Morphology Evolution of (331)A High-Index Surfaces During Atomic Hydrogen Assisted Molecular Beam Epitaxy (MBE)

Step like morphology of (331)A high-index surfaces during atomic hydrogen assisted molecular beam epitaxy (MBE) growth has been investigated. Atomic Force Microscope (AFM) measurements show that in conventional MBE, the step heights and terrace widths of GaAs layers increase monotonically with increasing substrate temperatures. The terrace widths and step densities increase with increasing the GaAs layer thickness and then saturates. And, in atomic hydrogen assisted MBE, the terrace width reduces and density increases when depositing the same amount of GaAs. It attributes this to the reduced surface migration length of Ga adatoms with atomic hydrogen. Laterally ordered InAs self-aligned nano-wires were grown on GaAs (331)A surfaces and its optical polarization properties were revealed by photoluminescence measurements.

GaAs基GaSb体材料及InAs/GaSb超晶格材料的MBE生长

采用分子束外延方法在GaAs(100)衬底上生长GaSb体材料,以此GaSb为缓冲层生长了不同InAs厚度的InAs/GaSb超晶格,其10K光致发光谱峰值波长在2.0～2.6 μm.高分辨透射电子显微镜观察证实超晶格界面清晰,周期完整.

蓝宝石衬底上单晶InAlGaN外延膜的RF-MBE生长

利用射频等离子体辅助分子束外延技术在蓝宝石衬底上外延了晶体质量较好的单晶InAlGaN薄膜．在生长InAlGaN外延层时，获得了外延膜的二维生长，卢瑟福背散射测量结果表明，InAlGaN外延层中In，Al和Ga的组分分别为2％，22％和76％，并且元素的深度分布比较均匀，InAlGaN（0002）三晶X射线衍射摇摆曲线的半高宽为4．8′，通过原子力显微镜观察外延膜表面存在小山丘状的突起和一些小坑，测量得到外延膜表面的均方根粗糙度为2．2nm．利用光电导谱测量InAlGaN的带隙为3．76eV．

MBE Growth of High Electron Mobility InP Epilayers

The molecular beam epitaxial growth of high quality epilayers on （100） InP substrate using a valve phosphorous cracker cell over a wide range of P/In BEP ratio （2.0-7.0） and growth rate （0.437 and 0. 791μm/h）. Experimental results show that electrical properties exhibit a pronounced dependence on growth parameters,which are growth rate, P/In BEP ratio, cracker zone temperature, and growth temperature. The parameters have been optimized carefully via the results of Hall measurements. For a typical sample, 77K electron mobility of 4.57 × 10^4 cm^2/（V · s） and electron concentration of 1.55×10^15 cm^-3 have been achieved with an epilayer thickness of 2.35μm at a growth temperature of 370℃ by using a cracking zone temperature of 850℃.

蓝宝石衬底上单晶InN外延膜的RF-MBE生长

采用低温氮化铟(InN)缓冲层，利用射频等离子体辅助分子束外延(RF-MBE)方法在蓝宝石衬底上获得了晶体质量较好的单晶InN外延膜．用光学显微镜观察所外延的InN单晶薄膜，表面无铟滴．InN(0002)双晶X射线衍射摇摆曲线的半高宽为14′；用原子力显微镜测得的表面平均粗糙度为3．3nm；Hall测量表明InN外延膜的室温背景电子浓度为3．3×10^18cm^3，相应的电子迁移率为262cm^2／(V·s)．

RF-MBE Grown AlGaN/GaN HEMT Structure with High Al Content

A Si doped AlGaN/GaN HEMT structure with high Al content (x= 44%) in the barrier layer is grown on sapphire substrate by RF-MBE. The structural and electrical properties of the heterostructure are investigated by the triple axis X-ray diffraction and Van der Pauw-Hall measurement, respectively. The observed prominent Bragg peaks of the GaN and AlGaN and the Hall results show that the structure is of high quality with smooth interface.fabricated and characterized. Better DC characteristics, maximum drain current of 1.0A/mm and extrinsic transconductance of 218mS/mm are obtained when compared with HEMTs fabricated using structures with lower Al mole fraction in the AlGaN barrier layer. The results suggest that the high Al content in the AlGaN barrier layer is promising in improving material electrical properties and device performance.

原子氢辅助MBE生长的不同晶面GaAs表面形貌

研究了原子氢辅助分子束外延(MBE)中，原子氢对不同晶面GaAs外延层表面形貌特征的诱导作用。原子力显微镜(AFM)测试表明，在GaAs的(311)A和(331)A面，原子氢导致了台阶状形貌的形成。提出了一种简单模型，解释了台阶面形貌形成的物理机制。为最终有序低维纳米表面结构提供了一种实验参考。

MBE生长的跨导为186 mS/mm的AlGaN/GaN HEMT

用分子束外延(MBE)技术研制出了AlGaN/GaN高电子迁移率晶体管(HEMT)材料,其室温迁移率为1 035 cm2/Vs、二维电子气浓度为1.0×1013 cm-2;77 K迁移率为2 653 cm2/V*s、二维电子气浓度为9.6×1012 cm-2.用此材料研制了栅长为1 μm、栅宽为80 μm、源-漏间距为4 μm的AlGaN/GaN HEMT,其室温最大非本征跨导为186 mS/mm、最大漏极饱和电流密度为925 mA/mm、特征频率为18.8 GHz.另外,还研制了具有20个栅指(总栅宽为20×80 μm＝1.6 mm)的大尺寸器件,该器件的最大漏极饱和电流为1.33 A.

RF-MBE生长AlN/GaN超晶格结构二维电子气材料

用射频等离子体辅助分子束外延技术（RF-MBE）在c面蓝宝石衬底上外延了高质量的GaN膜以及AlN/GaN超晶格结构极化感应二维电子气材料。所获得的掺Si的GaN膜室温电子浓度为2.2 * 10~(18)cm~(-3)，相应的电子迁移率为221cm~2/(V·s);1μm厚的GaN外延膜的（0002）X射线衍射摇摆曲线半高宽（FWHM）为7’；极化感应产生的二维电子气室温电子迁移率达到1086cm~2/(V·s)，相应的二维电子气面密度为7.5 * 10~(12)cm~(-2)。

NH_3-MBE生长极化场二维电子气材料

介绍了用NH_3-MBE技术在蓝宝石C面上外延的高质量的GaN单层膜以及GaN/AlN/GaN极化感应二维电子气材料。外延膜都是N面材料。形成的二维电子气是“倒置二维电子气”。GaN单层膜的室温电子迁移率为300cm~2/Vs。二维电子气材料的迁移率为680cm~2/Vs(RT)和1700cm~2/Vs(77K)，相应的二维电子气的面密度为3.2×10~(13)cm~(-2)(RT)和2.6×10~(13)cm~(-2)(77K)。

我国MBE GaAs基材料如何从实验室走向产业化

于2010-11-23批量导入

RF-MBE生长AlGaN/GaN二维电子气材料

于2010-11-23批量导入

RF-MBE生长AlGaN/GaN极化感应二维电子气材料

用射频等离子体辅助分子束外延技术(RF-MBE)在C面蓝宝石衬底上外延了高质量的GaN膜以及AlGaN/GaN极化感应二维电子气材料。所外延的GaN膜室温背景电子浓度为2×10~(17)cm~(-3)，相应的电子迁移率为177cm~2/(V·s);GaN(0002)X射线衍射摇摆曲线半高宽(FWHM)为6'；AlGaN/GaN极化感应二维电子气材料的室温电子迁移率为730cm~2(V·s)，相应的电子气面密度为7.6×10~(12)cm~(-2)；用此二维电子气材料制作的异质结场效应晶体管(HFET)室温跨导达50mS/mm(栅长1μm)，截止频率达13GHz(栅长0.5μm)。

MBE生长的高质量AlGaAs/InGaAs双δ掺杂PHEMT结构的材料

用MBE方法制备的PHEMT微结构材料，其2DEG浓度随材料结构的不同在2.0-4.0×10~(12)cm~(-2)之间，室温霍耳迁移率在5000-6500cm~2·V~(-1)·s~(-1)之间。制备的PHEMT器件，栅长为0.7μm的器件的直流特性：I_(dss)～280mA/mm,I_(max)～520-580mA/mm,g_m～320-400mS/mm,BV_(DS)>15V(I_(DS)=1mA/mm),BV_(GS)>10V,微波特性：P_0～600-900mW/mm,G～6-10dB,η_(add)～40-60%;栅长为0.4μm的器件的直流特性:I_(max)～800mA/mm,g_m>400mS/mm。

衬底温度和生长速率对MBE自组织生长In_xGa_(1-x)As/GaAsQD的影响

研究GaAs基In_xGa_(1-x)As/GaAs量子点(QD)的MBE生长条件，发现在一定的Ⅴ/Ⅲ比下，衬底温度和生长速率是影响In_xGa_(1-x)As/GaAs QD形成及形状的一对重要因素，基中衬底温度直接影响着In的偏析程度，决定了In_xGa_(1-x)As/GaAs的生长模式；生长速率影响着In_xGa_(1-x)As外延层的质量，决定了In_xGa_(1-x)As/GaAs QD的形状及尺寸。通过调节衬底温度和生长速率生长出了形状规则、尺寸较均匀的In_xGa_(1-x)As/GaAs QD(x=0.3)。