谱和二次离子质谱仪的测试,结果表明所生长的材料结构已满足制作器件的要求.

InP基多周期InAs/InAlGaAs量子点阵列的结构和光学性质

在InP(001)衬底上使用分子束外延技术自组织生长了多周期InAs/InAlGaAs量子点阵列结构.根据对透射电镜和光致发光谱结果的分析,认为引入与InP衬底晶格匹配的InAlGaAs缓冲层可以获得较大的InAs量子点结构,而InAlGaAs层的表面特性对InAs量子点的结构及光学性质有很大影响.对InP基InAlGaAs缓冲层上自组织量子点的形核和演化机制进行了探讨,提出量子点的演化过程表现为量子点的合并长大并伴随着自身的徙动,以获得能量最优的分布状态.

Design and Realization of Resonant Tunneling Diodes with New Material Structure

A new material structure with Al0.22Ga(>. 78 As/Ino.i5 Gao.ss As/GaAs emitter spacer layer and GaAs/Ino.15-Gao.8ii As/GaAs well for resonant tunneling diodes is designed and the corresponding device is fabricated. RTDs DC characteristics are measured at room temperature. Peak-to-valley current ratio and the available current density for RTDs at room temperature are computed. Analysis on these results suggests that adjusting material structure and optimizing fabrication processes will be an effective means to improve the quality of RTDs.