高增益偏振不灵敏InGaAs/InP体材料半导体光放大器

采用三元InGaAs体材料为有源区,通过直接在InGaAs体材料中引入0.20%张应变来加强TM模的增益,研制了一种适合于作波长变换器的偏振不灵敏半导体光放大器(SOA).在低压金属有机化学气相外延(LP-MOVPE)的过程中,只需调节三甲基Ga的源流量便可获得所要求的张应变量.制作的半导体光放大器在200 mA的注入电流下,获得了50nm宽的3 dB光带宽和小于0.5dB的增益抖动;重要的是,半导体光放大器能在较大的电流和波长范围里实现小于1.1dB的偏振灵敏度.对于1.55μm波长的信号光,在200 mA的偏置下,其偏振灵敏度小于1 dB,同时获得了大于14dB光纤到光纤的增益,3 dBm的饱和输出功率和大于30 dB的芯片增益.用作波长变换器,可获得较高的波长变换效率.进一步提高半导体光放大器与光纤的耦合效率,可得到性能更佳的半导体光放大器.

立方相GaN外延层中堆垛层错的非对称性

通过TEM截面像和平面像的观察，对于用低压金属有机化合物气相外延（LP-MOVPE）法在GaAs（001）衬底上制备的立方相GaN外延层中的缺陷结构进行了观察和分析。结果表明，在立方GaN/GaAs（001）外延层中存在很高密度的堆垛层错，层错密度及其宽度在相互垂直的（110）方向上有明显的差异，闪锌矿结构中α位错与β位错间的差异可能是层错出现非对称性的原因。

MOVPE生长的GaN基蓝色与绿色LED

报道用自行研制的LP-MOVPE设备,在蓝宝石(α-Al_2O_3)衬底上生长出以InGaN为有源区的蓝光和绿光InGaN/AlGaN双异质结构以及InGaN/GaN量子阱结构的LED,其发射波长分别为430～450nm和520～540nm。

立方相GaN外延层的表面起伏和高密度孪晶与六角相

利用扫描电子显微镜(SEM)、原子力显微镜(AFM)、透射电子显微镜(TEM)和X射线衍射(XRD)技术研究了低压金属有机化学气相淀积(LP-MOCVD)的立方相GaN/GaAs(001)外延层的表面起伏特征，及其与外延层极性和内部六角相、立方相微孪晶之间的联系。结果表明外延表面存在有大量沿[1-10]方向延伸的条带状台阶，而表面起伏处对应着高密度的六角相或立方相微孪晶，在表面平整的区域内其密度则较低。{111}_(Ga)和{111}_N面上形成六角相和微孪晶概率的明显差异是导致外延层表面台阶状起伏特征的根本原因。

选择区域生长高质量InGaAsP多量子阱材料

采用LP-MOVPE在SiO_2掩膜的InP衬底上实现了高质量的InGaAsP多量子阱(MQW)的选择区域生长(SAG)。通过改变生长温度和生长压力，MQW的适用范围由C波段扩展至L波段，即MQW的光致发光波长从1546nm延展至1621nm。光致发光(PL)测试表明

高质量立方相InGaN的生长

利用LP-MOCVD技术在GaAs(001)衬底上生长了高质量的立方相InGaN外延层。研究了生长速率对InGaN质量的影响，提出一个简单模型解释了在改变TEGa流量条件下出现的In组分的变化规律，实验结果与模型的一次项拟合结果较为吻合，由此推断，在现在的生长条件下，表面单个Ga原子作为临界晶核吸附Ga或In原子实现生长的模型与实际情况较为接近。对于晶体质量的变化也给予了说明。得到的高质量立方相InGaN室温下有很强的发光峰，光致发光峰半高宽为128meV左右。

InGaN/AlGaN双异质结绿光发光二极管

报道了用LP-MOVPE技术在蓝宝石(α-Al_2O_3)衬底上生长出以双掺Zn和Si的InGaN为有源区的绿光InGaN/AlGaN双异质结结构，并研制成功发射波长为520-540nm的绿光LED。

InAlGaAs/GaAs量子阱的生长及其界面特性

该文研究了以InAlGaAs作垒层的InAlGaAs/GaAs量子阱的低压金属有机化合物化学汽相淀积(LP-MOCVD)生长及其界面特性，发现在适当生长条件下可以解决InGaAs和AlGaAs在生长温度范围不兼容的问题，得到了高质量的InAlGaAs/GaAs量子阱材料。同时用X光和低温光致发光(PL)谱研究了量子阱结构的界面特性，表明适当的界面生长中断不仅可以改善界面平整度，而且能改善垒层InAlGaAs的质量。

1.27μm吸收型部分增益耦合MQW-DFB激光器

采用LP-MOCVD和LPE相结合,成功地研制出了吸收型部分增益耦合MQW-DFB激光器。扫描显微镜照片显示了清晰的被掩埋的吸收型增益耦合光栅,表明光栅掩埋生长前升温过程磷烷的保护是成功的。宽接触(broad area)脉冲电流大范围单纵模工作,条型器件室温连续直流工作阈电流为22mA至35mA,单模成品率高,边模抑制比(SMSR)超过37dB,没有观察到饱和吸收现象。

低压-金属有机物汽相外延生长的Ga（1-x）InxAs/InP激光器中深能级的研究

应用深能级瞬态谱(DLTS)技术详细研究低压-金属有机物汽相外延(LP-MOVPE)生长的Ga_(0.74)In_(0.53)As/InP量子阱、宽接触和质子轰击条形异质结激光器中的深能级。样品的DLTS表明,在宽接触激光器的i-Ga_(0.47)In(0.53)As有源层里观察到 H1(Ev+0.09eV)和E1(E_c-0.35eV)陷阱,它们可能分别与样品生长过程中扩散到i-Ga_(0.47)In_(0.53)As有源层的Zn和材料本身的原生缺陷有关。而条形激光器的i-Ga_(0.47)In_(0.53)A_s有源层的 H_2(E_v+0.11eV)和 E_2(E_q-0.42eV)陷阱则可能是H1和E1与质子轰击引起的损伤相互作用的产物 。

Fabrication of 1.3 mu m Si-based MEMS tunable optical filter

In this paper we report the fabrication of 1.3 mum Si-based MEMS tunable optical filter, by surface micromaching. Through wet etching of polyimide sacrificial layer, a tunable Fabry-Perot filter was successfully fabricated. We make the capacitance measurement of the prototype device, compare the experimental curve with the theoretical one, and explain the difference between them.

Optical characterization of the Ge/Si (001) islands in multilayer structure

We show that the observed temperature dependence of the photoluminescence (PL) features can be consistently explained in terms of thermally activated carrier transfer processes in a multilayer structure of the self-organized Ge/Si(001) islands. The type II (electron confinement in Si) behavior of the Ge/Si islands is verified. With elevated temperature, the thermally activated electrons and holes enter the Ge islands from the Si and from the wetting layer (WL), respectively. An involvement of the type I (spatially direct) into type II (spatially indirect) recombination transition takes place at a high temperature.

1.5 mu m DFB integrated with vertical tapered spotsize converter fabricated by selective MOVPE

1.5 mu m DFB LD butt-joint integrated with vertical tapered spotsize converter was fabricated by LP-MOVPE. The vertical far field angle (FWHM) was decreased from 34degrees to 10degrees the threshold currents was as low as 19.8mA, the output power was 9.6mw at 100mA without HR coating and the SMSR was 35.8dB. The 1-dBm misalignment tolerance was 3.2 mu m, while the counterpart of the device without SSC was 2.2 mu m.

SiGe/Si quantum well resonant-cavity-enhanced photodetector

Resonant-cavity-enhanced photodetectors have been demonstrated to be able to improve the bandwidth-efficiency product. We report a novel SiGe/Si multiple quantum-well resonant-cavity-enhanced photodetector fabricated on a separation-by-implanted-oxygen wafer operating near 1300nm. The buried oxide layer in SIMOX is used as a bottom mirror to form a vertical cavity with silicon dioxide/silicon Bragg reflector deposited on the top surface. The quantum efficiency at the wavelength of 1300nm is measured with 3.5% at a reverse bias of 15V, which is enhanced by 10 folds compared with a conventional photodetector with the same absorption structures.

Normal-incident SiGe/Si MQWs photodetectors operating at 1.3 mu m

A normal-incident SiGe/Si multiple quantum wells (MQWs) photodetector was reported. The structure and fabrication process of the photodetector were introduced. The photocurrent spectra measurement showed that the response spectra was expanded to 1.3 mu m wavelength. The quantum efficiency of the photodetector was 0.1% at 1.3 mu m and 20% at 0.95 mu m.