994 resultados para 7038-210
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We have applied the Green function theory in GW approximation to calculate the quasiparticle energies for semiconductors Si and GaAs. Good agreements of the calculated excitation energies and fundamental energy gaps with the experimental band structures were achieved. We obtained the calculated fundamental gaps of Si and GaAs to be 1.22 and 1.42 eV in comparison to the experimental values of 1.17 and 1.52 eV, respectively. Ab initio pseudopotential method has been used to generate basis wavefunctions and charge densities for calculating dielectric matrix elements and electron self-energies.
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We report on an aluminum oxynitride (AlON) film which was successfully made using the reactiver r.f. sputtering method in an N2-O2 mixture. The fabrication process, atomic components, breakdown field and refractive index of the AlON film are shown in detail. The AlON film is a new polyfilm combining the good properties of Al2O3 and AlN, and it is very interesting with regard to optoelectronic devices and integrated optic circuits.
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Cd in GaAs is an acceptor atom and has the largest atomic diameter among the four commonly-used group-II shallow acceptor impurities (Be, Mg, Zn and Cd). The activation energy of Cd (34.7 meV) is also the largest one in the above four impurities, When Cd is doped by ion implantation, the effects of lattice distortion are expected to be apparently different from those samples ion-implanted by acceptor impurities with smaller atomic diameter. In order to compensate the lattice expansion and simultaneously to adjust the crystal stoichiometry, dual incorporation of Cd and nitrogen (N) was carried out into GaAs, Ion implantation of Cd was made at room temperature, using three energies (400 keV, 210 keV, 110 keV) to establish a flat distribution, The spatial profile of N atoms was adjusted so as to match that of Cd ones, The concentration of Cd and N atoms, [Cd] and [N] varied between 1 x 10(16) cm(-3) and 1 x 10(20) cm(-3). Two type of samples, i.e., solely Cd+ ion-implanted and dually (Cd+ + N+) ion-implanted with [Cd] = [N] were prepared, For characterization, Hall effects and photoluminescence (PL) measurements were performed at room temperature and 2 K, respectively. Hall effects measurements revealed that for dually ion-implanted samples, the highest activation efficiency was similar to 40% for [Cd] (= [N])= 1 x 10(18) cm(-3). PL measurements indicated that [g-g] and [g-g](i) (i = 2, 3, alpha, beta,...), the emissions due to the multiple energy levels of acceptor-acceptor pairs are significantly suppressed by the incorporation of N atoms, For [Cd] = [N] greater than or equal to 1 x 10(19) cm(-3), a moderately deep emission denoted by (Cd, N) is formed at around 1.45-1.41 eV. PL measurements using a Ge detector indicated that (Cd, N) is increasingly red-shifted in energy and its intensity is enhanced with increasing [Cd] = [N], (Cd, N) becomes a dominant emission for [Cd] = [N] = 1 x 10(20) cm(-3). The steep reduction of net hole carrier concentration observed for [Cd]/[N] less than or equal to 1 was ascribed to the formation of (Cd, N) which is presumed to be a novel radiative complex center between acceptor and isoelectronic atoms in GaAs.
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采用分子束外延(MBE)方法,在(001)GaAs衬底上生长了短周期Ⅱ型超晶格(SLs):InAs/GaSb (2ML/8ML)和InAs/GaSb (8ML/8ML).从X射线衍射(HRXRD)中计算出超晶格周期分别为31.2(A)和57.3(A).室温红外透射光谱表明两种超晶格结构在短波2.1μm和中波5μm处有明显吸收.通过腐蚀、光刻和欧姆接触,制备了短波和中波的单元光导探测器.在室温和低温下进行光谱响应测试和黑体测试,77K下,50%截止波长分别为2.1μm和5.0μm,黑体探测率D~·_(bb)均超过2×10~8cmHz~(1/2)/W.室温下短波探测器D~·_(bb)超过10~8cmHz~(1/2)/W.
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在理论上研究了由法拉第旋转镜构成的Michelson干涉仪的偏振特性,推导出Michelson干涉仪的偏振引入相位噪声与法拉第旋转镜旋转角偏差的关系式。理论分析法拉第旋转角有偏差时,引导光纤中的偏振态扰动(偏振噪声)会在干涉仪中引入相位噪声,该相位噪声水平与引导光纤中的偏振噪声水平和干涉仪输入光的偏振态有关。并且当法拉第旋转角偏差±2°时,可估算偏振引入的相位噪声与引导光纤中偏振噪声的幅度比值低于2×10-3;在多波长复用系统中,若法拉第旋转角偏差±5°,该幅度比值仍低于1.5×10-2。实验中观察到该幅度比值低于2.5×10-2,并发现输入光偏振态变化并不引起干涉仪相位噪声的变化,由此可知由法拉第旋转角偏差引入的相位噪声符合理论估算的量级,得到了很好的抑制。
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在SIMOX SOI材料的埋氧中注氮是为了增强该类材料的抗辐射能力.通过C-V研究表明,对于埋氧层为150 nm的SIMOX SOI材料来说,当在其埋氧中注入4×10~(15)cm~(-2)剂量的氮后,与未注氮埋氧相比,注氮埋氧中的固定正电荷密度显著增加了;而对于埋氧层为375 nm的SIMOX SOI材料来说,当注氮剂量分别为2×10~(15)cm~(-2)和3×10~(15)cm~(-2)时,并未发现埋氧中固定正电荷密度的增加.所有SIMOX注氮后的退火条件是完全相同的.通过SIMS分析,将薄埋氧中固定正电荷密度的增加归结为注氮后的退火所引起的氮在埋氧与Si界面附近的积累.同时还发现,未注氮埋氧中的固定正电荷密度是非常小的.这意味着通常情况下在热生长SiO_2膜中大量存在的氧化物电荷,其数量在SIMOX埋氧中则要相对少得多.
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介绍了用NH_3-MBE技术在蓝宝石C面上外延的高质量的GaN单层膜以及GaN/AlN/GaN极化感应二维电子气材料。外延膜都是N面材料。形成的二维电子气是“倒置二维电子气”。GaN单层膜的室温电子迁移率为300cm~2/Vs。二维电子气材料的迁移率为680cm~2/Vs(RT)和1700cm~2/Vs(77K),相应的二维电子气的面密度为3.2×10~(13)cm~(-2)(RT)和2.6×10~(13)cm~(-2)(77K)。
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报道a-Si:H本征膜及Pin二极管的1MeV1.4×10~(15),4.2×10~(15),8.4×10~(15)/cm~2电子幅照实验结果和退火行为。测量了电子辐照对a-Si:H光暗电导率和光致发光谱的影响,以及a-Si:H Pin二极管光伏特性和光谱响应随电子辐照剂量的变化。发现电子辐照在a-Si:H本征膜和二极管中引起严重的损伤,和二极管光谱响应的峰值“红移”。但未见饱和现象,还观测到明显的室温恢复现象;但高温退火处理后未能完全恢复。该文对以上实验结果给出了合理的解释。
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用射频等离子体辅助分子束外延技术(RF-MBE)在C面蓝宝石衬底上外延了高质量的GaN膜以及AlGaN/GaN极化感应二维电子气材料。所外延的GaN膜室温背景电子浓度为2×10~(17)cm~(-3),相应的电子迁移率为177cm~2/(V·s);GaN(0002)X射线衍射摇摆曲线半高宽(FWHM)为6';AlGaN/GaN极化感应二维电子气材料的室温电子迁移率为730cm~2(V·s),相应的电子气面密度为7.6×10~(12)cm~(-2);用此二维电子气材料制作的异质结场效应晶体管(HFET)室温跨导达50mS/mm(栅长1μm),截止频率达13GHz(栅长0.5μm)。
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该文研究了MBE通常生长条件和氢原子辅助生长条件下(100)、(331)、(210)、(311)等表面外延形貌的变化。
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从基本的光跃迁理论出发,用半经典的线性色散模型,计算了双量子阱耦合情况下微腔透射谱。计算结果表明,当吸收系数取2×10~(-2)nm~(-1)时,在微腔的透射谱上能看到三个很高的透射峰,并且峰的线宽要窄于冷腔透射峰的线宽。这是由于耦合激子态与微腔光场的强耦合相互作用引起的。
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报道10×16元二维面阵GaAs/AlGaAs多量子阱红外探测器的研究进展。通过表面光栅耦合,采用垂直入射的工作模式,在T=80K时探测率为2.9×10~(10)cm·Hz~(1/2)/W,电压响应率为1.3×10~4V/W。各测试单元间探测率和电压响应率的偏差小于18%,串音小于0.45%,在最大探测率偏置条件下,器件的暗电流密度为6.2×10~(-6)A/cm~2。
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报道了用MBE生长轻掺Si高迁移率GaAs材料的杂质补偿特性实验研究。已得到77K温度下迁移率为16.2×10~4cm~2/(V·s)的GaAs材料。样品的Hall测量结果表明:在较低的杂质浓度范围(1×10~(13)cm~(-3)<n<1×10~(15)cm~(-3))内,在大体相同的生长温度(590℃左右)下,选择适当的生长速率Gr会增强对浅受主杂质的抑制作用,同时也会一致Si的自补偿效应,减小杂质的补偿度N_a/N_d之值,从而提高MBE外延GaAs材料的迁移率。
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Metamorphic high electron mobility transistor (M-HEMT) structures have been grown on GaAs substrates by molecular beam epitaxy (MBE). Linearly graded and the step-graded InGaAs and InAlAs buffet layers hal e been compared, and TEM, PL and low-temperature Hall have been used to analyze the properties of the buffer layers and the M-HEMT structure. For a single-delta-doped M-HEMT structure with an In0.53Ga0.47As channel layer and a 0.8 mum step-graded InAlAs buffer layer, room-temperature mobility of 9000 cm(2)/V s and a sheet electron density as high as 3.6 x 10(12)/cm(2) are obtained. These results are nearly equivalent to those obtained for the same structure grown on an InP substrate. A basic M-HEMT device with 1 mum gate was fabricated, and g(m) is larger than 400 mS/mm. (C) 2001 Elsevier Science B.V. All rights reserved.
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We demonstrate surface emitting distributed feedback quantum cascade lasers emitting at wavelengths from 8.1 mu m at 90 K to 8.4 mu m at 210 K. The second-order metalized grating is carefully designed using a modified coupled-mode theory and fabricated by contact lithography. The devices show single mode behavior with a side mode suppression ratio above 18 dB at all working temperatures. At 90 K, the device emits an optical power of 101 mW from the surface and 199 mW from the edge. In addition, a double-lobe far-field pattern with a separation of 2.2 degrees is obtained in the direction along the waveguide.