Polycrystalline silicon thin films and solar cells prepared by rapid thermal CVD

Polycrystalline silicon (poly-Si) films(similar to 10 mu m) were grown from dichlorosilane by a rapid thermal chemical vapor deposition (RTCVD) technique, with a growth rate up to 100 Angstrom/s at the substrate temperature (T-s) of 1030 degrees C. The average grain size and carrier mobility of the films were found to be dependent on the substrate temperature and material. By using the poly-Si films, the first model pn(+) junction solar cell without anti-reflecting (AR) coating has been prepared on an unpolished heavily phosphorus-doped Si wafer, with an energy conversion efficiency of 4.54% (AM 1.5, 100 mW/cm(2), 1 cm(2)).

Luminescence properties of ZnSe films grown by hot wall epitaxy

The photoluminescence (PL) properties of ZnSe films grown by hot wall epitaxy are reported. The PL spectra show clear neutral donor-bound exciton peak; donor acceptor pair (DAP) peak, conduction band to acceptor (CA) peak, and their phonon replicas until fourth order. The conduction band to acceptor peak and it's phonon replicas exist until room temperature. From the ratio of PL intensities of DAP and CA peaks and their replicas, we obtain the Huang-Rhys factor S = 0.58, in agreement with other experiments for acceptor-bound exciton transitions. From the temperature dependence of PL intensities we derive the activation energy of thermal quenching process for the DAP transitions as about 7 meV.

Energy relaxation processes of hot quasi-two-dimensional excitons in very thin GaAs/AlGaAs quantum wells by exciton-acoustic-phonon interaction

The rising time of the excitonic luminescence in GaAs/AlGaAs quantum wells is studied as a function of the well width. For well thickness below approximately 20 Angstrom, we find an increase of rising time with decreasing well width. We explain the dependence of the rising time on well width in very thin quantum wells by the slow-down energy relaxation and/or exciton migration processes due to the decrease of the scattering rate of the exciton-acoustic-phonon interaction. (C) 1996 American Institute of Physics.

CVD制备SiO_x纳米线的各个生长阶段的直接实验证据

在纳米线的制备中,气-液-固(VLS)生长机制得到了人们的广泛认可,但该机制的很多细节还停留在模型阶段.依托实验室自行设计的一台生长条件高度可控的高温化学气相沉积(CVD)系统,采用较为简便的方法,直接在Si片衬底上制备出了SiO_x纳米线.通过严格控制实验参数,用离位观测捕捉到了纳米线的催化、形核和长大的一系列过程及其相关细节,并发现纳米线从细到粗的气-液-固(VLS)生长机制.讨论了气-液-固(VLS)机制中气态Si原子的来源以及纳米线的催化、形核和长大过程中的纳米曲率效应和"纳米熟化"现象,取得了对SiO_x纳米线VLS催化生长机制的理解的突破.

Growth of SiGe by D-UHV/CVD at Low Temperature

The temperature is a key factor for the quality of the SiGe alloy grown by D-UHV/CVD. In conventional conditions,the lowest temperature for SiGe growth is about 550℃. Generally, the pressure of the growth chamber is about 10~(-5) Pa when liquid nitrogen is introduced into the wall of the growth chamber with the flux of 6sccm of the disilane gas. We have succeeded in depositing SiGe films at much lower temperature using a novel method. It is about 10.2 Pa without liquid nitrogen, about 3 magnitudes higher than the traditional method,leading to much faster deposition rate. Without liquid nitrogen,the SiGe film and SiGe/Si superlattice are grown at 485℃. The DCXRD curves and TEM image show that the quality of the film is good. The experiments show that this method is efficient to deposit SiGe at low temperature.

UHV/CVD法生长硅基低位错密度厚锗外延层

采用超高真空化学气相淀积系统,以高纯Si_2H_6和GeH_4作为生长气源,用低温缓冲层技术在Si（001）衬底上成功生长出厚的纯Ge外延层.对Si衬底上外延的纯Ge层用反射式高能电子衍射仪、原子力显微镜、X射线双晶衍射曲线和Ra-man谱进行了表征.结果表明在Si基上生长的约550nm厚的Ge外延层,表面粗糙度小于1nm,XRD双晶衍射曲线和Ra-man谱Ge-Ge模半高宽分别为530″和5.5cm~(-1),具有良好的结晶质量.位错腐蚀结果显示线位错密度小于5×105cm~(-2).可用于制备Si基长波长集成光电探测器和Si基高速电子器件.

Growth of near planar Si0.5Ge0.5 epitaxial layers directly on Si substrate by UHV/CVD at 500℃

The relationship between Ge content of Si1-xGex layers and growth conditions was investigated via UHV/CVD system at relative low temperature of 500℃. Si1-xGex layers were in a metastable state in this case. 10-period strained 3.0 nm- Si0.5Ge0.5/3.4 nm- Si multi quantum wells were obtained directly on Si substrate. Raman Measurement, high resolution electron microscopy and photoluminescence were used to characterize the structural and optical properties. It is found that such relative thick Si0.5Ge0.5/Si multi quantum wells are still near planar and free of dislocations, that makes it exploit applications to electrical and optical devices.

水平冷壁CVD生长4H-SiC同质外延膜

采用自行设计的水平冷壁低压化学气相沉积(LPCVD)方法在偏向〈1120〉晶向8°的n型4H-SiC(0001)衬底上进行了同质外延生长.在5.3×103Pa的低压下,外延膜生长速率超过3μm/h.电容-电压法测试表明在非有意掺杂外延膜中净施主浓度为8.4×10 15cm-3.Nomarski显微镜观察表明厚外延膜的表面光滑,生长缺陷密度很低.AFM测试显示表面均方根粗糙度为0.3nm,没有观察到宏观台阶结构.Raman谱线清晰锐利,表现出典型的4H-SiC特征.在低温PL谱中,近带边区域出现很强的自由激子峰,表明样品是高质量的.

Improved Epitaxy of 3C-SiC Layers on Si(100) by New CVD/LPCVD System

Single crystalline 3C-SiC epitaxial layers are grown on φ50mm Si wafers by a new resistively heated CVD/LPCVD system, using SiH_4, C_2H_4 and H_2 as gas precursors. X-ray diffraction and Raman scattering measurements are used to investigate the crystallinity of the grown films. Electrical properties of the epitaxial 3C-SiC layers with thickness of 1 ～ 3μm are measured by Van der Pauw method. The improved Hall mobility reaches the highest value of 470cm~2/(V·s) at the carrier concentration of 7.7 * 10~(17)cm~(-3).

ECR plasma CVD法淀积980 nm大功率半导体激光器端面光学膜技术

介绍了电子回旋共振等离子体化学气相沉积(简称ECR plasma CVD)法淀积980nm大功率半导体激光器两端面光学膜的工艺条件，探索了膜系监控的方法和优越性，讨论了这种淀积方法的优点和淀积的光学膜的优良特性。

ECR Plasma CVD淀积光电器件介质膜的工艺模拟

于2010-11-23批量导入

Growth of SiGe Films by Cold-wall UHV/CVD Using GeH_4 and Si_2H_6

国家自然科学基金,国家863计划

UHV/CVD外延生长SiGe/Si表面反应动力学

利用SiH_4和GeH_4作为源气体，对UHV/CVD生长Si_(1-x)Ge_x/Si外延层的表面反应机理进行了研究，通过TPD、RHEED等实验观察了Si(100)表面SiH_4的饱和吸附、热脱附过程，得出SiH_4的分解应该是每个SiH_4分子的4个H原子全部都吸附到了Si表面，SiH_4的吸附率正比于表面空位的4次方，并分析了GeH_4的表面吸附机制。在此基础上建立了UHV/CVD生长Si_(1-x)Ge_x/Si的表面反应动力学模型,利用模型对实验结果进行了模拟，二者符合得很好。