Microscopic analysis of defects in a high resistivity silicon detector irradiated to 1.7x10(15)n/cm(2)

Current-based microscopic defect analysis methods with optical filling techniques, namely current deep level transient spectroscopy (I-DLTS) and thermally stimulated current (TSC), have been used to study defect levels in a high resistivity silicon detector (p(+)-n-n(+)) induced by very high fluence neutron (VHFN) irradiation (1.7x10(15) n/cm(2)). As many as fourteen deep levels have been detected by I-DLTS. Arrhenius plots of the I-DLTS data have shown defects with energy levels ranging from 0.03 eV to 0.5 eV in the energy band gap. Defect concentrations of relatively shallow levels (E(t) < 0.33 eV) are in the order of 10(13)cm(-3), while those for relatively deep levels (E(t) > 0.33 eV) are in the order of 10(14) cm(-3). TSC data have shown similar defect spectra. A full depletion voltage of about 27,000 volts has been estimated by C-V measurements for the as-irradiated detector, which corresponds to an effective space charge density (N-eff) in the order of 2x10(14) cm(-3). Both detector leakage current and full depletion voltage have been observed to increase with elevated temperature annealing (ETA). The increase of the full depletion voltage corresponds to the increase of some deep levels, especially the 0.39 eV level. Results of positron annihilation spectroscopy have shown a decrease of total concentration of vacancy related defects including vacancy clusters with ETA, suggesting the breaking up of vacancy clusters as possible source of vacancies for the formation of single defects during the reverse anneal.

DETERMINATION OF THE X-CONDUCTION-SUBBAND ENERGIES IN TYPE-II GAAS/ALAS/GAAS QUANTUM-WELL BY DEEP-LEVEL TRANSIENT SPECTROSCOPY

Using deep level transient spectroscopy (DLTS) the X conduction-subband energy levels in an AlAs well sandwiched by double GaAs layers were determined. Calculation gives eight subbands in the well with well width of 50 Angstrom. Among them, five levels and the other three remainders are determined by using the large longitudinal electron effective mass m(1)(1.1m(0)) and transverse electron effective mass m(t)(0.19m(0)) at X valley, respectively. Two subbands with the height energies were hardly detectable and the other six ones with lower energies are active in the present DLTS study. Because these six subbands are close to each other, we divided them into three groups. Experimentally, we observed three signals induced from the three groups. A good agreement between the calculation and experiment was obtained. (C) 1995 American Institute of Physics.

DEVELOPMENT OF CURRENT-BASED MICROSCOPIC DEFECT ANALYSIS-METHODS AND ASSOCIATED OPTICAL FILLING TECHNIQUES FOR THE INVESTIGATION ON HIGHLY IRRADIATED HIGH-RESISTIVITY SILICON DETECTORS

Current based microscopic defect analysis methods such as current deep level transient spectroscopy (I-DLTS) and thermally stimulated current (TSC) have been further developed in accordance with the need for the defect analysis of highly irradiated (Phi(n) > 10(13) n/cm(2)) high resistivity silicon detectors. The new I-DLTS/TSC system has a temperature range of 8 K less than or equal to T less than or equal to 450 K and a high sensitivity that can detect a defect concentration of less than 10(10)/cm(3) (background noise as low as 10 fA). A new filling method using different wavelength laser illumination has been applied, which is more efficient and suitable than the traditional voltage pulse filling. It has been found that the filling of a defect level depends on such factors as the total concentration of free carriers generated or injected, the penetration length of the laser (laser wavelength), the temperature at which the filling is taking place, as well as the decay time after the filling (but before the measurement). The mechanism of the defect filling can be explained by the competition between trapping and detrapping of defect levels, possible capture cross section temperature dependence, and interaction among various defect levels in terms of charge transferring. Optimum defect filling conditions have been suggested for highly irradiated high resistivity silicon detectors.

磷化铟中铁原子替位与填隙的热致转变及其对材料性质的影响

高温退火后掺铁半绝缘(SI)InP单晶转变为n型低阻材料.利用霍尔效应(Hall),热激电流谱(TSC),深能级瞬态谱(DLTS),X射线衍射等方法分别研究了退火前后InP材料的性质和缺陷.结果表明受高温热激发作用部分铁原子由替位转变为填隙,导致InP材料缺少深能级补偿中心而发生导电类型转变.通过比较掺杂、扩散和离子注入过程Fe原子的占位和激活情况分析了这一现象的机理和产生原因.

掺Er／Pr的GaN薄膜深能级的研究

利用深能级瞬态谱（DLTS）、傅里叶变换红外光谱（FT-IR）对GaN以及GaN掺Er／Pr的样品进行了电学和光学特性分析．研究发现未掺杂的GaN样品只在导带下0．270eV处有一个深能级；GaN注入Er经900℃，30min退火后的样品出现了四个深能级，能级位置位于导带下0．300eV，0．188eV，0．600eV和0．410eV；GaN注入Pr经1050℃，30min退火后的样品同样出现了四个深能级。能级位置位于导带下0．280eV，0．190eV，0．610eV和0．390eV；对每一个深能级的来源进行了讨论．光谱研究表明，掺Er的GaN样品经900℃，30min退火后，可以观察到Er的1538nm处的发光。而且对能量输运和发光过程进行了讨论．

(p)nc-Si:H/(n)c-Si异质结变容二极管

采用等离子体增强化学气相沉积技术和电子束蒸发技术制备了一种新型的线性缓变异质结变容二极管--Au/Cr合金(电极)/multi-layer(p)nc-Si:H/(n)c-Si/(电极)Au/Ge合金结构.I-V,C-V,G-f以及DLTS的测试结果表明:其电容变化系数远大于单晶硅线性缓变异质结的电容变化系数,正向导电机制符合隧穿辅助辐射-复合模型,这是nc-Si:H层中nc-Si晶粒的量子效应所致;反向电流主要由异质结中空间电荷区的产生电流决定,且反向漏电流小,反向击穿电压高,表现出较好的整流特性.

高温退火处理的磷化铟中的深能级缺陷

用深能级瞬态谱(DLTS)研究了高温退火处理后磷化铟中的深能级缺陷.在退火前以及纯磷和磷化铁气氛下,退火后低阻磷化铟中的深能级缺陷的数量和浓度明显不同,磷化铁气氛下退火后的磷化铟中只有0.24和0.64 eV两个缺陷,而纯磷气氛下退火后的磷化铟中可测到0.24,0.42,0.54和0.64 eV4个缺陷,退火前的原生磷化铟样品中有的只有0.49和0.64 eV两个缺陷,有的只有0.13 eV一个缺陷.根据这些结果,讨论了退火气氛对缺陷的产生和抑制作用的物理机理.

分子束外延生长赝配高电子迁移率超高速微结构功能材料里深中心识别

应用深能级瞬态谱（DLTS）技术研究分子束外延（MBE）生长的high electron mobility transistors （HEMT）和Pseudomorphic high electron mobility transistors （P-HEMT）结构深中心行为。样品的DLTS谱表明，在HEMT和P-HEMT结构的n-AlGaAs层里存在着较大浓度（10~(15)-10~(17)cm~(-3)）和俘获截面（10~(-16)cm~2）的近禁带中部电子争阱。它们可能与AlGaAs层的氧含量有关。同时还观察到P-HEMT结构晶格不匹配的AlGaAs/InGaAs/GaAs系统在AlGaAs里产生的应力引起DX中心（与硅有关）能级位置的有序移动。其移动量可作为应力大小的一个判据，表明DLTS技术是定性识别此应力的可靠和简便的工具。

原子氢辅助分子束外延生长对GaAs材料性能的改善

利用深能级瞬态谱(DLTS)研究了常规分子束外延和原子氢辅助分子生长的掺杂Si和Be的GaAs同质结构样品中缺陷的电学特性。发现原子氢辅助分子束外延生长的样品中缺陷的浓度与常规分子束外延生长的样品相比有明显的降低，这可解释为生长过程中原子氢对缺陷的原位中和与钝化作用。

InAs自组织生长量子点的空穴俘获势垒

成功地用深能级瞬态谱(DLIS)研究了p型InAs自组织生长的量子点的电学性质，测得2.5原子层InAs量子点空穴基态能级在GaAs价带底上约0.09eV,该量子点在荷电状态发生变化时需要克服一个势垒，俘获势垒高度为0.26eV。首次利用DLTS测定了量子点空穴的基态能级和俘获势垒，相信对增加量子点性质的理解会起到有益的帮助。

分子束外延生长Al掺杂n型ZnS_（1-x）Tex的类DX中心

应用光致发光(PL)、电容-电压(C-V)、深能级瞬态谱(DLTS)和光电导(PC)技术系统研究Al掺杂ZnS_(1-x)Te_x中与Al有关的类DX中心。实验结果表明，ZnS_(1-x)Te_x中存在与Ⅲ－Ⅴ族半导体DX中心相类似的性质。获得与Al有关的类DX中心光离化能E_i(～1.0eV和2.0eV)和发射势垒E_e(0.21eV和0.39eV)，这表明ZnS_(1-x)Te_x大晶格弛豫的出现是由类DX中心引起。

InAs自组织生长量子点超晶格的电学性质

利用深能级瞬态谱(DLTS)研究了一系列InAs自组织生长的量子点超晶格样品，确认样品中存在体GaAs缺陷能级EL2和InAs量子点电子基态能级。测得1.7和2.5原子层InAs量子点电子基态能级相对于GaAs的导带底分别为100meV和210meV,量子点电子基态的俘获热垒分别为0.48eV和0.30eV。

InAs自组织生长量子点的电子俘获势垒

成功地用深能级瞬态谱(DLTS)研究了InAs自组织生长的量子点电学性质，获得2.5原子层InAs量子点电子基态能级在GaAs导带底下约0.13eV，该量子点在荷电状态发生变化时伴随有晶格弛豫，对应俘获势垒为0.32eV。

GeSi/Si应变结构内应力纵向分布

利用深能级瞬态谱(DLTS）研究分子束外延n-Ge_0.2)Si_(0.8)/Si应变超晶格，观察到两个与位错有关的深中心，其中一个能级位置在E_C=0.42eV,另一个随着偏压变化而发生明显 的移动，深能级位置从E_C=0.21eV变化到E_C=0.276eV,我们认为是内应力引起的。取该深能级的流体静压力系数γ=6.59meV/Kba,求出超晶格中的应力分布与计算值符合较好。在此基础上提出了一种通过测量深能级随应力移动效应来确定应变结构内应力纵向分布的新方法。

GeSi/Si应变超晶格退火及离子注入研究

用深能级瞬态谱(DLTS)研究退火及离子注入对分子束外延生长的GeS/i/Si应变超晶格性质的影响，观察到3个与位错有关的深中心和1个表层内的深中心，退火和离子注入都使得这些深中心的浓度增加数倍，说明GeSi/Si应变超晶格不适应做过多的热处理。测定Pd~+注入在GeSi/Si超晶格的杂质能级为E_C=0.28eV,与体Si中的Pd杂质能级一致。