Si-GaAs的电学补偿机理及微区均匀性对电子迁移率的影响

Submitted by zhangdi (zhangdi@red.semi.ac.cn) on 2009-04-13T11:45:31Z

Si-GaAs中El2的光淬灭效应及有关深能级行为的研究

Submitted by zhangdi (zhangdi@red.semi.ac.cn) on 2009-04-13T11:45:31Z

Si-GaAs注入退火特性的研究

Submitted by zhangdi (zhangdi@red.semi.ac.cn) on 2009-04-13T11:45:31Z

Si衬底上GaAs外延生长及其GaAs/AlGaAs激光器的研制

Submitted by zhangdi (zhangdi@red.semi.ac.cn) on 2009-04-13T11:45:31Z

大直径SI-GaAs 单晶的VGF 生长技术和材料性质研究

Submitted by zhangdi (zhangdi@red.semi.ac.cn) on 2009-04-13T11:45:31Z

Structural properties of SI-GaAs grown in space

The structural properties of Semi-insulating gallium arsenide (SI-GaAs) crystal grown with power-travelling technique in space have been studied by double-crystal x-ray diffractometry and chemical etching. The quality of the crystal was first evaluated by x-ray rocking-curve method. The full width at half maximum of x-ray rocking curve in space-grown SI-GaAs is 9.4+/-0.08 are seconds. The average density of dislocations revealed by molten KOH is 2.0 X 10(4) cm(-2), and the highest density is 3.1 X 10(4) cm(-2). The stoichiometry in the single crystal grown in space is improved as well. Unfortunately, the rear of the ingot grown in space is polycrystalline owing to being out of control of power. (C) 1999 COSPAR. Published by Elsevier Science Ltd.

ф2”和 ф3”非掺Si-GaAs单晶（片）研究

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INTERFACIAL REACTIONS IN THE CO/SI/GAAS AND SI/CO/GAAS SYSTEMS

The interfacial reactions between thin films of cobalt and silicon and (100)-oriented GaAs substrates in two configurations, Co/Si/GaAs and Si/Co/GaAs, were studied using a variety of techniques including Auger electron spectroscopy, x-ray diffraction, and transmission electron microscopy. The annealing conditions were 200, 300, 400, 600-degrees-C for 30 min, and rapid thermal annealing for 15 s. It was found that Si layer in the Co/Si/GaAs system acts as a barrier at the interface between Co and GaAs when annealed up to 600-degrees-C. The interfacial reaction between Co and Si is faster than that between Co and GaAs in the system of Si/Co/GaAs. The sequence of compound formation for the two metallizations studied (Co/Si/GaAs and Si/Co/GaAs) depends strongly on the sample configuration as well as the layer thickness of Si and Co (Co/Si atomic ratio). From our results, it is promising to utilize Co/Si/GaAs multilayer film structure to make a CoSi2/GaAs contact, and this CoSi2 may offer an alternative to the commonly used W silicides as improved gate metallurgies in self-aligned metal-semiconductor field effect transistor (MESFET) technologies.

Photoluminescence and activation on SI-GaAs by Si+ implantation and following rapid thermal annealing

Photoluminescence (PL) and electrical characteristics of SI-GaAs, Si+-implanted and following rapid thermal annealing (RTA), were investigated, The PL spectra of Si-GA-C-As, Ga-i-Si-As, and V-As-Si-As were obtained. This paper concentrates on the PL peak at 1.36 eV which was proven as an emission of the Si-Ga-V-Ga combination by Si+ + P+ dual implantation. The results indicate that the peak at 1.36 eV appears when the ratio of As:Ga increased during the processing. Also high activation was obtained for the sample under the same conditions. More discussion on the mechanism of Si+ implanted SI-GaAs has been made based on the Morrow model [J. Appl. Phys, 64 (1988) 1889].

VGF法生长的低位错掺Si-GaAs单晶的缺陷和性质

研究了垂直梯度凝固法（VGF法）生长的掺Si低阻GaAs单晶材料的晶格缺陷和性质,并将VGF法和LEC法生长的非掺半绝缘GaAs单晶进行了比较.利用A-B腐蚀显微方法比较了两种材料中的微沉积缺陷,对其形成原因进行了分析.利用荧光光谱研究了掺Si-GaAs单晶中Si原子和B原子的占位情况和复合体缺陷.Hall测量结果表明,掺Si低阻VGF-GaAs单晶中存在很强的Si自补偿效应,造成掺杂效率降低.VGF-GaAs单晶生长过程中高的Si掺杂浓度造成晶体中产生大量杂质沉积,而杂质B的存在加重了这种现象.对降低缺陷密度,提高掺杂效率的途径进行了分析.

Analysis of Si/GaAs Bonding Stresses with the Finite Element Method

In conjunction with ANSYS, we use the finite element method to analyze the bonding stresses of Si/GaAs. We also apply a numerical model to investigate a contour map and the distribution of normal stress,shearing stress,and peeling stress,taking into full consideration the thermal expansion coefficient as a function of temperature. Novel bonding structures are proposed for reducing the effect of thermal stress as compared with conventional structures. Calculations show the validity of this new structure.

空间实用背场Si太阳电池和GaAs/Ge太阳电池性能随质子辐照注量变化的比较

研究了空间实用背场Si太阳电池和GaAs/Ge太阳电池性能随质子辐照注量1 * 10~9 ～ 5 * 10~(13) cm~(-2)的变化。实验表明，两种太阳电池的电性能随辐照注量增加有不同的衰降趋势，背场Si太阳电池性能参数I_(sc)、V_(oc)和P_(max)衰降变化快，辐照注量为2 * 10~(10)cm~(-2)时，P_(max)就已衰降为原值的75％；而GaAs/Ge电池对应相同的衰降辐照注量达8 * 10~(11)cm~(-2), 且其I_(sc)、V_(oc)和P_(max)衰降变化起初缓慢，当辐照注量接近3 * 10~(12)~(-2)时才迅速下降。背场Si电池和GaAs/Ge电池性能衰降分别与擀子辐照引入的E_v + 0.14eV及E_v + 0.43eV和E_c - 0.41eV深能级有关。

X射线回摆曲线定量检测SI-GaAs势光晶片的亚表面损伤层厚度

通过测量SI-GaAs抛光晶片及其本体（腐蚀了晶片的亚表面损伤层)的X射线回摆曲线FWHM,与抛光晶片的TEM观测相结合，作出晶片回摆曲线FWHM的比率R与TEM观测的晶征亚表面损伤层厚度D的关系曲线，建立了一种定量检测SI-GaAa抛光晶片的片表面损伤层厚度技术，文中将对这种技术进行描述并作讨论。

MBE生长轻掺Si高迁移率GaAs材料的杂质补偿特性研究

报道了用MBE生长轻掺Si高迁移率GaAs材料的杂质补偿特性实验研究。已得到77K温度下迁移率为16.2×10~4cm~2/(V·s)的GaAs材料。样品的Hall测量结果表明:在较低的杂质浓度范围(1×10~(13)cm~(-3)＜n＜1×10~(15)cm~(-3))内,在大体相同的生长温度(590℃左右)下,选择适当的生长速率Gr会增强对浅受主杂质的抑制作用,同时也会一致Si的自补偿效应,减小杂质的补偿度N_a/N_d之值,从而提高MBE外延GaAs材料的迁移率。