PHOTOLUMINESCENCE SPECTRUM STUDY OF THE GAAS/SI EPILAYER GROWN BY USING A THIN AMORPHOUS SI FILM AS BUFFER LAYER

Recently, we reported successful growth of high-quality GaAs/Si epilayers by using a very thin amorphous Si film as buffer layer. In this paper, the impurity properties of this kind of GaAs/Si epilayers have been studied by using PL spectrum, SIMS and Hall measurement. Compared to a typical PL spectrum of the GaAs/Si epilayers grown by conventional two-step method, a new peak was observed in our PL spectrum at the energy of 1.462 eV, which is assigned to the band-to-silicon acceptor recombination. The SIMS analysis indicates that the silicon concentration in this kind of GaAs/Si epilayers is about 10(18) cm(-3). But its carrier concentration (about 4 x 10(17) cm(-3)) is lower than the silicon concentration. The lower carrier concentration in this kind of GaAs/Si epilayer can be interpreted both as the result of higher compensation and as the result of the formation of the donor-defect complex. We also found that the high-quality and low-Si-concentration GaAs/Si epilayers can be regrown by using this kind of GaAs/Si epilayer as substrate. The FWHM of the X-ray (004) rocking curve from this regrowth GaAs epilayer is 118 '', it is much less than that of the first growth GaAs epilayer (160 '') and other reports for the GaAs/Si epilayer grown by using conventional two-step method (similar to 200 '').

Si_(0.75)Ge_(0.25)虚衬底上应变补偿Si/Si_(0.62)Ge_(0.38)量子阱发光

由于Si/SiGe异质结构的带阶差主要发生在价带,为实现高效率的发光,本文从理论上设计了在硅基Si_(1-x) Ge_x虚衬底上外延应变补偿的Si/S_(1-y) Ge_y(y>x)量子阱的能带结构,将量子阱对电子的限制势垒提高到100meV以上.在实验上,采用300℃生长的Ge量子点插入层,制备出薄的SiGe驰豫缓冲层(虚衬底),表面Ge组份达到0.25,表面粗糙度小于2nm,驰豫度接近100%.在我们制备的SiGe缓冲层上外延了应变补偿SiGe/Si多量子阱结构,并初步研究了其发光特性.

Si／SiNx超晶格材料的非线性光学特性

采用射频磁控反应溅射技术与热退火处理制备了Si／SiN；超晶格材料。利用吸收光谱和X射线衍射对材料进行表征。通过皮秒脉冲激光单光束Z-扫描技术研究了该材料在非共振吸收区的三阶非线性光学特性，实验结果表明，样品的非线性折射率为负值，非线性吸收属于双光子吸收。由实验数据得到材料的三阶非线性极化率实部和虚部分别为1．27×10~(-7)，1．51×10~(-8)esu，该值比体硅材料的三阶非线性极化率值大5个数量级。对材料光学非线性产生的机理进行了探讨，认为材料的非线性极化率的增加来源于材料量子限制效应的增强。

氧离子束辅助激光淀积生长ZnO/Si薄膜深度剖析

对于在Si(111)上用氧离子束辅助(O~+-assisted)脉冲激光淀积(PLD)生长的ZnO薄膜,用X射线光电子能谱(XPS)深度剖析方法对长成的样品进行了异位测试,分析了导致各峰峰位能移的因素;通过异位与原位XPS谱图的比较,指出O+-assisted PLD法生成的ZnO薄膜中存在孔隙;指出生长出的ZnO薄膜中含si成分的厚度不超过18 nm;同时探讨了在长成的ZnO/Si上继续生长GaN薄膜的可行性.

DCXRD Investigation of a Ge/Si（001） Island Multilayer Structure

A Ge/Si（001） island multilayer structure is investigated by double crystal X-ray diffraction, transmission electron microscopy,and atomic force microscopy. We fit the satellite peaks in the rocking curve by two Lorentz lineshapes, which originate from the wetting layer region and the island region. Then from the ratio of the thick- nesses of the Si and Ge （GeSi） layers as determined by TEM,tbe Ge compositions of the wetting layer and islands are estimated to be about 0. 51 and 0. 67, respectively,according to the positions of the fitted peaks. This proves to be a relatively simple way to investigate the Ge/Si （001） island multilayer structure.

Uniformity Investigation in 3C-SiC Epitaxial Layers Grown on Si Substrates by Horizontal Hot-Wall CVD

50mm 3C-SiC epilayers are grown on （100） and （111） Si substrates in a newly developed horizontal lowpressure hot-wall CVD reactor under different growth pressures and flow rates of H_2 carrier gas. The structure,electrical properties, and thickness uniformity of the 3C-SiC epilayers are investigated by X-ray diffraction （XRD） ,sheet resistance measurement, and spectroscopic ellipsometry. XRD patterns show that the 3C-SiC films have excellent crystallinity. The narrowest full widths at half maximum of the SIC（200） and （111） peaks are 0.41° and 0.21°, respectively. The best electrical uniformity of the 50mm 3C-SiC films obtained by sheet resistance measurement is 2.15%. A σ/mean value of ± 5.7% in thickness uniformity is obtained.

射频磁控溅射制备掺Al的纳米Si-SiO_2复合薄膜及其光致发光特性

采用射频磁控技术和退火处理制备掺Al的纳米Si-SiO_2复合薄膜.通过X射线衍射(XRD)、X射线光电子能谱(XPS)和傅里叶变换红外光谱(FTIR)表征了薄膜的结构,组分和成键情况.掺Al在SiO_2中造成氧空位,使薄膜光致发光强度增强,并出现新的发光峰.退火温度对掺Al薄膜的光致发光的峰位和峰强有较大影响.

离子束溅射制备Si／Ge多层膜及红外吸收性能研究

采用离子束溅射方法在Si衬底上制备Si／Ge多层膜。通过改变生长温度、溅射速率等因素得到一系列Si／Ge多层膜样品。通过X射线衍射、拉曼散射、原子力显微分析（AFM）等表征方法研究薄膜结构与生长条件的关系。在小束流（10mA）、室温条件下制备出界面清晰、周期完整的Si／Ge多层膜。通过红外吸收谱的测量发现薄膜样品具有较好的红外吸收性能。

Low -temperature preparation of ZnO films on Si substrates by MOCVD

ZnO films were deposited on Si（100） substrates at 300℃ by metal - organic chemical vapor deposition（MOCVD）. The effect of different ratios of DEZn to N2O on crystal quality was analyzed. It is found that the optimum ratio of DEZn to N2O is 2.1. And in this optimum growth condition, X - ray diffraction （XRD） and scanning probe morphology （SPM） images indicate that the films grow along the c - axis orientation. ZnO film exhibits a strong UV optical absorption near 388 nm. And the optical absorbance is close to zero,that indicates nearly 100% optical transparence. Photoluminescence （PL） spectrum shows only strong near - band - edge emissions with little or no deep - level emission related to defects. The full - width at half - maximum （FWHM） of the ultraviolet emission peak is 80meV. The results indicate that better crystal quality can be obtained.

纳米Si镶嵌SiO2薄膜的发光与非线性光学特性的应用

采用射频磁控溅射技术和热退火处理制备了纳米Si镶嵌SiO2薄膜，在室温下观察到光致发光现象，峰值分别位于360，430和835nm，结合吸收谱、光致发光激发谱和X射线衍射分析讨论了发光机理．利用纳米Si镶嵌SiO2薄膜的非线性光学特性可作为可饱和吸收体，在Nd

Effects of Thickness on Properties of ZnO Films Grown on Si by MOCVD

High quality ZnO films are successfully grown on Si（100） substrates by metal-organic chemical vapor deposition at 300℃. The effects of the thickness of the ZnO films on crystal structure, surface morphology,and optical properties are investigated using X-ray diffraction, scanning probe microscopy,and photoluminescence spectra, respectively. It is shown that the ZnO films grown on Si substrates have a highly-preferential C-axis orientation,but it is difficult to obtain the better structural and optical properties of the ZnO films with the increasing of thickness. It is maybe due to that the grain size and the growth model are changed in the growth process.

LPCVD Growth of 3C-SiC on Si Mesas and SiO2/Si Substrates for MEMS Applications

This paper presents the development of LPCVD growth of 3C-SiC thin films grown on Si mesas and thermally oxidized SiO2 masks over Si with an area of 150 × 100μm^2 and SiO2/Si substrates. The growth has been performed via chemical vapor deposition using SiH4 and C2H4 precursor gases with carrier gas of H2. 3C-SiC films on these substrates were characterized by optical microscopy, X-ray diffraction （ XRD ）, X-ray photoelectron spectroscopy （ XPS ）, scanning electron microscopy （SEM） and room temperature Hall effect measurements. It is shown that there were no voids at the interface between 3C-SiC and SiO2.

利用x射线小角散射技术研究微晶硅薄膜的微结构

采用x射线小角散射(SAXS)技术研究了由射频等离子体增强化学气相沉积(rf-PECVD)、热丝化学气相沉积(HWCVD)和等离子体助热丝化学气相沉积(PE-HWCVD)技术制备的微晶硅(μc-Si:H)薄膜的微结构.实验发现,在相同晶态比的情况下,PECVD沉积的μc-Si:H薄膜微空洞体积比小,结构较致密,HWCVD沉积的μ-Si:H薄膜微空洞体积比大,结构较为疏松,PE-HWCVD沉积的μc-Si:H薄膜,由于等离子体的敲打作用,与HWCVD样品相比,微结构得到明显改善.采用HWCVD二步法和PE-HWCVD加适量Ar离子分别沉积μc-Si:H薄膜,实验表明,微结构参数得到了进一步改善.45°倾角的SAXS测量显示,不同方法制备的μc-Si:H薄膜中微空洞分布都呈各向异性.红外光谱测量也证实了SAXS的结果.

磁性半导体Gd_xSi_(1-x)的XPS研究

采用离子束技术,在n型硅基片上注入稀土元素钆,制备了磁性/非磁性p-n结.本文中使用的XPS对制备的样品进行测试,利用Origin 7.0提供的PFM工具进行研究,O1s束缚能介于金属氧化物和SiO_2中O1s的束缚能之间,Si2p的XPS谱分裂为两个峰,其中一个是单质Si的,另一个介于单质Si和硅化物之间,Gd4d的束缚能介于金属钆和氧化钆中的Gd4d之间,说明Gd_xSi_(1-x)形成了无定形结构.

Preparation of 50mm 3C-SiC/Si(111) as Substrates Suited for Ⅲ-Nitrides

50mm SiC films with high electrical uniformity are grown on Si(111) by a newly developed vertical low-pressure chemical vapor deposition (LPCVD) reactor.Both in-situ n- and p-type doping of 3C-SiC are achieved by intentional introduction of ammonia and boron into the precursor gases.The dependence of growth rate and surface morphology on the C/Si ratio and optimized growth conditions is obtained.The best electrical uniformity of 50mm 3C-SiC films obtained by non-contact sheet resistance measurement is ±2.58%.GaN films are grown atop the as-grown 3C-SiC/Si(111) layers using molecular beam epitaxy (MBE).The data of both X-ray diffraction and low temperature photoluminescence of GaN/3C-SiC/Si(111) show that 3C-SiC is an appropriate substrate or buffer layer for the growth of Ⅲ-nitrides on Si substrates with no cracks.