Effects of Thickness on Properties of ZnO Films Grown on Si by MOCVD

High quality ZnO films are successfully grown on Si（100） substrates by metal-organic chemical vapor deposition at 300℃. The effects of the thickness of the ZnO films on crystal structure, surface morphology,and optical properties are investigated using X-ray diffraction, scanning probe microscopy,and photoluminescence spectra, respectively. It is shown that the ZnO films grown on Si substrates have a highly-preferential C-axis orientation,but it is difficult to obtain the better structural and optical properties of the ZnO films with the increasing of thickness. It is maybe due to that the grain size and the growth model are changed in the growth process.

径向三重流MOCVD反应器输运过程的数值模拟

对径向三重流MOCVD反应器的输运过程进行了二维数值模拟研究.在模拟计算中,分别改变反应腔几何尺寸、导流管位置、流量、压强、温度等条件,得到反应器流场、温场、浓度场的相应变化.根据对模拟结果的分析,发现反应腔内涡旋首先在流动的转折处产生,上下壁面温差的加大使涡旋增大,中管进口流量的增加对涡旋产生抑制作用,内管和外管流量的增加对涡旋产生扩大作用.得出输运过程的优化条件为:反应腔上下壁靠近,导流管水平延长,中管进口流量尽量大于内、外管流量,压强尽量低于105Pa,上下壁面温差尽量减小等.

Twinning in Low-Temperature MOCVD Grown GaN on (001) GaAs Substrate

GaN buffer layers (thickness ～60nm) grown on GaAs(001) by low-temperature MOCVD are investigated by X-ray diffraction pole figure measurements using synchrotron radiation in order to understand the heteroepitaxial growth features of GaN on GaAs(001) substrates. In addition to the epitaxially aligned crystallites,their corresponding twins of the first and the second order are found in the X-ray diffraction pole figures. Moreover, { 111 } q scans with χ at 55° reveal the abnormal distribution of Bragg diffractions. The extra intensity maxima in the pole fig ures shows that the process of twinning plays a dominating role during the growth process. It is suggested that the polarity of { 111 } facets emerged on (001) surface will affect the growth-twin nucleation at the initial stages of GaN growth on GaAs(001) substrates. It is proposed that twinning is prone to occurring on { 111 } B, N-terminated facets.

缓冲层厚度对MOCVD法生长GaN外延薄膜性能的影响

本文研究了低温GaN(LT-GaN)缓冲层表面形貌,其随厚度的变化规律及对随后生长GaN外延膜各项性能的影响.用场发射扫描电镜(SEM)和原子力显微镜(AFM)研究LT-GaN缓冲层表面形貌,发现随着厚度的增加,其表面由疏松、粗糙变得致密、平整,六角GaN小晶粒的数量减少,且取向较为一致.用X光双晶衍射(XRD)、AFM和Hall测量研究1μm厚本征GaN外延薄膜的结晶质量、表面粗糙度、背底载流子浓度和迁移率等性能,发现随着LT-GaN缓冲层厚度的增加:XRD的半高宽FWHMs增大,表面粗糙度先减小后又略有增大,背底载流子浓度则随之减少,而迁移率的变化则不明显.通过分析进一步确认LT-GaN缓冲层的最优生长时间.

MOCVD生长AlGaInN外延层的光学性质研究

对AlInGaN四元合金进行了微区发光和拉曼散射研究.根据V-形缺陷周围扫描电镜图像和阴极荧光光谱的分析,确定AⅡnGaN外延层中V-形缺陷的形成与铟的分凝之间的关系.同时,用波长为325纳米的短波长激光研究了AlInGaN外延薄层的拉曼散射,测量了合金铝组分改变引起的A1(LO)声子的频率移动,观测到了出射共振引起的LO声子拉曼散射谱的共振加强,此共振过程的机制是一种类级联的电子-多声子互作用机制.

MOCVD生长Mg掺杂GaN的退火研究

用MOCVD技术在50mm蓝宝石衬底(0001)面上生长了GaN∶Mg外延膜,对样品进行热退火处理并作了Hall、双晶X射线衍射(DCXRD)和室温光致发光谱(PL)测试.Hall测试结果表明,950℃退火后空穴浓度达到5×1017cm-3以上,电阻率降到2.5Ω·cm;(0002)面DCXRD测试发现样品退火前、后的半峰宽均约为4′;室温PL谱中发光峰位于2.85eV处,退火后峰的强度比退火前增强了8倍以上,表明样品中大量被H钝化的受主Mg原子在退火后被激活.

InP基长波长光发射OEIC材料的MOCVD生长

为了生长制作器件所需的外延片,采用低压金属有机物化学气相沉积方法在半绝缘InP衬底上生长了InP/InGaAs异质结双极晶体管(HBT)结构、1.55μm多量子阱激光二极管以及两者集成的光发射光电集成电路材料结构.激光器结构的生长温度为655℃,有源区为5个周期的InGaAsP/ InGaAsP多量子阱(阱区λ＝1.6μm,垒区λ＝1.28μm);HBT结构则采用550℃低温生长,其中基区采用Zn掺杂,掺杂浓度约为2×1019cm-3.对生长的各种结构分别进行了X射线双晶衍射,光致发光谱和二次离子质谱仪的测试,结果表明所生长的材料结构已满足制作器件的要求.

缓冲层生长压力对MOCVD GaN性能的影响

利用自制的在位监测系统, 研究了用金属有机物化学气相外延法(MOCVD)在蓝宝石衬底上生长GaN时, GaN低温缓冲层的生长压力对高温生长GaN外延层性能的影响规律. 在位监测曲线及扫描电子显微镜(SEM)分析结果表明, 缓冲层生长压力越大, GaN缓冲层退火后成核中心体积越小, 表面粗糙度越大, 高温生长GaN岛间合并延迟. X射线衍射(XRD)和光致发光谱(PL)测量结果表明, GaN缓冲层生长压力增大时外延的GaN结晶质量得到改善.

（111）A InP衬底上MOCVD外延InGaAsP的表面形貌和光学特性

为了研究(111)衬底的特性以及实现等边三角形微腔激光器，利用金属有机化学气相淀积(MOCVD)研究了(111)A InP衬底上InGaAsP外延层的表面形貌和光学特性。考虑到(111)A InP衬底的悬挂键密度比较低，在生长过程中有意提高了V／III比。通过扫描电子显微镜(SEM)和光荧光(PL)谱分别研究了外延层的表面形貌和光学特性。实验发现，表面形貌和光学特性随V／III比和温度的变化非常大。最佳V／IlI比和温度分别为400和625℃。

Si(111)衬底无微裂GaN的MOCVD生长

采用AlN插入层技术在Si(111)衬底上实现无微裂GaN MOCVD生长.通过对GaN外延层的a,c轴晶格常数的测量,得到了GaN所受张应力与AlN插入层厚度的变化关系.当AlN厚度在7～13nm范围内,GaN所受张应力最小,甚至变为压应力.因此,GaN微裂得以消除.同时研究了AlN插入层对GaN晶体质量的影响,结果表明,许多性能相比于没有AlN插入层的GaN样品有明显提高.

GAN_(1-x)P_x三元合金的MOCVD生长

用金属有机化学气相淀积技术在蓝宝石衬底上成功外延了高P组分的GaN_(1-x)P_x 三元合金。俄歇电子能谱深度剖面结果表明在GaN_(1-x)P_x 中P的掺入量最高达到20%且分布均匀；X射线光电子能谱价态分析证实了外延层中Ga-P键的存在。对不同P组分的GaN_(1-x)P_x 样品进行了低温光致发光（PL）测试，与来自GaN衬底的带边发射相比，随三元合金中P组分的变化，GaN_(1-x)P_x 的PL峰呈现出了不同程度的红移。在GaN_(1-x)P_x 的PL谱中没有观测到有关GaP的发射峰，表明该合金材料没有发生相分离。

窄条宽MOCVD选区生长InP系材料的速率增强因子

报道了窄条宽选区生长有机金属化学气相沉积（NSAG－MOCVD）成功生长的InP系材料，并提出在NSAG－MOCVD生长研究中，引入填充因子的必要性，给出速率增强因子随填充因子变化的经验公式，计算得出速率增强因子随填充因子的变化关系。与实验结果作了比较，发现InP的速率增强因子主要取决于掩膜宽度，InGaAsP的速率增强因子不仅与掩膜宽度有关，同时也依赖于生长厚度，且这种依赖性随掩膜宽度的增加而增加。

Spotsize Converter Integrated DFB Laser Diode Using Selective Area Growth of MOCVD

The characteristics of thickness enhancement factor and bandgap wavelength of selectively grown In-GaAsP are investigated. A high thickness enhancement factor of 2.9 is obtained. Spotsize converter integrated DFB lasers are fabricated by using the technique of SAG. The threshold current is as low as 10.8mA. The output power is 10m W at 60mA without coating and the SMSR is 35.8dB. The vertical far field angle (FWHM) is decreased from 34 °to 9 °. The tolerance of 1dBm misalignment is 3.4μm vertically.

Growth of Cubic GaN by MOCVD at High Temperature

High quality cubic GaN (c-GaN) is grown by metalorganic vapor deposition (MOCVD) at an increased growth temperature of 900 ℃, with the growth rate of 1.6 μm/h. The full width at half maximum (FWHM) of room temperature photoluminescence (PL) for the high temperature grown GaN film is 48meV. It is smaller than that of the sample grown at 830 ℃. In X-ray diffraction (XRD) measurement, the high temperature grown GaN shows a (002) peak at 20° with a FWHM of 21'. It can be concluded that, although c-GaN is of metastable phase, high growth temperature is still beneficial to the improvement in its crystal quality. The relationship between the growth rate and growth temperature is also discussed.

MOCVD生长碳掺杂GaAs/AlGaAs大功率半导体激光器

利用低压金属有机金属化合物汽相淀积方法,以液态CCl_4为掺杂源生长了高质量C掺杂GaAs/AlGaAs材料,并对生长机理、材料特性以及C掺杂对大功率半导体激光器的影响进行了分析。在材料研究的基础上生长了以C为P型掺杂剂的GaAs/AlGaAs/InGaAs应变量子阱半导体激光器结构,置备了高性能980 nm大功率半导体激光器。