586 resultados para UNDOPED INP


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研究了低温(1.5K)和强磁场(0-13T)条件下,InP基In_(0.53)Ga_(0.47)As/In_(0.52)A_(l0.48)As量子阱中电子占据两个子带时填充因子随磁场的变化规律.结果表明,在电子自旋分裂能远小于朗道能级展宽的情况下,如果两个子带分裂能是朗道分裂能的整数倍时,即⊿E_(21)=κ*ω_c(其中κ为整数),填充因子为偶数;当两个子带分裂能为朗道分裂能的半奇数倍时,即⊿E_(21)=(2κ+1*ω/2,填充因子出现奇数.

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A 1.55μm InGaAsP-InP three-section DFB laser with hybrid grating is fabricated and self-pulsations (SP) with frequencies around 20GHz are observed. The mechanism of SP generation in this device is researched. Furthermore, the important role of the phase tuning section on the SP is investigated.

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High performance InP/InGaAs heterojunction bipolar transistors(HBTs) have been widely used in high-speed electronic devices and optoelectronic integrated circuits. InP-based HBTs were fabricated by low pressure metal organic chemical vapor deposition(MOCVD) and wet chemical etching. The sub-collector and collector were grown at 655 ℃ and other layers at 550 ℃. To suppress the Zn out-diffusion in HBT, base layer was grown with a 16-minute growth interruption. Fabricated HBTs with emitter size of 2.5×20 μm~2 showed current gain of 70~90, breakdown voltage(BV_(CE0))>2 V, cut-off frequency(f_T) of 60 GHz and the maximum relaxation frequency(f_(MAX)) of 70 GHz.

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高温退火后掺铁半绝缘(SI)InP单晶转变为n型低阻材料.利用霍尔效应(Hall),热激电流谱(TSC),深能级瞬态谱(DLTS),X射线衍射等方法分别研究了退火前后InP材料的性质和缺陷.结果表明受高温热激发作用部分铁原子由替位转变为填隙,导致InP材料缺少深能级补偿中心而发生导电类型转变.通过比较掺杂、扩散和离子注入过程Fe原子的占位和激活情况分析了这一现象的机理和产生原因.

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研究了基于InP基的In_(0.65)Ga_(0.35)As/In_(0.52)Al_(0.48)As赝型高迁移率晶体管材料中纵向磁电阻的Shubniko-de Haas (SdH)振荡效应和霍耳效应,通过对纵向磁电阻SdH振荡的快速傅里叶变换分析,获得了各子带电子的浓度,并因此求得了各子带能级相对于费米能级的位置.联立求解Schrodinger方程和Poisson方程,自洽计算了样品的导带形状、载流子浓度分布以及各子带能级和费米能级位置.理论计算和实验结果很好符合.实验和理论计算均表明,势垒层的掺杂电子几乎全部转移到了量子阱中,转移率在95%以上.

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在半绝缘的InP衬底上采用分子束外延的方法生长制备了不同势垒厚度的RTD材料样品,室温下测量的最高峰-谷电流比为18.39.通过模拟得到RTD直流特性与势垒厚度、势阱材料及厚度、隔离层厚度以及掺杂浓度间的关系,对结果进行了分析与讨论.

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初步设计14xx nm锥形增益区脊形波导量子阱激光器材料和器件结构,利用MOCVD生长14xx nm In—GaAsP/InP量子阱激光器外延片,引入腔破坏凹槽(cavity—spoiling grooves)将有源层刻蚀断以隔离从锥形区反向传输回的高阶模,进一步改善远场光束质量.保持总腔长1900μm不变,改变脊形区的长度,其长度分别为450,700和950μm.对比三种情况的最高输出功率和远场特性,发现L_(RW)=700μm时,器件特性参数和远场光柬质量最优,斜率效率为0.32W/A,饱和输出功率为1.21W,其远场为近衍射极限的高斯分布,发散角为29°×9.6°.当固定脊形区长度为700μm,改变锥形区长度,发现当锥形区长度为1000μm时,器件特性参数进一步提高,斜率效率达0.328W/A,饱和输出功率为1.27W,远场仍为近似高斯分布.

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通过疏水键合方法实现了InGaAsP/InP有源区与GaAs/AlAs DBR的单面和双面键合,并通过SEM,I-V曲线和反射谱、光致发光谱等手段研究了GaAs/InP键合界面的机械、光学和电学性质,良好的界面性质为使用键合技术制备长波长面发射激光器提供了可能性.

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对不同气氛下高温退火非掺杂磷化铟(InP)材料的电子辐照缺陷进行了研究. 除铁受主外,磷化铁(FeP_2)气氛下退火后的InP中辐照前没有深能级缺陷,而辐照后样品的热激电流谱(TSC)中出现了5个较为明显的缺陷峰,对应的激活能分别为0.23 _eV, 0.26 _eV, 0.31 _eV, 0.37 _eV和0.46 _eV. 磷(P)气氛下退火后InP中的热生缺陷较多,电子辐照后形成的缺陷具有复合体特征. 与辐照前相比,辐照后样品的载流子浓度和迁移率产生显著变化. 在同样的条件下,经FeP_2 气氛下高温退火后的InP样品的辐照缺陷恢复速度较快. 根据这些现象分析了缺陷的属性、快速恢复机理和缺陷对材料电学性质的影响.

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分析研究了一些缺陷对InP单晶衬底的影响,包括团状结构位错的产生及其对晶格完整性的影响,坑状微缺陷、晶片抛光损伤和残留杂质的清洗腐蚀等.对这些缺陷的形成原因和抑制途径进行了分析.在此基础上获得了"开盒即用(EPI-READY)"、具有良好晶格完整性、表面无损伤的InP单晶衬底抛光片.

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报道了应用于医疗器械的InP基1730nm波段半导体激光器.外延片采用低压金属有机物化学气相沉积法(MOCVD)生长,有源区为5个周期的InGaAs量子阱层和InGaAsP垒层.器件采用pnpn结限制掩埋结构,有源区脊宽2μm、腔长300μm.室温下腔面镀膜后激光器管芯的阈值电流为18±5mA,8mW输出功率时的工作电流为60±5mA.采用TO封装后,100mA工作电流下激光器的输出功率大于5mW,输出波长为1732±10nm,高温恒流加速老化筛选实验表明,器件具有长期工作的可靠性,满足实用化要求。

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平面型雪崩光电二极管(APD)在结弯曲处具有高的电场,导致在结边缘的提前击穿。运用FEMLAB软件对不同工艺流程制备的三种不同结构平面型InP/InGaAsAPD的电场分布进行了二维有限元模拟,在表面电荷密度为5×10^11cm^-2时分析了吸收层厚度、保护环掺杂浓度、保护环和中央结纵向及横向间距等因素对边缘提前击穿特性的抑制程度。比较了这三种结构的InP/InGaAsAPD在边缘提前击穿的抑制特性的优劣。通过理论研究对平面InP/InGaAsAPD进行了优化。

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A near-infrared single-photon detection system is established by using pigtailed InGaAs/InP avalanche photodiodes. With a 50GHz digital sampling oscilloscope, the function and process of gated-mode (Geiger-mode) single-photon detection are intuitionally demonstrated for the first time. The performance of the detector as a gated-mode single-photon counter at wavelengths of 1310 and 1550nm is investigated. At the operation temperature of 203K,a quantum efficiency of 52% with a dark count probability per gate of 2. 4 * 10~(-3), and a gate pulse repetition rate of 50kHz are obtained at 1550nm. The corresponding parameters are 43% , 8. 5 * 10~(-3), and 200kHz at 238K.

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采用低压金属有机化合物气相沉积法(LP-MOCVD)生长并制作了1.6—1.7μm大应变InGaAs/InGaAsP分布反馈激光器.采用应变缓冲层技术,得到质量良好的大应变InGaAs/InP体材料.器件采用了4个大应变的量子阱,加入了载流子阻挡层改善器件的温度特性.1.66μm和1.74μm未镀膜的3μm脊型波导器件阈值电流低(小于15mA),输出功率高(100mA时大于14mW).从10—40℃,1.74μm激光器的特征温度T0=57K,和1.55μm InGaAsP分布反馈激光器的特征温度相当.

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Homoepitaxial growth of4H-SiC on off-oriented Si-face (0001) 4H-SiC substrates was performed at 1500℃ by using the step controlled Epitaxy. Ti/4H-SiC Schottky barrier diodes (SBDs) with blocking voltage over lkV have been made on an undoped epilayer with 32μm in thick and 2-5 × 10^15 cm^-3 in carrier density. The diode rectification ratio of forward to reverse (defined at ± 1V) is over 107 at room temperature and over 10^2 at 538K. Their electrical characteristics were studied by the current-voltage measurements in the temperature range from 20 to 265 ℃. The ideality factor and Schottky barrier height obtained at room temperature are 1.33 and 0. 905eV, respectively. The SBDs have on-state current density of 150A/cm^2 at a forward voltage drop of about 2.0V. The specific on-resistance for the rectifier is found to be as 7.9mΩ · cm^2 and its variation with temperature is T^2.0.