Self-assembling process of alkanethiol monolayers on gold surface via underpotential deposition


Autoria(s): Han DX; Xu XY; Peng H; Yang GF; Li N; Zhao JW
Data(s)

2006

Resumo

It was demonstrated feasible that underpotential deposition(UPD) of copper on a monolayer-modified gold substrate can be used to determine the gold electrode area. The deposition and stripping of a Cu adlayer can take Place reversibly and stably at a bared or a self-assembled monolayer modified gold electrode. The growth kinetics of decanethiol/Au was also investigated via Cu UPD. The difference between the assembling kinetics determined by UPD and that by quartz crystal microbalance measurements reveals the configuration transmutation of the assembled molecules from a disordered arrangement to an ordered arrangement during the self-assembling processes.

Identificador

http://ir.ciac.jl.cn/handle/322003/16933

http://www.irgrid.ac.cn/handle/1471x/152642

Idioma(s)

英语

Fonte

Han DX;Xu XY;Peng H;Yang GF;Li N;Zhao JW.Self-assembling process of alkanethiol monolayers on gold surface via underpotential deposition,CHEMICAL RESEARCH IN CHINESE UNIVERSITIES,2006,22(6):783-786

Palavras-Chave #COVERED AU(111) SURFACES #COPPER DEPOSITION #ELECTRODES #CU #ADSORPTION #OXIDATION #MEMBRANES #THIOLS
Tipo

期刊论文