Electrical switching behavior of amorphous Ge15Te85 Si--x(x) thin films with phase change memory applications

Amorphous Ge15Te85-xSix thin film switching devices (1 <= x <= 6) have been deposited in sandwich geometry, on glass substrates with aluminum electrodes, by flash evaporation technique. These devices exhibit memory type electrical switching, like bulk Ge15Te85-xSix glasses. However, unlike the bulk glasses, a-Ge15Te85-xSix films exhibit a smooth electrical switching behavior. The electrical switching fields of a-Ge15Te85-xSix thin film samples are also comparable with other chalcogenide samples used in memory applications. The switching fields of a-Ge15Te85-xSix films have been found to increase with increasing Si concentration. Also, the optical band gap of a-Ge15Te85-xSix films is found to increase with Si content. The observed results have been understood on the basis of increase in network connectivity and rigidity with Si addition. (C) 2013 Elsevier Ltd. All rights reserved.

不同膜层数的Mo/Si多层膜的表界面粗糙度和软X射线反射率

用磁控溅射法制备了顶层分别是Mo膜层和Si膜层的两个系列的Mo/Si多层膜，它们的周期厚度相同但是膜层数各不相同。Mo/Si多层膜的周期厚度和界面粗糙度由小角X射线衍射（SAXRD）曲线拟和得到。用原子力显微镜测量了Mo/Si多层膜的表面粗糙度。在国家同步辐射实验室测量了Mo/Si多层膜的软X射线反射率。通过理论和试验研究，发现Mo/Si多层膜的软X射线反射率主要由周期数和界面粗糙度决定，表面粗糙度对Mo/Si多层膜的软X射线反射率影响较小。

研究扩散屏障层对Mo/Si多层膜软X射线反射率影响的模拟

在特定波长下,用四层结构模型模拟了Mo/Si多层膜的软X射线反射率.研究了扩散屏障层dMo-on-Si和dSi-on-Mo对Mo/Si多层膜软X射线反射率的影响.研究发现,扩散屏障层并不总是损害Mo/Si多层膜的光学性能,通过合理设计dMo-on-Si和dSi-on-Mo厚度,增加dMo-on-Si与dSi-on-Mo的比值,也能提高多层膜的软X射线反射率.

Mo／Si软X射线多层膜的界面粗糙度研究

用磁控溅射法分别制备了以Mo膜层和Si膜层为顶层的Mo／Si多层膜系列，利用小角X射线衍射确定了各多层膜的周期厚度。以不同周期数的Mo／Si多层膜的新鲜表面近似等同于同一多层膜的内界面，通过原子力显微镜研究了多层膜界面粗糙度随膜层数的变化规律。并在国家同步辐射实验室测量了各多层膜的软X射线反射率。研究表明：随着膜层数的增加，Mo膜层和Si膜层的界面粗糙度先减小后增加然后再减小，多层膜的峰值反射率先增加后减小。

SiGe/Si异质结构的x射线双晶衍射

通过X射线双晶衍射图形讨论了SiGe/Si HBT的电学特性与晶格结构的关系。

在微重力下生长的GaAs:Si单晶结构缺陷的X射线研究

对空间生长GaAs:Si单晶,沿着生长方向用X射线形貌和双晶衍射方法进行了研究,X射线形貌观测到了在空间生长区域有一个扇形高完整区。双晶衍射表明,在这个扇形区回摆曲线最窄、强度较高。

Strain analysis of InP/InGaAsP wafer bonded on Si by X-ray double crystalline diffraction

Wafer bonding between p-Si and an n-InP-based InGaAsP multiple quantum well (MQW) wafer was achieved by a direct wafer bonding method. In order to investigate the strain at different annealing temperatures, four pre-bonded pairs were selected, and pair one was annealed at 150 degrees C, pair two at 250 degrees C, pair three at 350 degrees C, and pair four at 450 degrees C, respectively. The macroscopical strains on the bonded epitaxial layer include two parts, namely the internal strain and the strain caused by the mismatching of the crystalline orientation between InP (100) and Si (100). These strains were measured by the X-ray double crystalline diffraction, and theoretical calculations of the longitudinal and perpendicular thermal strains at different annealing temperatures were calculated using the bi-metal thermostats model, both the internal strain and the thermal strain increase with the annealing temperature. Normal thermal stress and the elastic biaxial thermal strain energy were also calculated using this model. (c) 2006 Elsevier B.V. All rights reserved.

Substrate nitridation induced modulations in transport properties of wurtzite GaN/p-Si (100) heterojunctions grown by molecular beam epitaxy

Phase pure wurtzite GaN films were grown on Si (100) substrates by introducing a silicon nitride layer followed by low temperature GaN growth as buffer layers. GaN films grown directly on Si (100) were found to be phase mixtured, containing both cubic (beta) and hexagonal (alpha) modifications. The x-ray diffraction (XRD), scanning electron microscopy (SEM), photoluminescence (PL) spectroscopy studies reveal that the significant enhancement in the structural as well as in the optical properties of GaN films grown with silicon nitride buffer layer grown at 800 degrees C when compared to the samples grown in the absence of silicon nitride buffer layer and with silicon nitride buffer layer grown at 600 degrees C. Core-level photoelectron spectroscopy of Si(x)N(y) layers reveals the sources for superior qualities of GaN epilayers grown with the high temperature substrate nitridation process. The discussion has been carried out on the typical inverted rectification behavior exhibited by n-GaN/p-Si heterojunctions. Considerable modulation in the transport mechanism was observed with the nitridation conditions. The heterojunction fabricated with the sample of substrate nitridation at high temperature exhibited superior rectifying nature with reduced trap concentrations. Lowest ideality factors (similar to 1.5) were observed in the heterojunctions grown with high temperature substrate nitridation which is attributed to the recombination tunneling at the space charge region transport mechanism at lower voltages and at higher voltages space charge limited current conduction is the dominating transport mechanism. Whereas, thermally generated carrier tunneling and recombination tunneling are the dominating transport mechanisms in the heterojunctions grown without substrate nitridation and low temperature substrate nitridation, respectively. (C) 2011 American Institute of Physics. [doi:10.1063/1.3658867]

铁磁/半导体异质结材料MnSb/Si的物理气相沉积生长

采用一种新的生长铁磁 /半导体异质结材料的方法——物理气相沉积方法生长了一种铁磁 /半导体异质结材料 Mn Sb/Si.对所获得的样品进行特征 X射线能谱分析表明 Mn和 Sb在 Si衬底上的沉积速率相近 ,它们的原子百分数之比接近 1∶ 1.X射线衍射分析发现薄膜中形成了 Mn Sb相 ,样品在室温下测出磁滞回线也从侧面验证了存在 Mn Sb相 .用原子力显微镜对样品的表面进行观察 ,发现 Mn Sb呈有规则形状的小晶粒状 ,晶粒大小比较均匀 ,尺寸大多数在 5 0 0 nm左右 .

低能离子束方法制备重掺杂Fe的Si∶Fe固溶体

利用质量分离的低能离子束方法 ,以离子能量为 1 0 0 0 e V,剂量为 3× 1 0 1 7cm- 2 ,室温下往 p型 Si(1 1 1 )单晶衬底注入 Fe离子 ,注入的样品在 4 0 0℃真空下进行热处理 .俄歇电子能谱法 (AES)对原位注入样品深度分析表明 Fe离子浅注入到 p型 Si单晶衬底 ,注入深度约为 4 2 nm.X射线衍射法 (XRD)对热处理样品结构分析发现只有 Si衬底的衍射峰 ,没有其他新相 .X射线光电子能谱法 (XPS)对热处理样品表面分析发现 Fe2 p束缚能对应于单质 Fe的峰 ,没有形成 Fe的硅化物 .这些结果表明重掺杂 Fe的 Si∶ Fe固溶体被制备 .电化学 C- V法测量了热处理后样品载流子浓度随深度的分布 ,发现 Fe重掺杂 Si致使 Si的导电类型从 p型转为 n型 ,Si∶ Fe固溶体和 Si衬底形成 pn结 ,具有整流特性

Mo原子溅射能量对Mo／Si薄膜微结构的影响

用磁控溅射法制备了Mo／Si薄膜，用AFM和XRD分别研究了Mo原子的溅射能量不同时，Mo／Si薄膜表面形貌和晶相的变化。通过比较发现，随着Mo原子溅射能量的增大，Mo／Si薄膜表面粗糙度增加，Mo和Si的特征X射线衍射峰也越来越强，并且Mo膜层和Si膜层之间生成了Mo-Si2。Mo原子的溅射能量是诱导非晶Si结晶和MoSi2生成的主要原因。

用不同的Mo靶溅射功率制备Mo／Si多层膜

用磁控溅射法制备了周期厚度和周期数均相同的Mo／Si多层膜，用原子力显微镜和小角X射线衍射分别研究了Mo靶溅射功率不相同时，Mo／Si多层膜表面形貌和晶相的变化。随后在国家同步辐射实验室测量了Mo／Si多层膜的软X射线反射率。研究发现，随着Mo靶溅射功率的增大，Mo／Si多层膜的表面粗糙度增加，Mo的特征X射线衍射峰也增强，Mo／Si多层膜的软X射线峰值反射率先增大后减小。