平面酞菁弱取向外延薄膜的KPFM研究

载流子传输一直是有机半导体研究中最核心的问题，通过弱外延生长方法可制备高取向、大面积连续的平面酞菁化合物薄膜，其迁移率可达到单晶水平。本论文中应用建立起来的有机半导体开尔文探针力显微镜(KPFM)表征方法，从微观水平研究了这种弱取向外延薄膜和常规的多晶有机半导体薄膜中结构和电特性的关系。 1. 建立了有机半导体的KPFM表征方法。KPFM用微探针方法同时获得样品的表面形貌和电势，本文第二章中论述了KPFM的工作原理、操作方法和成像机制，解释了相关的有机半导体表面态的问题。并且定量验证我们所建立的这种方法的可靠性。 2. 运用KPFM研究了多晶态的有机半导体CuPc和F16CuPc，直接观察到晶界势垒的存在，说明CuPc晶界处存在类施主的缺陷能级，F16CuPc晶界处存在类受主的缺陷能级，这两两种缺陷态分别俘获空穴和电子，使晶界周围的载流子耗尽而形成空间电荷区，限制了载流子的传输，我们从实验的角度证明了有机半导体中晶界限制载流子传输的理论。另外得到多晶CuPc高能量分辨的局域功函图像，越是π电子暴露的表面其功函越高。 3. 在导电的H-Si(111)衬底上制备出6P诱导弱取向生长的CuPc和F16CuPc薄膜，比较了和SiO2衬底上的弱外延生长薄膜的特征。KPFM观察到在CuPc界面处的能带弯曲和空穴累积，这大大降低了载流子传输沟道内CuPc晶界的势垒，从而其迁移率得到很大提高，这说明6P除了具有在结构上诱导使酞菁取向的作用外，还具有电子结构上的效应。另外研究了6P弱外延生长的亚单层F16CuPc薄膜，直接观察到在6P-F16CuPc界面存在强烈的电荷累积，这从微观上说明了有机异质结的电特性。

PLD方法制备ZnO薄膜的特征温度研究

用PLD方法在Si(111)衬底上制备了ZnO薄膜.在薄膜的沉积过程中,用安装在激光脉冲沉积设备上的反射高能电子衍射仪(RHEED)对薄膜的生长进行了原位监测.结合薄膜的X射线衍射(XRD)分析和荧光光谱(PL)分析,发现达到或者超过650C时生长的薄膜,结构和光学特性得到了显著的改善.

带有A1N插入层的GaN薄膜的结构及应变研究

利用金属有机化学汽相沉积(MOCVD)法在硅衬底上生长具有AIN插入层的GaN外延膜，采用高分辨X射线衍射(HRXRD)和卢瑟福背散射/沟道(RBS/Channeling)技术研究分析其结构和应变性质。从RBS＜0001＞沟道谱可知，该外延膜具有良好的结晶品质，χ_(min)＝2.5％。利用不同方位角上XRD摇摆曲线测量，可得出GaN(0001)面与Si(111)面之间的夹角β＝1.379°。通过对GaN(0002)和GaN(10(1-bar)5)衍射面的θ-2θ扫描，可以得出GaN外延膜在垂直方向和水平方向的平均弹性应变分别为-0.10%±0.02％和0.69％±0.09％。通过对{10(1-bar)0}面内非对称<1(2-bar)13>轴RBS角扫描可得出由弹性应变引起的四方畸变e_T在近表面处为0.35％±0.02％。外延膜弹性性质表明GaN膜在水平方向具有张应力(e~〃＞0)、在垂直方向具有压应力(e~⊥＜0)，印证了XRD的结果。四方畸变是深度敏感的，通过对不同深度的四方畸变计算可知，A1N插入层下面的GaN外延膜弹性应变释放速度比A1N层上面的GaN层弹性应变释放快，说明A1N层的插入缓解了应变释放速度。

脉冲激光沉积方法制备ZnO薄膜生长参量对发光特性的影响

用脉冲激光沉积（PLD）方法在Si（111）衬底上制备了ZnO薄膜。以325nmHe-Cd激光器为光源对薄膜进行了荧光光谱分析，用X射线衍射仪（XRD）和原子力显微镜（AFM）分别对薄膜的结构和形貌进行了分析。脉冲激光沉积方法的主要生长参量为氧压、激光重复频率、生长温度和激光能量。通过控制这些参量变量，研究了这些参量对ZnO薄膜发光特性的影响，得到了用于紫外发光的ZnO薄膜生长的优化条件

溶胶-凝胶法制备ZnO纳米薄膜的工艺和应用

ZnO是一种重要的功能材料和新型的n一Ⅵ族宽禁带半导体材料。采用溶胶一凝胶(sol-gel)工艺在si(100)、si(111)和c面蓝宝石衬底上成功制备出高质量的ZnO纳米薄膜，并用XRD、SEM、AFM等方法研究了薄膜的特性。首次以制备的ZnO纳米薄膜为缓冲层，在n型si(1()o)衬底上采用低压化学气相沉积(LPCVD)工艺外延生长了SiC薄膜，得到了低载流子浓度、高电子迁移率和高空穴迁移率的两种SiC薄膜样品，分析了该薄膜的性能。

Study of infrared luminescence from Er-implanted GaN films

In this study, we report the dependences of infrared luminescence properties of Er-implanted GaN thin films (GaN:Er) on the kinds of substrates used to grow GaN, the growth techniques of GaN, the implantation parameters and annealing procedures. The experimental results showed that the photoluminescence (PL) intensity at 1.54 mum was severely influenced by different kinds of substrates. The integrated PL peak intensity from GaN:Er /Al2O3 (00001) was three and five times stronger than that from GaN:Er /Si (111) grown by molecular beam epitaxy (MBE) and by metalorganic chemical vapor deposition (MOCVD), respectively. The PL spectra observed from GaN:Er/Al2O3 (0001) grown by MOCVD and by MBE displayed a similar feature, but those samples grown by MOCVD exhibited a stronger 1.54 mum PL. It was also found that there was a strong correlation between the PL intensity with ion implantation parameters and annealing procedures. Ion implantation induced damage in host material could be only partly recovered by an appropriate annealing temperature procedure. The thermal quenching of PL from 15 to 300 K was also estimated. In comparison with the integrated PL intensity at 15 K, it is reduced by only about 30 % when going up to 300 K for GaN:Er/Al2O3 sample grown by MOCVD. Our results also show that the strongest PL intensity comes from GaN:Er grown on Al2O3 substrate by MOCVD. (C) 2004 Elsevier B.V. All rights reserved.

Photoluminescence of nanocrystalline SiC films prepared by rf magnetron sputtering

Amorphous Sic films are deposited on Si (111) substrates by rf magnetron sputtering and then annealed at 1200 degreesC for different times by a dc self-heating method in a vacuum annealing system. The crystallization of the amorphous Sic is determined by Raman scattering at room temperature and X-ray diffraction. The experimental result indicates that the Sic nanocrystals have formed in the films. The topography of the as-annealed films is characterized by atomic force microscopy. Measurements of photoluminescence of the as-annealed films show blue or violet light emission from the nanocrystalline Sic films and photoluminescence peak shifts to short wavelength side as the annealing time decreases.

Self-assembling process of alkanethiol monolayers on gold surface via underpotential deposition

It was demonstrated feasible that underpotential deposition(UPD) of copper on a monolayer-modified gold substrate can be used to determine the gold electrode area. The deposition and stripping of a Cu adlayer can take Place reversibly and stably at a bared or a self-assembled monolayer modified gold electrode. The growth kinetics of decanethiol/Au was also investigated via Cu UPD. The difference between the assembling kinetics determined by UPD and that by quartz crystal microbalance measurements reveals the configuration transmutation of the assembled molecules from a disordered arrangement to an ordered arrangement during the self-assembling processes.

Growth mode and strain relaxation of InAs on InP (111)A grown by molecular beam epitaxy

Growth mode and strain relaxation of molecular-beam-epitaxy grown InAs/InAlAs/InP (111)A system have been investigated using reflection high-energy electron diffraction, transmission electron microscopy, atomic force microscopy, and photoluminescence measurements. In direct contrast to the well-studied InAs/GaAs system, our experimental results show that the InAs grown on InAlAs/InP (111)A follows the Stranski-Krastanov mode. Both self-organized InAs quantum dots and relaxed InAs islands are formed depending on the InAs coverage. Intense luminescence signals from both the InAs quantum dots and wetting layer are observed. The luminescence efficiency of (111)A samples is comparable to that of (001) samples, suggesting the feasibility of fabricating quantum dot optoelectronic devices on InP (111)A surfaces. (C) 1999 American Institute of Physics. [S0003-6951(99)01010-4].

(111)Si上外延生长六方GaN的TEM观察

利用衍衬、SAED、HRTEM对在（111）Si上外延生长的六方GaN进行了观察分析。GaN外延层与缓冲层和基底的取向关系为(0001)_(GaN)∥(0001)_(AlN)∥(111)_(Si)，[11(2-bar)0]_(GaN)∥[11(2-bar)0]_(AlN)∥[110]_(Si)。GaN外延层中存在倒反畴。GaN中位错以刃型位错为主。In_(0.1) Ga_(0.9) N/GaN的多重量子阱结构（MQW）具有阻挡穿透位错，降低位错密度的作用。

质量分离的双离子束沉积法生长CeO_2（111）/Si薄膜

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Slow highly charged ions induced electron emission from clean Si surfaces

The electron emission yields from the interaction of slow highly charged ions (SHCI) He2+, O2+ and Ne2+ with clean Si surface are measured separately. It is found that electron emission yield gamma increases proportionally to projectile kinetic energy E-p/M-p, ranging from 0.75 keV/u to 10.5 keV/u (i.e. 3.8 x 10(5) m/s <= v(p) <= 1.42 x 10(6) m/s), and it is higher for heavy ions (O2+ and Ne2+) than for light ion (He2+). For O2+ and Ne2+, gamma increases with Z(p) decreasing in our energy range, and it shows quite different from the result for higher projectile kinetic energy. After calculating the stopping power by using TRIM 2006, it is found that the fraction of secondary electrons induced by recoil atoms increases significantly at lower projectile energy, thereby leads to the differences in gamma for heavy ions O2+ and Ne2+ between lower and higher projectile kinetic energy.

反冲原子对低速离子轰击Si表面时电子发射产额的影响；Slow highly charged ions induced electron emission from clean Si surfaces

在兰州重离子加速器国家实验室电子回旋共振离子源高电荷态原子物理实验平台上,用低能(0.75keV/u≤EP/MP≤10.5keV/u,即3.8×105m/s≤vP≤1.42×106m/s)He2+,O2+和Ne2+离子束正入射到自清洁Si表面时二次电子发射产额的实验结果.结果表明电子发射产额γ近似正比于入射离子动能EP/MP.在相同动能下,γ(O)>γ(Ne)>γ(He),对于原子序数ZP比较大的O2+和Ne2+离子,ZP大者反而γ小,这与较高入射能量时的结果截然不同.通过计算不同入射能量下入射离子的阻止能损S,发现反冲原子对激发二次电子的作用随入射离子能量的降低显著增大,这正是导致在较低能量范围内二次电子发射产额与较高入射能量时存在差异的主要原因.

Mo／Si软X射线多层膜的界面粗糙度研究

用磁控溅射法分别制备了以Mo膜层和Si膜层为顶层的Mo／Si多层膜系列，利用小角X射线衍射确定了各多层膜的周期厚度。以不同周期数的Mo／Si多层膜的新鲜表面近似等同于同一多层膜的内界面，通过原子力显微镜研究了多层膜界面粗糙度随膜层数的变化规律。并在国家同步辐射实验室测量了各多层膜的软X射线反射率。研究表明：随着膜层数的增加，Mo膜层和Si膜层的界面粗糙度先减小后增加然后再减小，多层膜的峰值反射率先增加后减小。