A new structure of In-based ohmic contacts to n-type GaAs

Electrical, structural and reaction characteristics of In-based ohmic contacts to n-GaAs were studied. Attempts were made to form a low-band-gap interfacial phase of InGaAs to reduce the barrier height at the metal/semiconductor junction, thus yielding low-resistance, highly reliable contacts. The contacts were fabricated by e-beam sputtering Ni, NiIn and Ge targets on VPE-grown n(+)-GaAs film (approximate to 1 mu m, 2 x 10(18) cm(-3)) in ultrahigh vacuum as the structure of Ni(200 Angstrom)/NiIn(100 Angstrom)/Ge(40 Angstrom)/n(+)-GaAs/SI-GaAs, followed by rapid thermal annealing at various temperatures (500-900 degrees C). In this structure, a very thin layer of Ge was employed to play the role of heavily doping donors and diffusion limiters between In and the GaAs substrate. Indium was deposited by sputtering NiIn alloy instead of pure In in order to ensure In atoms to be distributed uniformly in the substrate; nickel was chosen to consume the excess indium and form a high-temperature alloy of Ni3In. The lowest specific contact resistivity (rho(c)) of (1.5 +/- 0.5)x 10(-6) cm(2) measured by the Transmission Line Method (TLM) was obtained after annealing at 700 degrees C for 10 s. Auger sputtering depth profile and Transmission Electron Microscopy (TEM) were used to analyze the interfacial microstructure. By correlating the interfacial microstructure to the electronical properties, InxGa1-xAs phases with a large fractional area grown epitaxially on GaAs were found to be essential for reduction of the contact resistance.

An asymmetric broad waveguide structure for a 0.98-μm high-conversion-efficiency diode laser

A novel asymmetric broad waveguide diode laser structure was designed for high power conversion efficiency (PCE). The internal quantum efficiency, the series resistance, and the thermal resistance were theoretically optimized. The series resistance and the thermal resistance were greatly decreased by optimizing the thickness of the P-waveguide and the P-cladding layers. The internal quantum efficiency was increased by introducing a novel strain-compensated GaAs_0.9P_0.1/InGaAs quantum well. Experimentally, a single 1-cm bar with 20% fill factor and 900 μm cavity length was mounted P-side down on a microchannel-cooled heatsink, and a peak PCE of 60% is obtained at 26.3-W continuous wave output power.The results prove that this novel asymmetric waveguide structure design is an efficient approach to improve the PCE.

用正电子研究原生ZnO单晶中的缺陷

利用正电子寿命谱和多普勒展宽谱技术研究了原生ZnO的缺陷结构及其退火效应. 经900 ℃退火之后,正电子寿命实验显示样品中的空位型缺陷基本被消除,其体寿命为180 ps.通过比较原生和退火样品的符合多普勒展宽谱的商谱曲线,两者有相似的峰型,结合寿命谱的相关数据表明原生ZnO中不存在H原子填充Zn空位.

掺Er／Pr的GaN薄膜深能级的研究

利用深能级瞬态谱（DLTS）、傅里叶变换红外光谱（FT-IR）对GaN以及GaN掺Er／Pr的样品进行了电学和光学特性分析．研究发现未掺杂的GaN样品只在导带下0．270eV处有一个深能级；GaN注入Er经900℃，30min退火后的样品出现了四个深能级，能级位置位于导带下0．300eV，0．188eV，0．600eV和0．410eV；GaN注入Pr经1050℃，30min退火后的样品同样出现了四个深能级。能级位置位于导带下0．280eV，0．190eV，0．610eV和0．390eV；对每一个深能级的来源进行了讨论．光谱研究表明，掺Er的GaN样品经900℃，30min退火后，可以观察到Er的1538nm处的发光。而且对能量输运和发光过程进行了讨论．

带有Bragg反射镜的谐振腔增强型Si光电探测器

采用电子束蒸发和键合技术，制作了具有高反射率的、表面为薄层单晶Si的分布Bragg反射器。用标准光刻工艺在单晶Si薄层上制作出窄带谐振腔增强型（RCE）金属一半导体一金属（MSM）光电探测器，响应峰值波长分别在836、900、965和1030nm处，其中在900nm处峰值半高宽为18nm。该器件具有波长选择特性，可有效抑制相邻频道间的串扰，而且容易制成集成面阵。

大功率GaInP／AlGaInP半导体激光器

制备了大功率实折射率GaInP／AlGaInP压应变分别限制量子阱激光器．所用外延材料在15°偏角的GaAs衬底上由有机金属气相外延一次外延生长得到．制备的激光器具有双沟脊波导结构，条宽和腔长分别为3和900μm，前后端面分别蒸镀5％的增透膜和95％的高反膜．分析了室温连续激射时激光器的光电输出性能．阈值电流的典型值为32mA，光学灾变阈值为88mW，功率为80mW时的工作电流为110mA，斜率效率为1W／A，串联电阻为3Ω．基横模光输出功率可达60mW，60mW时的平行结和垂直结的远场发散角分别为10°和32°，激射波长为658．4nm．器件的内损耗为4．1cm^-1，内量子效率达80％，透明电流密度为648A／cm^2．

1.78 μm Strained InGaAs-InGaAsP-InP Distributed Feedback Quantum Well Lasers

Ridge-waveguide distributed-feedback(DFB) lasers with highly strained InGaAs/InGaAsP active regions,emitting at 1.78 μm were fabricated by low pressure metal-organic vapor phase epitaxy(LP-MOVPE) and tested.The lasers exhibited threshold current of 33 mA for 900 μm long cavities at room temperature.A maximum light output power of 8 mW from one facet and an external differential quantum efficiency of 7% were also obtained.In oddition,the side mode suppression ratio (SMSR) is 27.5 dB.

掺铒GaN薄膜的背散射/沟道分析和光致发光研究

采用背散射(RBS)/沟道(channeling)分析和傅里叶变换红外光谱(FT-IR)研究了掺铒GaN薄膜的晶体结构和光致发光(PL)特性.背散射/沟道分析结果表明:随退火温度的升高,薄膜中辐照损伤减少;但当退火温度达到1000℃,薄膜中的缺陷又明显增加.Er浓度随注入深度呈现高斯分布.通过沿GaN的<0001>轴方向的沟道分析,对于900℃,30min退火的GaN:Er样品,Er在晶格中的替位率约76%.光谱研究表明:随退火温度的升高,室温下样品的红外PL峰强度增加;但是当退火温度达到1000℃,样品的PL峰强度明显下降;测量温度从15K变化到300K时,样品(900℃,30min退火的GaN:Er)的1540nm处PL温度猝灭为30%.

紧缩型SOI多模干涉光开关的设计

提出了一种新的紧缩型SOI多模干涉（MMI）光开关。开关由单模输入输出波导和MMI耦合器组成。通过在多模波导区域引入调制区，利用Si的等离子色散效应（PDE）改变调制区的折射率来实现开关动作。用FD-BPM方法对开关的工作原理和性能进行了模拟与分析。结果表明，光开尖良好的综合性能，而整个开关的长度只有7mm。

快速热退火和氢等离子体处理对富硅氧化硅薄膜微结构与发光的影响

采用micro-Raman散射、傅里叶变换红外吸收谱和光致发光谱研究了快速热退火及氢等离子体处理对等离子体增强化学气相沉积法200 ℃衬底温度下生长的富硅氧化硅（SRSO）薄膜微结构和发光的影响。研究发现在300-600 ℃范围内退火，SRSO薄膜中非晶硅和SiO_x:H两相之间的相分离程度随退火温度升高趋于减小；而在600-900 ℃范围内退火，其相分离程度退火温度升高又趋于增大；同时发现SRSO薄膜发光先是随退火温度的升高显著加强，然后在退火温度达到和超过600 ℃后迅速减弱；发光峰位在300 ℃退火后蓝移，此后随退火温度升高逐渐红移。对不同温度退火后的薄膜进行氢等离子体处理，发光强度不同程度有所增强，发光峰位有所移动，但不同温度退火样品发光增强的幅度和峰位移动的趋势不同。分析认为退火能够引起薄膜中非晶硅颗粒尺度、颗粒表面结构状态以及氢的存在和分布等方面的变化。结果表明不仅颗粒的尺度大小，而且颗粒表面的结构状态都对非晶硅颗粒能带结构和光生载流子复合机理发挥重要影响。

Growth of Cubic GaN by MOCVD at High Temperature

High quality cubic GaN (c-GaN) is grown by metalorganic vapor deposition (MOCVD) at an increased growth temperature of 900 ℃, with the growth rate of 1.6 μm/h. The full width at half maximum (FWHM) of room temperature photoluminescence (PL) for the high temperature grown GaN film is 48meV. It is smaller than that of the sample grown at 830 ℃. In X-ray diffraction (XRD) measurement, the high temperature grown GaN shows a (002) peak at 20° with a FWHM of 21'. It can be concluded that, although c-GaN is of metastable phase, high growth temperature is still beneficial to the improvement in its crystal quality. The relationship between the growth rate and growth temperature is also discussed.

用硅离子注入SiO_2层方法制备的纳米硅的光学性质

报道了用硅离子注入热氧化生长的SiO_2层后热退火的方法制备纳米硅样品,并在室温下测量了样品的光致发光谱及其退火温度的关系。实验结果表明,在800℃以下退火的样品的发光是由于离子注入而引入SiO_2层的缺陷发光,在900℃以上退火,才观察到纳米硅的发光,在1100℃下退火,纳米硅发光达到最强,纳米硅的发光峰随退火温度升高而红移呈量子尺寸效应。在直角散射配置下,首次观察到纳米硅的特征拉曼散射峰,进一步证实了光致发光谱的结果。

氢化非晶氧化硅薄膜的微结构及光致发光的研究

利用等离子增强化学气相沉积技术制备了一组含量不同的氢化非晶氧化硅(a-SiO_x:H)薄膜,室温下在550～900 nm的波长范围内观察到了两个强的发光带:一个是由峰位在670 nm(1.85 eV)左右的主峰和峰位在835 nm(1.46 eV)的伴峰组成的包络,另一个只能在氮气氛中1170℃退火后的样品中观测到,峰位大约在850 nm。通过对红外谱和微区Raman谱的分析,认为这二个发光带可能分别与存在于薄膜中的a-Si原子团和Si纳米晶粒有关。

含纳米锗粒二氧化硅薄膜的光致发光研究

以锗-二氧化硅(GSO)复合靶作为溅射靶,改变靶上锗与总靶面积比为0％,5％和10％, 用射频磁控溅射方法在p型硅衬底上沉积了含锗量不同的三种二氧化硅薄膜。各样品分别在氮气氛中经过300至900℃不同温度的退火处理。通过对样品所作Raman散射光谱的分析，发现随着锗在溅射靶中面积比的增加，所制备的氧化硅薄膜中纳米锗粒的平均尺寸在增大。确定出随着退火温度由600℃升高到900℃，GSO(5％)样品中纳米锗粒的平均直径由5.4nm增至9.5nm。含纳米锗粒大小不同的二氧化硅薄膜的光致发光谱中都存在位于2.1eV的发光峰，它并不随纳米锗粒的存在与否或纳米锗粒的尺寸而改变，对于以纯二氧化硅靶制备的二氧化硅膜的光致发光谱中还多出两个位于1.9和2.3eV的发光峰。以上实验结果与量子限制模型的推论相矛盾，却可用量子限制/发光中心模型予以解释。

低阈值电流密度InGaAs/GaAs/AlGaAs应变量子阱激光器

利用分子束外延技术,生长了极低阈值电流密度、低内损耗、高量子效率的InGaAs/GaAs/AlGaAs应变量子阱激光器。在腔长900μm时，80μm宽接触激光器阈值电流密度是125A/cm~2,在腔长为2000μm时是113A/cm~2,这样低的阈值电流密度是目前国内报道的最低值。激光器的内损耗和内量子效率分别是2cm~(-1)和84％。