LPCVD Growth of 3C-SiC on Si Mesas and SiO2/Si Substrates for MEMS Applications

This paper presents the development of LPCVD growth of 3C-SiC thin films grown on Si mesas and thermally oxidized SiO2 masks over Si with an area of 150 × 100μm^2 and SiO2/Si substrates. The growth has been performed via chemical vapor deposition using SiH4 and C2H4 precursor gases with carrier gas of H2. 3C-SiC films on these substrates were characterized by optical microscopy, X-ray diffraction （ XRD ）, X-ray photoelectron spectroscopy （ XPS ）, scanning electron microscopy （SEM） and room temperature Hall effect measurements. It is shown that there were no voids at the interface between 3C-SiC and SiO2.

16×0．8nm Si基SiO2阵列波导光栅设计、制备及测试

叙述了一个完整的16通道硅基二氧化硅阵列波导光栅(AWG)的设计、制备及测试过程。通道间隔为0．8nm(100GHz)，解复用器的插入损耗为16．8dB，其中材料损耗为11．95dB，相邻通道串扰小于一17dB，通道插损非均匀性小于2．2dB。

p型纳米硅与a-Si∶H不锈钢底衬nip太阳电池

报道了选用厚度为0．05mm的不锈钢箔作衬底，B掺杂P型氢化纳米硅作窗口层，制备成功开路电压和填充因子分别达到0．90V和0．70的nip非晶硅基薄膜单结太阳电池．UV-VIS透射谱和微区Raman谱证实所用p层具有典型氢化纳米硅的宽能隙和含有硅结晶颗粒的微结构特征．明确指出导致这种氢化纳米硅能隙展宽的物理机制是量子尺寸效应．

SiO2/Si波导应力双折射数值分析

采用有限元法对SiO2/Si掩埋光波导制备工艺中的应力变化进行了系统的分析,在此基础上,应用有限差分束传播法(FDBPM)对应力光波导的双折射进行了计算.结果表明上包层的玻璃化过程是SiO2/Si波导形成水平方向和垂直方向应力差的主要原因,相应的应力双折射系数B在10-4量级.进一步的分析表明上包层B,P重掺杂可明显减小波导的双折射系数.

用于光网络通信的Si基光子集成器件的研究

报导了可用于光网络系统终端OADM和OXC的Si基长波长量子阱窄带响应光电接收器，MOEMS和F-P TO宽频域光学滤波器，M—Z型TO光开关和MMI多路分束器以及可变光强衰减器．用应变层SiGe/Si MQW研制的RCE光电接收器响应谱半宽FWHM<6mm，外量子效率η>4．2％；采用表面微机械加工的桥式光学滤波器，当外加电压0→50V，连续可调谐范围达90nm；采用全平面工艺研制的F-P腔TO滤波器，当外加电流0→57mA时，连续可调谐范围达23nm，FWHM<0．5nm．在SOI Si基片上研制的M—ZTO波导光开关，开关时间<30μs，功耗～100mW．开关消光比-13dB和-10dB，1×4MMI多路分束器输出光场的不均衡性<0．36dB，总插入损耗6．9dB．用背向对接的MMI构成的M-Z干涉仪实现了光强的可变调最大衰减量26dB，响应时间100μs，插入损耗4．8～7dB．

(p)nc-Si:H/(n)c-Si异质结变容二极管

采用等离子体增强化学气相沉积技术和电子束蒸发技术制备了一种新型的线性缓变异质结变容二极管--Au/Cr合金(电极)/multi-layer(p)nc-Si:H/(n)c-Si/(电极)Au/Ge合金结构.I-V,C-V,G-f以及DLTS的测试结果表明:其电容变化系数远大于单晶硅线性缓变异质结的电容变化系数,正向导电机制符合隧穿辅助辐射-复合模型,这是nc-Si:H层中nc-Si晶粒的量子效应所致;反向电流主要由异质结中空间电荷区的产生电流决定,且反向漏电流小,反向击穿电压高,表现出较好的整流特性.

纳米非晶硅(na-Si:H)P-i-n太阳电池

该文报道了通过适当氢稀释(RH=15)和合适的衬底温度(Ts=170℃)下,用PECVD制备得到的宽带隙氢化纳米非晶硅(na-Si:H)薄膜,并将其用作pin太阳电池的本征层.经过电池结构和工艺条件的优化设计,在p/i,i/n界面插入渐变带隙缓冲层,制备出了glass/ITO/p-a-SiC:H/i-na-Si:H/n-nc-Si:H/Al结构的pin太阳电池.电池初始开路电压(Voc)高达0.94V,同时还能保证0.72的填充因子(FF).光电转换效率(Eff)达到8.35%(AM1.5,100mW/cm2).

Fabrication of 1.55μm Si-Based Resonant Cavity Enhanced Photodetectors

A novel bonding method using silicate gel as bonding medium is developed.High reflective SiO2/Si mirrors deposited on silicon substrates by e-beam deposition are bonded to the active layers at a low temperature of 350℃ without any special treatment on bonding surfaces.The reflectivities of the mirrors can be as high as 99.9%.A Si-based narrow band response InGaAs photodetector is successfully fabricated,with a quantum efficiency of 22.6% at the peak wavelength of 1.54μm,and a full width at half maximum of about 27nm.This method has a great potential for industry processes.

氧离子束辅助激光淀积生长ZnO/Si的研究

利用X射线衍射(XRD),X射线摇摆曲线(XRC)和X射线光电子能谱(XPS)分析方法对氧离子束辅助激光淀积生长的ZnO/Si异质结薄膜进行了分析.结果表明:用该法可生长出高度c轴单一取向ZnO薄膜,XRC的半高宽度(FWHM)仅为2.918°.表明此生长方法经优化,可生长出单晶质量很好的ZnO/Si薄膜.

Preparation of 50mm 3C-SiC/Si(111) as Substrates Suited for Ⅲ-Nitrides

50mm SiC films with high electrical uniformity are grown on Si(111) by a newly developed vertical low-pressure chemical vapor deposition (LPCVD) reactor.Both in-situ n- and p-type doping of 3C-SiC are achieved by intentional introduction of ammonia and boron into the precursor gases.The dependence of growth rate and surface morphology on the C/Si ratio and optimized growth conditions is obtained.The best electrical uniformity of 50mm 3C-SiC films obtained by non-contact sheet resistance measurement is ±2.58%.GaN films are grown atop the as-grown 3C-SiC/Si(111) layers using molecular beam epitaxy (MBE).The data of both X-ray diffraction and low temperature photoluminescence of GaN/3C-SiC/Si(111) show that 3C-SiC is an appropriate substrate or buffer layer for the growth of Ⅲ-nitrides on Si substrates with no cracks.

厚表层Si柔性绝缘衬底上SiC薄膜的外延生长

利用LPCVD方法,在厚表层Si(SOL≈0.5μm)柔性绝缘衬底(SOI)(001)上外延生长出了可与硅衬底上外延晶体质量相比拟的SiC/SOI,表明SOI是一种很有潜力的柔性衬底. Raman 光谱结果表明SiC/SOI外延层比SiC/Si外延层有更大的残存应力,对此从理论上进行了解释.利用X射线衍射(XRD)、原子力显微镜(AFM)、扫描电镜(SEM)和喇曼散射光谱(RAM)技术研究了外延材料的晶体结构、界面性质和应变情况.

Fabrication of SiGe/Si Multi-Quantum Wells Resonant-Cavity-Enhanced Detector

A SiGe/Si multi-quantum wells resonant-cavity-enhanced(RCE) detector with high reflectivity bottom mirror is fabricated by a new method.The bottom mirror is deposited in the hole,which is etched from the backside of the sample by ethylenediamine-pyrocatechol-water(EPW) solution with the buried SiO2 layer in SOI substrate as the etching-stop layer.Reflectivity spectrum indicates that the mirror deposited in the hole has a reflectivity as high as 99% in the range of 1.2～1.5μm.The peak responsivity of the RCE detector at 1.344μm is 1.2mA/W and the full width at half maximum is 12nm.Compared with the conventional p-i-n photodetector,the responsivity of RCE detector is enhanced 8 times.

低能离子束方法制备磁性Fe-Si合金薄膜

利用质量分离的低能离子束技术,获得了磁性Fe-Si合金薄膜.利用俄歇电子能谱法(AES)、X射线衍射法(XRD)以及交变梯度样品磁强计(AGM)测试了样品的组分、结构以及磁特性.测试结果表明在室温下制备的Fe-Si合金是Fe组分渐变的非晶薄膜,具有室温铁磁性.当衬底温度为300℃时制备的非晶Fe-Si薄膜中有Fe硅化物FeSi相产生,样品的铁磁性被抑制.

低能离子束方法制备重掺杂Fe的Si:Fe固溶体

利用质量分离的低能离子束方法,以离子能量为1000eV,剂量为3×1017cm-2,室温下往p型Si(111)单晶衬底注入Fe离子,注入的样品在400 C真空下进行热处理.俄歇电子能谱法(AES)对原位注入样品深度分析表明Fe离子浅注入到p型Si单晶衬底,注入深度约为42nm.X射线衍射法(XRD)对热处理样品结构分析发现只有Si衬底的衍射峰,没有其他新相.X射线光电子能谱法(XPS)对热处理样品表面分析发现Fe2p束缚能对应于单质Fe的峰,没有形成Fe的硅化物.这些结果表明重掺杂Fe的Si:Fe固溶体被制备.电化学C-V法测量了热处理后样品载流子浓度随深度的分布,发现Fe重掺杂Si致使Si的导电类型从p型转为n型,Si:Fe固溶体和Si衬底形成pn结,具有整流特性.

Si衬底和Si-SiO2-Si柔性衬底上的GaN生长

使用MBE方法在Si(111)衬底和Si-SiO2-Si柔性衬底上生长了GaN外延层,并对在两种衬底上生长的样品进行了对比分析.在柔性衬底上获得了无裂纹的外延层,其表面粗糙度为0.6nm.研究了GaN外延层中的应力及其光学性质,光致发光测试结果表明柔性衬底上生长的外延层中应力和杂质浓度明显低于直接生长在Si衬底上的样品的值.研究结果显示了所用柔性衬底有助于改善GaN外延膜的质量.