144 resultados para Er : YAB


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利用金属有机气相淀积方法生长了一种新型吸收体:高反射率半导体可饱和吸收镜.用这种吸收体兼作端镜,实现了1.044μm半导体端面泵浦Yb∶YAB激光器被动锁模,脉冲宽度为3.05ps,重复率为375MHz,输出功率为45mW.

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A passive mode-locked diode-pumped self-frequency-doubling Yb:YAB laser with a low modulation depth semiconductor saturable absorber mirror operating at 374 MHz is demonstrated. The measured pulse duration is 1.98 ps at the wavelength of 1044 nm. The maximum average power reaches 45 mW.

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对nc-Si/SiO_2<Er>薄膜中纳米硅(nc-Si)、Er~(3+)和非辐射复合缺陷三者间的关系作了研究.在514.5 nm光激发下,nc-Si/SiO_2<Er>薄膜在750nm和1.54μm处存在较强的发光,前者与薄膜中的nc-Si有关,后者对应于Er~(3+)从第一激发态4I13/2到基态4I15/2的辐射跃迁.随薄膜中Er3+含量的提高,1.54μm处的发光强度明显增强,750 nm处的发光强度却降低.H处理可以明显增强薄膜的发光强度,但是对不同退火温度样品,处理效果却有所不同.根据以上实验结果,可得如下结论:在nc-Si颗粒附近的Er~(3+)和其他的缺陷组成了nc-Si颗粒内产生的束缚激子的非辐射复合中心,束缚激子通过Er~(3+)的非辐射复合,激发Er~(3+)产生1.54μm处的发光,同时降低了750nm处的发光强度.nc-Si颗粒附近其他非辐射复合中心的存在会降低Er~(3+)被激发的概率,引起1.54μm处的发光强度降低.

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采用光致发光(PL)谱和傅里叶变换红外(FTIR)谱研究了掺铒a-SiO_x:H(a-SiO_x:H<Er>)薄膜在不同退火温度下光学性质和微观结构的变化。PL谱的测量结果表明:薄膜在1.54μm的Er~(3+)发光和750nm处的可风发光随退火温度有相同的变化趋势,这种变化和薄膜在退火过程中微观结构的变化有着密切关系。FTIR谱的分析表明:a-SiO_x:H薄膜是一种两相结构,富硅相镶嵌在富氧相中。两者的成分可近似用a-SiO_(x≈0.3):H和a-SiO_(x≈1.5):H表示,前者性质接近于氢化非晶硅(a-Si:H),后者性质接近于a-SiO_2。富硅相在退火中的变化对Er~(3+)的发光强度有重要影响。

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本文采用集团模型和推广的Hucket分子轨道理论(EHMO)计算c-Si中Er点缺陷及Er-O复合缺陷的原子构型及电子结构。计算结果符合实验及一些文献的第一性原理计算结果,解释了Er有c-Si中的发光特性。

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材料科学开放实验室基金,光学信息技术科学教育部开放实验室基金

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用溶胶-凝胶方法合成了掺铒(掺杂浓度10~20/cm~3)的二氧化硅玻璃。在室温下可产生1.45μm波长的红外荧光。实验结果表明

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用光致发光谱(PL)、傅里叶变换红外吸收谱(FTIR)和X射线衍射谱(XRD)等研究了稀土(Er)和氧(O)双离子注入GaAs和Si的发光特性和高效发光机理。测量并分析了该材料的FTIR和XRD谱;对该材料的高效发光机制作了较深入地探讨和澄清。

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于2010-11-23批量导入

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分别在InP、GaAs和Si中以7×10<′14>和1×10<′15>cm<′-2>的剂量进行Er离子注入, 并采用闭管、快速和炉退火等热处理。低温光致发光(PL)、反射式高等电子衍射和卢瑟福背散射实验研究表明, 上述样品中Er<′3+>离子特征发光的中心波长均出现在1.5μm处, 其中InP的发光峰最强, 而注入损伤的恢复是影响Er<′3+>发光的重要因素之一。卢瑟福背散射分析进一步证实退火后Er原子在Si中向表面迁移, 而在InP中的外扩散较小, 并比较了Er在InP和Si晶格中的占位情况。图7参12

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于2010-11-23批量导入

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SiOx films with oxygen concentrations ranging 13-46 at.% were deposited by plasma enhanced chemical vapor deposition (PECVD) technique using: pure SiH4 and N2O mixture. Erbium was then implanted at an energy of 500 KeV with dose of 2x10(15) ions/cm(2). The samples were subsequently annealed in N-2 for 20 sec at temperatures of (300-950 degrees C). Room temperature (RT) photo-luminescence (PL) data were collected by Fourier Transform Infrared Spectroscopy (FTIS) with an argon laser at a wavelength of 514.5 nm and an output power from 5 to 2500 mw. The intense room-temperature luminescence was observed around 1.54 mu m. The luminescence intensity increases by 2 orders of magnitude as compared with that of Er-doped Czochralski (CZ) Si. We found that the Er3+ luminescence depends strongly on the SiOx microstructure. Our experiment also showed that the silicon grain radius decreased with increasing oxygen content and finally formed micro-crystalline silicon or nano-crystalline silicon. As a result, these silicon small particles could facilitate the energy transfer to Er3+ and thus enhanced the photoluminescence intensity.

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In this study, we report the dependences of infrared luminescence properties of Er-implanted GaN thin films (GaN:Er) on the kinds of substrates used to grow GaN, the growth techniques of GaN, the implantation parameters and annealing procedures. The experimental results showed that the photoluminescence (PL) intensity at 1.54 mum was severely influenced by different kinds of substrates. The integrated PL peak intensity from GaN:Er /Al2O3 (00001) was three and five times stronger than that from GaN:Er /Si (111) grown by molecular beam epitaxy (MBE) and by metalorganic chemical vapor deposition (MOCVD), respectively. The PL spectra observed from GaN:Er/Al2O3 (0001) grown by MOCVD and by MBE displayed a similar feature, but those samples grown by MOCVD exhibited a stronger 1.54 mum PL. It was also found that there was a strong correlation between the PL intensity with ion implantation parameters and annealing procedures. Ion implantation induced damage in host material could be only partly recovered by an appropriate annealing temperature procedure. The thermal quenching of PL from 15 to 300 K was also estimated. In comparison with the integrated PL intensity at 15 K, it is reduced by only about 30 % when going up to 300 K for GaN:Er/Al2O3 sample grown by MOCVD. Our results also show that the strongest PL intensity comes from GaN:Er grown on Al2O3 substrate by MOCVD. (C) 2004 Elsevier B.V. All rights reserved.

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Photoluminescence (PL) from Er-implanted hydrogenated amorphous silicon suboxide (a-SiOX:H<Er>(x<2.0)) films was measured. Two luminescence bands with maxima at lambda congruent to 750 nm and lambda congruent to 1.54mum, ascribed to the a-SiOX:H intrinsic emission and Er3+ emission, were observed. Peak intensities of the two bands follow the same trend as a function of annealing temperature from 300 to 1000degreesC. Micro-Raman results indicate that the a-SiOX:H<Er> films are a mixture of two phases, an amorphous SiOX matrix and amorphous silicon (a-Si) domains embedded there in. FTIR spectra confirm that hydrogen effusion from a-SiOX:H<Er> films occurs during annealing. Hydrogen effusion leads to a reconstruction of the microstructure of a-Si domains, thus having a strong influence on Er3+ emission. Our study emphasizes the role of a-Si domains on Er3+ emission in a-SiOX:H<Er> films.

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The beta-delayed proton decays of Er-145,Er-147 have been studied experimentally using the Ni-58 + Mo-92 reaction at beam energy of 383 MeV. On the basis of a He-jet apparatus coupled with a tape transport system, the beta-delayed proton radioactivities both from the nu s(1/2) ground state and the nu h(11/2) isomer in Er-145,Er-147 were observed by proton-gamma coincidence measurements. By analyzing the time distributions of the 4(+) -> 2(gamma)(+) transitions in the granddaughter nuclei Dy-144,Dy-146, the half-lives of 1.0 +/- 0.3 s and 1.6 +/- 0.2 s have been deduced for the nu h(11/2) isomers in Er-145,Er-147, respectively.