LITHIUM PASSIVATION OF ZN AND CD ACCEPTORS IN P-TYPE GAAS

We report lithium passivation of the shallow acceptors Zn and Cd in p-type GaAs which we attribute to the formation of neutral Li-Zn and Li-Cd complexes. Similar to hydrogen, another group-I element, lithium strongly reduces the concentration of free holes when introduced into p-type GaAs. The passivation is inferred from an increase of both the hole mobility and the resisitivity throughout the bulk of the sample. It is observed most clearly for Li concentrations comparable to the shallow-acceptor concentration. In addition, compensation of shallow acceptors by randomly distributed donors is present in varying degree in the Li-diffused samples. Unlike hydrogenation of n-type GaAs, Li doping shows no evidence of neutralizing shallow donors in GaAs.

PHOTOEMISSION-STUDY ON THE SNO2/P A-SICX-H INTERFACE

Ultraviolet and X-ray photoemission spectroscopies (UPS and XPS) have been employed to SnO2 and its interface with P-type a-SiCx:H. The HeI valence band spectra of SnO2 show that the valence band maximum (VBM) shifts from 4.7 eV to 3.6 eV below the Fermi level (E(F)), and the valence band tail (VBT) extends up to the E(F), as a consequence of H-plasma treatments. The work function difference between SnO2 and P a-SiCx:H is found to decrease from 0.98 eV to 0.15 eV, owing to the increase of the work function of the treated SnO2. The reduction of SnO2 to metallic Sn is also observed by XPS profiling, and it is found that this leads to a wider interfacial region between the treated SnO2 and the successive growth of P a-SiCx:H.

A NEW RESULT IN TRANSIENT CURRENT EXPERIMENT ON A-SI-H P/I/N AND N/I/N DEVICES

The transient current response of a-Si:H in both p/i/n and n/i/n structures has been measured as a function of pulse intermittence and pulse amplitude. The results are consistent with the picture that in p/i/n samples the peculiar current response is caused by the competing contributions of electrons and holes which show themselves in different time scales.

SPECTROSCOPIC INVESTIGATION OF HYDROGEN-DOPANT COMPLEXES IN BULK P-TYPE AND IMPLANTED N-TYPE CRYSTALLINE SILICON

Infrared absorption experiments have been performed on hydrogenated and deuterated bulk boron- and aluminum-doped-Si and implanted P, As, and Sb donors in silicon. A first evidence of complex formation in bulk p-type Si is obtained and the spectra confirm the anomalous 3.3-cm-1 deuterium frequency shift with respect to boron isotopes. The ratio of the D-B-11 and D-B-10 peak areas is found to be the same as that of the two boron isotopes natural abundance. In donor-implanted silicon, a quantitative analysis of the obtained data has allowed a rough estimate of the passivating rate due to diffusing deuterium. While the frequencies of the various vibrational lines are found to be in agreement with those reported in the literature, the data on the broad line at 1660 cm-1 (H) or 1220 cm-1 (D) seem to suggest an assignment of this peak to a complex in the bulk involving some type of defect due to the implantation process.

GSMBE growth and characterization of InxGa1-xAs/InP strained-layer MQWs in a P-i-N configuration

InxGa1-xAs/InP (0.39 less than or equal to x less than or equal to 0.68) strained-layer quantum wells having 20 wells with thickness of 50 Angstrom in a P-i-N configuration were grown by gas source molecular beam epitaxy (GSMBE). High-resolution X-ray diffraction rocking curves show the presence of up to seven orders of sharp and intense satellite reflection, indicative of the structural perfection of the samples. Low-temperature photoluminescence and low-temperature absorption spectra were used to determine the exciton transition energies as a function of strain. Good agreement is achieved between exciton transition energies obtained experimentally at low temperature with those calculated using the deformation potential theory.

穿透型V形坑对GaN基p-i-n结构紫外探测器反向漏电的影响

研究了GaN基p-i-n(p-AlGaN/i-GaN,n-GaN)结构紫外探测器的漏电机理.实验发现,在位错密度几乎相同的情况下,基于表面有较高密度的V形坑缺陷材料制备的器件表现出较高的反向漏电.进一步的SEM测试发现,这种V形坑穿透到有源区i-GaN、甚至n-GaN层.在制备p-AlGaN电极时,许多金属会落在V形坑中,从而与i-GaN形成了肖特基接触.有些甚至直接和n-GaN形成欧姆接触.正是由于并联的肖特基接触和欧姆接触的存在导致了漏电的增加.

以弱p���为有源区的新型p-n结构GaN紫外探测器

提出了以弱p���(p~--GaN)为有源区的p-n结构GaN紫外探测器.由于弱p���层的载流子浓度较低,很容易增加耗尽区的宽度,从而可以增加器件的量子效率.通过模拟计算,研究了金属与p~--GaN层的肖特基接触势垒高度、p~--GaN层厚度等参数对器件性能的影响.研究结果表明,降低金属与p~--GaN层的接触势垒高度、适当减小p~--GaN层厚度能够实现有源层方向单一的内建电场,从而提高器件的量子效率.要制备出具有良好性能的p-n结构紫外探测器,必须减小p~--GaN层厚度,降低金属与p~--GaN层的接触势垒高度.

Ni基电极淀积前后表面处理对p-GaN欧姆接触的影响

在p-GaN上蒸发Ni/Au电极前,采用王水、HCl、缓冲HF进行前表面处理,O_2气氛下退火后,比较各电极样品的I-V特性和表面形貌.结果显示无表面处理时接触电阻最小,且溶剂处理后残留的电解质会影响电极的电流特性和稳定性.用俄歇电子能谱(AES)测试不同元素随深度分布情况,发现高温退火过程中NiO的形成有自动清洁p-GaN表面的作用,因此对于Ni基电极前表面处理不是必需的.再将样品用10%草酸溶液处理,其I-V特性显示接触电阻率明显下降;X射线光电子能谱(XPS)测试显示草酸溶液处理后电极表面Ni含量显著减少,而Au元素信号峰增强,说明表面高阻P���NiO被有效除去,对改善接触性能具有实际意义.

NiO removal of Ni/Au Ohmic contact to p-GaN after annealing

The Ni/Au contact was treated with oxalic acid after annealing in O_2 ambient, and its I-V characteristic showed the property of contact has been obviously improved. An Auger electron spectroscopy (AES) depth pro-file of the contact as-annealed showed that the top layer was highly resistive NiO, while an X-ray photo-electron spectroscopy (XPS) of oxalic acid treated samples indicated that the NiO has been removed effectively. A scanning electron microscope (SEM) was used to observe the surface morphology of the contacts, and it was found that the lacunaris surface right after annealing became quite smooth with lots of small Au exposed areas after oxalic acid treatment. When the test probe or the subsequently deposited Ti/Au was directly in contact with these small Au areas, they worked as low resistive current paths and thus decrease the specific contact resistance.

p���掺杂1.3 μm InAs/GaAs量子点激光器的最大模式增益特性的研究

对p���掺杂1.3 μm InAs/GaAs量子点激光器的最大模式增益进行了实验和理论分析.实验上,测量了不同腔长激光器阈值电流密度与总损耗的对应关系,拟合出的最大模式增益为17.5 cm~(-1),与相同结构非掺杂量子点激光器的最大模式增益一致.同时理论分析表明,p���掺杂对InAs/GaAs量子点激光器的最大模式增益并无影响,并且最大模式增益的计算结果与实验值相符.具有较小高度或高宽比的量子点能达到更高的最大模式增益,而较高的最大模式增益对p���掺杂1.3 μm InAs/GaAs自组织量子点激光器在光通信系统中的应用具有重要意义.

两步合金法制作p-GaN高反电极

利用两步合金法获得了能与p-GaN形成良好欧姆接触的高反射电极。电极的构成采用透明电极+高反射金属方案,厚的Ag层或Al层覆盖在合金后的Ni/Au上以提高电极的反射率,以Pt和Au作为覆盖层,可有效地防止Ag的氧化和团聚,短时间的热处理有助于Ag基电极反射率的提高。可靠性测试表明Ag基电极的稳定性较好,对于Al基电极,热处理后反射镜上出现暗斑,导致其反射率的下降。最终获得了波长在460nm处反射率为74%的Ag基高反射电极。