Aggregation and precipitation in high dose as ion implanted Ge0.5Si0.5 alloy

Thermally stimulated redistribution and precipitation of excess arsenic in Ge0.5Si0.5 alloy has been studied by X-ray photoelectron spectroscopy (XPS), cross sectional transmission electron microscopy (XTEM) and X-ray energy disperse spectrometry (EDS). Samples were prepared by the implantation of 6 X 10(6) As+ cm(-2) and 100 keV with subsequent thermal processing at 800 degrees C and 1000 degrees C for 1 h. The XPS depth profiles from the implanted samples before and after the thermal annealing indicate that there is marked redistribution of the elements in heavily arsenic-implanted Ge0.5Si0.5 alloys during the annealing, including: (1) diffusion of As from the implanted region to the surface; (2) aggregation of Ge in the vicinity of the surface. A high density of precipitates was observed near the surface which were by XTEM and EDS identified as an arsenide. It is suggested that most of the implanted As in Ge0.5Si0.5 alloy exists in the form of GeAs.

Dislocation movement in nitrogen-doped Czochralski silicon

Dislocation movement in N-doped Czochralski silicon (Cz-Si) was surveyed by four point bend method. Dislocation movement velocities in Cz-Si doped with nitrogen, with both nitrogen and antimony, and with only antimony were investigated. The order of measured dislocation movement velocities, at 700 degrees C less than or equal to T less than or equal to 800 degrees C and under resolved stress sigma=4.1 kg/mm(2), was V-Sb.O > V-n.Sb.O>V-N.O. The experiments showed that nigtrogen doping could retard the movement of dislocations.

Diamond growth by carbon ion implantation of diamond

Medium energy (5-25 keV) C-13(+) ion implantation into diamond (100) to a fluence ranging from 10(16) cm(-2) to 10(18) cm(-2) was performed for the study of diamond growth via the approach of ion beam implantation. The samples were characterized with Rutherford backscattering/channelling spectroscopy, Raman spectroscopy, X-ray photoemission spectroscopy and Auger electron spectroscopy. Extended defects are formed in the cascade collision volume during bombardment at high temperatures. Carbon incorporation indeed induces a volume growth but the diamond (100) samples receiving a fluence of 4 x 10(17) to 2 x 10(18) at. cm(-2) (with a dose rate of 5 x 10(15) at. cm(-2) s(-1) at 5 to 25 keV and 800 degrees C) showed no He-ion channelling. Common to these samples is that the top surface layer of a few nanometers has a substantial amount of graphite which can be removed by chemical etching. The rest of the grown layer is polycrystalline diamond with a very high density of extended defects.

Stress and resistivity controls on in situ boron doped LPCVD polysilicon films for high-Q MEMS applications

The simultaneous control of residual stress and resistivity of polysilicon thin films by adjusting the deposition parameters and annealing conditions is studied. In situ boron doped polysilicon thin films deposited at 520 ℃ by low pressure chemical vapor deposition (LPCVD) are amorphous with relatively large compressive residual stress and high resistivity. Annealing the amorphous films in a temperature range of 600-800 ℃ gives polysilicon films nearly zero-stress and relatively low resistivity. The low residual stress and low resistivity make the polysilicon films attractive for potential applications in micro-electro-mechanical-systems (MEMS) devices, especially in high resonance frequency (high-f) and high quality factor (high-Q MEMS resonators. In addition, polysilicon thin films deposited at 570 ℃ and those without the post annealing process have low resistivities of 2-5 mΩ·cm. These reported approaches avoid the high temperature annealing process (> 1000℃), and the promising properties of these films make them suitable for high-Q and high-f MEMS devices.

GaAs基MOEMS波长可调谐滤波器的设计和理论模拟

采用传输矩阵理论和结合悬臂梁的电学一机械模型对GaAs基1.55 μm微光电机械系统(MOEMS)波长可调谐滤波器的光学和电学特性进行了深入的对比分析和研究.结果表明,采用800 nm厚的空气腔可以实现滤波器波长的调谐范围为100 nm,所需最大反向偏压为4 V,波长的调谐速率可以达到1.83 MHZ.

以金属为缓冲层在Si（111）上分子束外延GaN及其表征

用电子束蒸发方法在Si（111）衬底上蒸发了Au/Cr和Au/Ti/Al/Ti两种金属缓冲层,然后在金属缓冲层上用气源分子束外延（GSMBE）生长GaN.两种缓冲层的表面都比较平整和均匀,都是具有Au（111）面择优取向的立方相Au层.在Au/Cr/Si（111）上MBE生长的GaN,生长结束后出现剥离.在Au/Ti/Al/Ti/Si（111）上无AlN缓冲层直接生长GaN,得到的是多晶GaN;先在800℃生长一层AlN缓冲层,然后在710℃生长GaN,得到的是沿GaN（0001）面择优取向的六方相GaN.将Au/Ti/Al/Ti/Si（111）在800℃下退火20min,金属层收缩为网状结构,并且成为多晶,不再具有Au（111）方向择优取向.

Characterization of Phosphorus Diffused ZnO Bulk Single Crystals

Phosphorus was diffused into CVT grown undoped ZnO bulk single crystals at 550 and 800℃ in a closed quartz tube. The P-diffused ZnO single crystals were characterized by the Hall effect, X-ray photoelectron spectroscopy （XPS）, photoluminescence spectroscopy （PL）, and Raman scattering. The P-diffused ZnO single crystals are n-type and have higher free electron concentration than undoped ZnO, especially for the sample diffused at 800℃. The PL measurement reveals defect related visible broad emissions in the range of 420-550nm in the P-diffused ZnO samples. The XPS result suggests that most of the P atoms substitute in the Zn site after they diffuse into the ZnO single crystal at 550℃ ,while the P atom seems to occupy the O site in the ZnO samples diffused at 800℃. A high concentration of shallow donor defect forms in the P-diffused ZnO,resulting in an apparent increase of free electron concentration.

HIT太阳电池中ITO薄膜的结构和光电性能

采用射频磁控溅射技术在不同射频功率下沉积了ITO薄膜,并将其应用于HIT太阳电池.分析了薄膜的结构、光电特性.结果表明,在120W时制备的薄膜很好地兼顾了电阻率和光透过率,其电阻率为3.48×10~(-4)Ω·cm、在350～800 nm波段的平均光透过率为87.1%,将其应用于HIT太阳电池上,电池的转换效率可达13.38%.

1550nm偏振不灵敏半导体光放大器的研制

研制了有源区为InGaAs张应变体材料的1．55μm偏振不灵敏半导体光放大器（SOA）。采用束传播法计算了偏离镜面垂直方向7°的埋层波导结构模式场分布，并用平面波展开法设计了多层抗反射膜，在TE模和TM模反射率同时小于10^-4时膜厚允许误差为3％。对放大自发发射谱（ASE）和增益谱的分析表明，他们具有基本一致的偏振灵敏度。对一腔长800μm的SOA在注入电流250mA时，测量得出TE模和TM模的ASE谱偏振灵敏度小于0．5dB，增益谱3dB带宽为63nm，1550nm处光纤到光纤增益为11．9dB，3dB饱和输出功率为5．6dB，在1570nm处的噪声指数为7．8dB。而一腔长1000μmSOA耦合封装后得到的最大增益为15dB。

低能碳离子束沉积（111）织构的立方SiC薄膜

在硅衬底上利用具有质量选择功能的低能离子束沉积技术沉积碳离子制备出除碳、硅之外无其他杂质元素的纯净的立方SiC薄膜．利用X射线光电子谱、俄歇电子能谱、X射线衍射对样品进行了表征．结果显示常温和400℃制备的样品为非晶结构，在800℃制备的样品由一富碳的表面层和有着良好化学计量比的SiC层组成，碳化硅晶体薄膜是（111）织构的．通过分析可知衬底温度、离子沉积能量和样品保温扩散时间等因素综合在一起对于在硅上沉积SiC薄膜起着重要作用．远远大于TRIM预测厚度的SiC薄膜的获得是高的衬底温度、一定注入能量的碳离子引起的增强扩散以及通道注入效应综合作用的结果。

非晶／微晶相变域硅薄膜及其太阳能电池

采用甚高频等离子体增强化学气相沉积(VHF—PECVD)法，成功制备出从非晶到微晶过渡区域的硅薄膜．样品的微结构、光电特性及光致变化的测量结果表明这些处于相变域的硅薄膜兼具非晶硅优良的光电性质和微晶硅的稳定性．用这种两相结构的材料作为本征层制备了p-i-n太阳能电池，并测量了其稳定性．结果在AM1．5(100mW／c^m2)的光强下曝光800-5000min后，开路电压略有升高，转换效率仅衰退了2．9％．

掺铒纳米晶硅和掺铒非晶纳米硅薄膜的发光性质

采用等离子体增强化学气相沉积(PECVD)方法制备含有纳米晶硅的SiO2(NCSO)和含有非晶纳米硅颗粒的氢化非晶氧化硅(a-SiOx:H)薄膜.采用离子注入和高温退火方法将稀土Fr掺入含有纳米晶硅(nc-Si)和非晶纳米硅(a-n-Si)颗粒的基体中.利用IFS/20HR傅里叶变换红外光谱仪和微区拉曼散射光谱仪研究含有纳米晶硅和非晶纳米硅颗粒的薄膜掺稀土前后的发光特性.结果表明来自nc-Si在800 nm的发光强度比来自a-SiOx:H基体中非晶纳米硅的发光强度高近一个数量级,而来自a-SiOx:H在1.54 μm的发光强度比NCSO高4倍.还研究了掺铒a-SiOx:H薄膜中Si颗粒和Er3+的发光强度随退火温度的变化,结合掺铒纳米晶硅和非晶纳米硅薄膜发光强度随Er掺杂浓度变化和Raman散射等的测量结果,进一步明确指出a-Si颗粒在Er3+的激发中可以起到和nc-Si同样的作用,即作为光吸收介质和敏化剂的作用

带有锥形增益区14xxnm量子阱激光器的研制

利用MOCVD生长了14xxnm AlGaInAs/AlInAs/InP应变量子阱外延片.采用带有锥形增益区脊型波导结构和普通条形脊型波导结构在相同的实验条件下制作800μm腔长激光器管芯,在相同的驱动电流下前者可以获得更高的输出光功率,而且P-Ⅰ曲线线性度较好、饱和电流高.1200μm腔长带有锥形增益区脊型波导结构管芯功率达到500mW,饱和电流3A以上,峰值波长1460nm,远场发散角为39°×11°.

InGaAlN四元合金的光学性质和低维结构

研究了用MOCVD方法生长InGaAlN四元合金材料的生长规律,发现生长温度在800～880 ℃, 其In组分随生长温度升高而降低. 用变温光致发光谱和时间分辨谱研究了InGaAlN的光学性质.光致发光谱表明InGaAlN的发光强度随温度衰减规律与InGaN类似,但比GaN慢,室温下比GaN的发光强度大1个数量级以上.时间分辨光谱表明,在InGaAlN中存在低维结构的铟聚集区--在没有高温GaN中间层的InGaAlN材料中存在类似量子盘的二维铟聚集区;而在有高温GaN中间层的InGaAlN材料中存在类似量子点的零维铟聚集区.

Improved Epitaxy of 3C-SiC Layers on Si(100) by New CVD/LPCVD System

Single crystalline 3C-SiC epitaxial layers are grown on φ50mm Si wafers by a new resistively heated CVD/LPCVD system, using SiH_4, C_2H_4 and H_2 as gas precursors. X-ray diffraction and Raman scattering measurements are used to investigate the crystallinity of the grown films. Electrical properties of the epitaxial 3C-SiC layers with thickness of 1 ～ 3μm are measured by Van der Pauw method. The improved Hall mobility reaches the highest value of 470cm~2/(V·s) at the carrier concentration of 7.7 * 10~(17)cm~(-3).