High-Saturation-Power and High-Speed Ge-on-SOI p-i-n Photodetectors

Ge-on-silicon-on-insulator p-i-n photodetectors were fabricated using an ultralow-temperature Ge buffer by ultrahigh-vacuum chemical vapor deposition. For a detector of 70-mu m diameter, the 1-dB small-signal compression power was about 110.5 mW. The 3-dB bandwidth at 3-V reverse bias was 13.4 GHz.

Ge composition saturation behavior during low-temperature Si1-xGex growth by disilane and solid Ge molecular beam epitaxy

Ge composition dependence on the Ge cell temperature has been studied during the growth of Si1-xGex by disilane and solid Ge molecular beam epitaxy at a substrate temperature of 500 degrees C. It is found that the composition x increases and then saturates when the Ge cell temperature increases, which is different from the composition-dependent behavior in growth at high temperature as well as in growth by molecular beam epitaxy using disilane and germane. The enhanced hydrogen desorption from a Ge site alone cannot account for this abnormal composition-variation behavior. We attribute this behavior to the increase of rate constant of H desorption on a Si site when the Ge cell temperature increases.

Effect of Si-Ge interdiffusion on the waveguide properties of SiGe-Si MQW photodetector

Because of Si-Ge interdiffusion in the Si-SiGe interface during the growth process, the square-wave refractive index distribution of a SiGe-Si multiple-quantum-web (MQW) will become smooth. In order to simulate the actual refractive index profile, a staircase approximation is applied. Based on this approach, the dispersion equation of the MQW waveguide is obtained by using a transfer matrix method, The effects of index changes caused by the interdiffusion on the optical field and the characteristics of the photodetector are evaluated by solving the dispersion equation, It is shown that the Si-Ge interdiffusion can result in a reduction of the effective absorption coefficient and the quantum efficiency.

Microstructure studies of PdGe/Ge ohmic contacts to n-type GaAs formed by rapid thermal annealing

A low resistance and shallow ohmic contact to n-GaAs is performed by using Ge/Pd/GaAs trilayer structure and rapid thermal annealing process. The dependence of specific contact resistivity on the temperature of rapid thermal annealing is investigated. A good ohmic contact is formed after annealing at 400-500 degrees C for 60 s. The best specific contact resistivity is 1.4 x 10(-6) Omega cm(2). Auger electron spectroscopy (AES), secondary ion mass spectrometry (SIMS) and scanning electron microscopy (SEM) are used to analyze the interfacial microstructure. A strong correlation between the contact resistance and the film microstructure is observed.

GaInP/GaAs/Ge三结叠层光电池光谱响应的温度特性

利用金属有机物化学气相沉积法(MOCVD)制备了转化效率达27.1%的GaInP/GaAs/Ge三结叠层电池,并对其光谱响应的温度特性进行了测量研究.通过光谱响应曲线观察到各子电池的吸收边随温度升高发生红移,这主要归因于电池材料禁带宽度的变窄效应.根据光谱响应数据计算得到的GaInP/GaAs/Ge叠层电池各子电池在室温下的短路电流密度分别为12.9,13.7和17 mA/cm~2,且叠层电池的短路电流密度的温度系数为8.9 μA/(cm~2·℃).最后,根据叠层电池的串联结构推导了其电压温度系数为-6.27 mV/℃.

Si衬底上Ge材料的UHVCVD生长

采用超低温Buffer层技术在Si衬底上生长出了质量优良的厚Ge材料,材料的穿透位错密度为1×10~5 cm~(-2).原子力显微镜测试表明表面均方根粗糙度为0.33nm,卢瑟福背散射谱表明Ge的沟道产额低达3.9%,透射电镜分析则表明应变的弛豫主要是通过在Si与Ge的界面处形成失配位错来实现的.

Ge组分对SiGe HBT直流特性的影响

制作了基区Ge组分分别为0.20和0.23的多发射极指数双台面结构SiGe异质结双极型晶体管(HBT).实验结果表明,基区Ge组分的微小增加,引起了较大的基极复合电流,但减小了总的基极电流,提高了发射结的注入效率,电流增益成倍地提高.Ge组分从0.20增加到0.23,HBT的最大直流电流增益从60增加到158,提高了约2.6倍.

Smaller Ge Quantum Dots Obtained by ArF Excimer Laser Annealing

Ge self-assembled quantum dots (SAQDs) are grown with a self-assembled UHV/CVD epitaxy system. Then,the as-grown Ge quantum dots are annealed by ArF excimer laser. In the ultra-shot laser pulse duration,～20ns, bulk diffusion is forbidden, and only surface diffusion occurs, resulting in a laser induced quantum dot (LIQD). The diameter of the LIQD is 20～25nm which is much smaller than the as-grown dot and the LIQD has a higher density of about 6 × 10~(10)cm~(-2). The surface morphology evolution is investigated by AFM.

DCXRD Investigation of a Ge/Si（001） Island Multilayer Structure

A Ge/Si（001） island multilayer structure is investigated by double crystal X-ray diffraction, transmission electron microscopy,and atomic force microscopy. We fit the satellite peaks in the rocking curve by two Lorentz lineshapes, which originate from the wetting layer region and the island region. Then from the ratio of the thick- nesses of the Si and Ge （GeSi） layers as determined by TEM,tbe Ge compositions of the wetting layer and islands are estimated to be about 0. 51 and 0. 67, respectively,according to the positions of the fitted peaks. This proves to be a relatively simple way to investigate the Ge/Si （001） island multilayer structure.

nc-Ge/Si岛基光子晶体单点缺陷腔的数值模拟与分析

阐述了利用光子晶体单点缺陷微腔来提高Ge/Si纳米岛发光效率的机理.通过3D FDTD方法计算出在平板厚度为300nm时,谐振波长随a和r/a变化的规律,即当给定r/a,h时,波长随晶格常数成次线性增加;当给定a,h时,波长随r/a的增加而减小.并从理论上给予分析.

离子束溅射制备Si／Ge多层膜及红外吸收性能研究

采用离子束溅射方法在Si衬底上制备Si／Ge多层膜。通过改变生长温度、溅射速率等因素得到一系列Si／Ge多层膜样品。通过X射线衍射、拉曼散射、原子力显微分析（AFM）等表征方法研究薄膜结构与生长条件的关系。在小束流（10mA）、室温条件下制备出界面清晰、周期完整的Si／Ge多层膜。通过红外吸收谱的测量发现薄膜样品具有较好的红外吸收性能。

光子晶体对nc-Ge/Si岛发光增强的模拟

在Si基集成光电子学的发展中,高效的Si基光源是人们不懈追求的目标.但是Si材料的间接带隙特性导致其发光效率低,更谈不上受激发射.于是人们探索了多种Si基材料体系来提高Si材料的发光效率,并在不同程度上取得了重要的进展.在众多的Si基发光材料体系中,Ge/Si量子点材料,不仅生长工艺与标准的CMOS工艺有很好的兼容性,而且发光波长能够覆盖重要的光通信波段即1.3～1.55 μm,因此成为实现Si基发光器件的重要途径之一.但是目前这种材料的发光效率仍很低,所以提高其发光效率自然成为人们关注的焦点.如果将光子晶体引入到nc-Ge/Si材料中,它不仅可以改变材料本身的自发发射特性,而且可以改变发射的光子的提取效率,从而使材料的发光效率得到增强.提出了在Ge/Si量子点材料中引入光子晶体结构来提高其发光效率,包括光子晶体点缺陷腔结构和带边模式工作的完整光子晶体结构,并从理论上分析了发光效率提高的原理.针对发光波长在1.5 μm附近的材料结构,模拟出了相应的光子晶体的结构参数.从模拟结果可以看出,对于缺陷腔的光子晶体结构,采用单点缺陷微腔很好地实现了单模运作,但是微腔内有源材料的体积很小,因此得到的发光效率很低.而采用耦合缺陷腔的结构和H2腔都增加了腔内有源区的体积.但是耦合腔与H2腔相比,谐振腔模减少,主谐振模式的峰值强度增加,更容易实现单模发光.因而更适用于提高nc-Ge/Si的发光效率.而带边模式工作的光子晶体结构,尺寸较大,不需引入缺陷,工艺上更容易实现.

Mn注入 n型 Ge单晶的特性研究

采用离子能量为 100keV,剂量为 3× 1016cm- 2的离子注入技术,室温下往 n型 Ge( 111)单晶 衬底注入 Mn+离子,注入后的样品进行 400℃热处理.利用 X-射线衍射法 (XRD)和原子力显微 镜( AFM)对注入后的样品进行了结构和形貌分析, 俄歇电子能谱法 (AES)进行了组分分析,交变 梯度样品磁强计( AGM)进行了室温磁性测量.结果表明原位注入样品的结构是非晶的,热处理后 发生晶化现象.没有在样品中观察到新相形成. Mn离子较深的注入进 Ge衬底,在 120 nm处 Mn原子百分比浓度达到最高为 8%.热处理后的样品表现出了室温铁磁特性.

Si基片上掺Ge SiO2的火焰水解法制备

用火焰水解法在单晶Si片上沉积了掺Ge的SiO2(GeO2-SiO2)粉末,随后在高温炉中将此粉末烧结成玻璃.用光学显微镜观察了样品表面形貌,研究了不同的烧结工艺对样品形貌的影响.用X射线光电子能谱检测了样品的元素组成,并用棱镜耦合法测量了样品的折射率和厚度.结果表明,用适宜的工艺条件制备出的掺Ge的SiO2具有表面平整光滑,折射率和厚度可调等优点,适合用作Si基SiO2波导器件的芯层.

小尺寸Si/Ge量子点内应变和组分的拉曼光谱表征

本文详细地研究了原始生长和退火处理后的Si/Ge量子点的拉曼光谱.我们观测到了Si/Ge量子点的一系列本征的拉曼振动模以及Ge-Ge模的LO和TO声子峰间4.2cm-1的频率劈裂.通过这些参数, 我们自洽地确定了原始生长的平面直径为20nm和高为2nm的Si/Ge量子点内Ge的平均组分为80%,平均应变为-3.4%.分析清楚地表明了这种小尺寸的Si/Ge量子点内的应变仍遵从双轴应变,并且应变的释放主要由量子点和Si隔离层间Si-Ge原子互扩散决定.