Sensitivity of Total-Dose Radiation Hardness of SIMOX Buried Oxides to Doses of Nitrogen Implantation into Buried Oxides

In order to improve the total-dose radiation hardness of the buried oxides(BOX) in the structure of separa tion-by-implanted-oxygen(SIMOX) silicon-on-insulator(SOI), nitrogen ions are implanted into the buried oxides with two different doses,2 × 1015 and 3 × 1015 cm-2 , respectively. The experimental results show that the radiation hardness of the buried oxides is very sensitive to the doses of nitrogen implantation for a lower dose of irradiation with a Co-60 source. Despite the small difference between the doses of nitrogen implantation, the nitrogen-implanted 2 × 1015 cm-2 BOX has a much higher hardness than the control sample (i. e. the buried oxide without receiving nitrogen implantation) for a total-dose irradiation of 5 × 104rad(Si), whereas the nitrogen-implanted 3 × 1015 cm-2 BOX has a lower hardness than the control sample. However,this sensitivity of radiation hardness to the doses of nitrogen implantation reduces with the increasing total-dose of irradiation (from 5 × 104 to 5 × 105 rad (Si)). The radiation hardness of BOX is characterized by MOS high-frequency (HF) capacitance-voltage (C-V) technique after the top silicon layers are removed. In addition, the abnormal HF C-V curve of the metal-silicon-BOX-silicon(MSOS) structure is observed and explained.

低能离子束方法制备重掺杂Fe的Si:Fe固溶体

利用质量分离的低能离子束方法,以离子能量为1000eV,剂量为3×1017cm-2,室温下往p型Si(111)单晶衬底注入Fe离子,注入的样品在400 C���空下进行热处理.俄歇电子能谱法(AES)对原位注入样品深度分析表明Fe离子浅注入到p型Si单晶衬底,注入深度约为42nm.X射线衍射法(XRD)对热处理样品结构分析发现只有Si衬底的衍射峰,没有其他新相.X射线光电子能谱法(XPS)对热处理样品表面分析发现Fe2p束缚能对应于单质Fe的峰,没有形成Fe的硅化物.这些结果表明重掺杂Fe的Si:Fe固溶体被制备.电化学C-V法测量了热处理后样品载流子浓度随深度的分布,发现Fe重掺杂Si致使Si的导电类型从p型转为n型,Si:Fe固溶体和Si衬底形成pn结,具有整流特性.

GaN基肖特基结构紫外探测器

在蓝宝石(0001)衬底上采用低压金属有机物化学气相沉积(MOCVD)方法生长GaN外延层结构,以此为材料制作了GaN基肖特基结构紫外探测器.测量了该紫外探测器的暗电流曲线、C-V特性曲线、光响应曲线和响应时间曲线.该紫外探测器在5V偏压时暗电流为0.42nA,在10V偏压时暗电流为38.5nA.在零偏压下,该紫外探测器在250nm～365nm的波长范围内有较高的响应度,峰值响应度在363nm波长处达到0.12A/W,在365nm波长左右有陡峭的截止边;当波长超过紫外探测器的截止波长(365nm左右),探测器的响应度减小了三个数量级以上.该紫外探测器的响应时间小于2μs.

GaAs/Si/AlAs异质结的带阶和GaAS生长温度的影响

用分子束外延（MBE）设备制备了GaAs/AlAs和GaAs/Si/AlAs异质结，通过XPS分别研究了异质结界面处Si层厚度为0.5ML和1ML对异质结带阶的调节，得到最大调节量为0.2eV;通过C���V法研究了异质结的GaAs层在不同温度下生长对0.5MLSi夹层的影响，得到Si夹层的空间分布随GaAs层生长温度的升高而扩散增强的温度效应，通过深能级瞬态谱（DLTLS）研究了在上述不同温度下生长的GaAs层的晶体质量。

Si(100)衬底上n-3C-SiC���p-Si异质结构研究

利用LPCVD方法在Si(100)衬底上获得了3C-SiC���延膜，扫描电子显微镜(SEM)研究表明3C-SiC���p—Si界面平整、光滑，无明显的坑洞形成。研究了以In和Al为接触电极的3C-SiC���p—Si异质结的I—V，C-V特性及I—V特性的温度依赖关系，比较了In电极的3C-SiC���p—Si异质结构和以SiGe作为缓冲层的3C-SiC���SiGe／p—Si异质结构的I—V特性，实验发现引入SiGe缓冲层后，器件的反向击穿电压由40V提高到70V以上。室温下A1电极3C-SiC���p—Si二极管的最大反向击穿电压接近100V，品质因子为1．95。

Heteroepitaxial Growth and Heterojunction Characteristics of Voids-Free n-3C-SiC on p-Si(100)

Highly oriented voids-free 3C-SiC heteroepitaxial layers are grown on φ50mm Si (100) substrates by low pressure chemical vapor deposition (LPCVD). The initial stage of carbonization and the surface morphology of carbonization layers of Si(100) are studied using reflection high energy electron diffraction (RHEED) and scanning electron microscopy (SEM). It is shown that the optimized carbonization temperature for the growth of voids-free 3S-SiC on Si (100) substrates is 1100 ℃. The electrical properties of SiC layers are characterized using Van der Pauw method. The I-V, C-V, and the temperature dependence of I-V characteristics in n-3C-SiC-p-Si heterojunctions with AuGeNi and Al electrical pads are investigated. It is shown that the maximum reverse breakdown voltage of the n-3C-SiC-p-Si heterojunction diodes reaches to 220V at room temperature. These results indicate that the SiC/Si heterojunction diode can be used to fabricate the wide bandgap emitter SiC/Si heterojunction bipolar transistors (HBT's).

利用Γ－X混合在AlAs/GaAs异质结构实现光生电子、空穴对的持久存储

利用GaAs量子阱中Γ谷速缚态与AlAs层中X谷束缚态在异质结界面处的共振Γ－X混合，使得光生电子不仅在实空间而且在K空间与光生空穴分离开来，从而在结构中形成了持久的电荷极化。这一效应已被C���V特性上所观察到的电容阶跃和正反方向扫描时所出现的双稳滞迟现象所证实。如果将我们的器件用作存储单元，预期可以获得很长的存储时间T_s。同时，由于Γ－X混合隧穿速率很快，光子“读出”仍可以保持很快。

室温铁磁性半导体Mn_xGa_(1-x)Sb

采用离子注入、离子沉积及后期退火方法制备了稀磁半导体单晶Mn_xGa_(1-x)Sb，在室温下（300 K）获得了单晶的磁滞回线。用X射线衍射方法分析了铁磁性半导体单晶Mn_xGa_(1-x)Sb的结构，用电化学C-V法分析了单晶的载流子浓度分布。由X射线衍射得知，Mn_xGa_(1-x)Sb中Mn含量逐渐由近表面处的x = 0.09下降到晶片内部的x = 0。电化学C-V测得单晶的空穴浓度高达1 * 10~(21)cm~(-3)，表明Mn_xGa_(1-x)Sb单晶中大部分Mn原子占据Ga位，起受主作用。

薄二氧化硅MOS电容电离辐射陷阱电荷研究

采用高频C-V曲线方法，研究了50nm及15nm MOS电容电离辐射空穴陷阱及界面态的建立过程。二种样品电离辐射空穴陷阱电荷密度在1×10~3Gy(Si)剂量下近乎相同，而在大于3×10~3Gy(Si)_剂量下，50nm MOS电容的电荷密度约为15nm MOS电容的2倍。利用电离辐射后的隧道退火效应，计算出二种样品电离辐射陷阱电荷在Si-SiO_2界面附近分布的距离均约为4nm。

GeSi/Si多层异质外延载流子浓度的分布

通过实验研究了一种与Ge_xSi_(1-x)合金表面具有良好电化学界面的电解液，利用电化学C-V方法研究了多层Ge_xSi_(1-x)/Si异质外延材料的载流子浓度纵向分布。实验结果表明

分子束外延生长Al掺杂n型ZnS_（1-x）Tex的类DX中心

应用光致发光(PL)、电容-电压(C-V)、深能级瞬态谱(DLTS)和光电导(PC)技术系统研究Al掺杂ZnS_(1-x)Te_x中与Al有关的类DX中心。实验结果表明，ZnS_(1-x)Te_x中存在与Ⅲ－Ⅴ族半导体DX中心相类似的性质。获得与Al有关的类DX中心光离化能E_i(～1.0eV和2.0eV)和发射势垒E_e(0.21eV和0.39eV)，这表明ZnS_(1-x)Te_x大晶格弛豫的出现是由类DX中心引起。

Heteroepitaxial growth and annealing of gamma-Al2O3 thin films on silicon

The gamma-Al2O3 films were grown on Si (100) substrates using the sources of TMA (Al (CH3)(3)) and O-2 by very low-pressure chemical vapor deposition (VLP-CVD). It has been found that the gamma-Al2O3 film has a mirror-like surface and the RMS was about 2.5nm. And the orientation relationship was gamma-Al2O3(100)/Si(100). The thickness uniformity of gamma-Al2O3 films for 2-inch epi-wafer was less than 5%. The X-ray diffraction (XRD) and reflection high-energy electron diffraction (RHEED) results show that the crystalline quality of the film was improved after the film was annealed at 1000degreesC in O-2 atmosphere. The high-frequency C-V and leakage current of Al/gamma-Al2O3/Si capacitor were also measured to verify the annealing effect of the film. The results show that the dielectric constant increased from 4 to 7 and the breakdown voltage for 65-nm-thick gamma-Al2O3 film on silicon increases from 17V to 53V.

Dielectric properties of Bi2Ti2O7 films grown on Si(100) substrate by APMOCVD

The growth of Bi2Ti2O7 films with (111) orientation on Si(100) substrate by atmospheric pressure metal-organic chemical vapor deposition(APMOCVD) technique at 480similar to550 degreesC is presented. The films were characterized by X-ray diffraction analysis, atomic force microscopy and electron diffraction. The results show high quality Bi2Ti2O7 films with smooth shinning surface. The dielectric properties and C-V characterization of the films were studied. The dielectric constant (epsilon) and loss tangent (tgdelta) were found to be 180 and 0.01 respectively. The charge storage density was 31.9fC/mum(2). The resistivity is higher than 1x10(12) Omega. .cm under the applied voltage of 5V. The Bi2Ti2O7 films are suitable to be used as a new insulating gate material in dynamic random access memory (DRAM).

Charged and strange hadron elliptic flow in Cu plus Cu collisions at root s(NN)=62.4 and 200 GeV

We present the results of an elliptic flow, v(2), analysis of Cu + Cu collisions recorded with the solenoidal tracker detector (STAR) at the BNL Relativistic Heavy Ion Collider at root s(NN) = 62.4 and 200 GeV. Elliptic flow as a function of transverse momentum, v(2)(p(T)), is reported for different collision centralities for charged hadrons h(+/-) and strangeness-ontaining hadrons K-S(0), Lambda, Xi, and phi in the midrapidity region vertical bar eta vertical bar < 1.0. Significant reduction in systematic uncertainty of the measurement due to nonflow effects has been achieved by correlating particles at midrapidity, vertical bar eta vertical bar < 1.0, with those at forward rapidity, 2.5 < vertical bar eta vertical bar < 4.0. We also present azimuthal correlations in p + p collisions at root s = 200 GeV to help in estimating nonflow effects. To study the system-size dependence of elliptic flow, we present a detailed comparison with previously published results from Au + Au collisions at root s(NN) = 200 GeV. We observe that v(2)(p(T)) of strange hadrons has similar scaling properties as were first observed in Au + Au collisions, that is, (i) at low transverse momenta, p(T) < 2 GeV/c, v(2) scales with transverse kinetic energy, m(T) - m, and (ii) at intermediate p(T), 2 < p(T) < 4 GeV/c, it scales with the number of constituent quarks, n(q.) We have found that ideal hydrodynamic calculations fail to reproduce the centrality dependence of v(2)(p(T)) for K-S(0) and Lambda. Eccentricity scaled v(2) values, v(2)/epsilon, are larger in more central collisions, suggesting stronger collective flow develops in more central collisions. The comparison with Au + Au collisions, which go further in density, shows that v(2)/epsilon depends on the system size, that is, the number of participants N-part. This indicates that the ideal hydrodynamic limit is not reached in Cu + Cu collisions, presumably because the assumption of thermalization is not attained.

Origin of improvement in device performance via the modification role of cesium hydroxide doped tris(8-hydroxyquinoline) aluminum interfacial layer on ITO cathode in inverted bottom-emission organic light-emitting diodes

It has been found that cesium hydroxide (CsOH) doped tris(8-hydroxyquinoline) aluminum (Alq(3)) as an interfacial modification layer on indium-tin-oxide (ITO) is an effective cathode structure in inverted bottom-emission organic light-emitting diodes (IBOLEDs). The efficiency and high temperature stability of IBOLEDs with CsOH:Alq(3) interfacial layer are greatly improved with respect to the IBOLEDs with the case of Cs2CO3:Alq(3). Herein, we have studied the origin of the improvement in efficiency and high temperature stability via the modification role of CsOH:Alq(3) interfacial layer on ITO cathode in IBOLEDs by various characterization methods, including atomic force microscopy (AFM), ultraviolet photoemission spectroscopy (UPS), X-ray photoemission spectroscopy (XPS) and capacitance versus voltage (C-V). The results clearly demonstrate that the CsOH:Alq(3) interfacial modification layer on ITO cathode not only enhances the stability of the cathode interface and electron-transporting layer above it. which are in favor of the improvement in device stability, but also reduces the electron injection barrier and increases the carrier density for current conduction, leading to higher efficiency.