314 resultados para SILICON-ON-INSULATOR


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Our configurable optical add/drop multiplexers (OADM) are based on thermally tunable silicon-on-insulator (SOI) Bragg gratings. We have simulated the whole device and get ideal performance. We also tried experiments to explore the process of grating waveguide and got useful results.

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Effects of structure parameters on bend loss of rib silicon-on-insulator (Sol) bend waveguides have been analyzed by means of effective index method (EIM) and 2D bend loss formula. The simulation results indicate that the bend loss decreases with the increase of bend radius and waveguide width, as well as with the decrease of the step factor of the rib waveguide. Moreover, the optional structure parameters have been found when bend waveguides are single-mode.

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设计并制作了阻塞型和完全无阻塞型4×4热光SOI(silicon-on-insulator)波导开关阵列.开关单元采用了多模干涉耦合器(MMI)-MZI(Mach-Zehnder intederometer)结构的2×2光开关.阻塞型光开关附加损耗为4.8~5.4 dB,串扰为-21.8 dB~-14.5 dB.完全无阻塞型光开关阵列附加损耗为6.6~9.6 dB,串扰为-25.8~-16.8 dB.两者的消光比都在17~25 dB内变化,开关单元功耗小于230 mW.器件的开关时间小于3μs.功耗和开关速度都明显优于SiO_2基和聚合物基的开关阵列.

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基于SOI(silicon on insulator)材料的亚微米尺度电光调制器成为了研究Si光电子学的重点.评述了亚微米尺度下SOI脊型光波导实现单模条件、偏振无关、低耦合损耗的技术要求,分析并比较了几种基于不同光学结构和电学结构的电光调制器的原理和特性,讨论了达到高速电光调制的方式.

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研究了慢光模式在SOI(silicon-on-insulator)材料光子晶体线缺陷弯折波导中的传输特性.通过优化波导弯折处的结构参数,慢光模式在光子晶体60°与120°弯折波导中的透射率提高10倍以上,归一化透射率分别达到80%和60%以上.为了进一步减慢光速,设计了新颖的高Q值耦合腔弯折波导结构,在归一化透射率达到75%的基础上,光波群速度低至c/170(c为真空光速).研究结果对于增强光子晶体的慢光效应,提高光子晶体慢光器件的微型化和集成化都有一定的积极意义.

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This paper proposes a novel loadless 4T SRAM cell composed of nMOS transistors. The SRAM cell is based on 32nm silicon-on-insulator (SO1) technology node. It consists of two access transistors and two pull-down transistors. The pull-down transistors have larger channel length than the access transistors. Due to the significant short channel effect of small-size MOS transistors, the access transistors have much larger leakage current than the pull-down transistors,enabling the SRAM cell to maintain logic "1" while in standby. The storage node voltages of the cell are fed back to the back-gates of the access transistors,enabling the stable "read" operation of the cell. The use of back-gate feedback also helps to im- prove the static noise margin (SNM) of the cell. The proposed SRAM cell has smaller area than conventional bulk 6T SRAM cells and 4T SRAM cells. The speed and power dissipation of the SRAM cell are simulated and discussed. The SRAM cell can operate with a 0. 5V supply voltage.

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介绍了不同截面大小的SOI(silicon-on-insulator)波导单模条件,详细描述了几种降低传输损耗,消除偏振相关,提高耦合效率的技术手段.分析比较了一种带有MOS(metal-oxide-semiconductor)电容结构和一种具有微环结构的高速电光调制器,其调制频率分别达到10和1.5GHz.

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In order to improve the total-dose radiation hardness of the buried oxides(BOX) in the structure of separa tion-by-implanted-oxygen(SIMOX) silicon-on-insulator(SOI), nitrogen ions are implanted into the buried oxides with two different doses,2 × 1015 and 3 × 1015 cm-2 , respectively. The experimental results show that the radiation hardness of the buried oxides is very sensitive to the doses of nitrogen implantation for a lower dose of irradiation with a Co-60 source. Despite the small difference between the doses of nitrogen implantation, the nitrogen-implanted 2 × 1015 cm-2 BOX has a much higher hardness than the control sample (i. e. the buried oxide without receiving nitrogen implantation) for a total-dose irradiation of 5 × 104rad(Si), whereas the nitrogen-implanted 3 × 1015 cm-2 BOX has a lower hardness than the control sample. However,this sensitivity of radiation hardness to the doses of nitrogen implantation reduces with the increasing total-dose of irradiation (from 5 × 104 to 5 × 105 rad (Si)). The radiation hardness of BOX is characterized by MOS high-frequency (HF) capacitance-voltage (C-V) technique after the top silicon layers are removed. In addition, the abnormal HF C-V curve of the metal-silicon-BOX-silicon(MSOS) structure is observed and explained.

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采用有效折射率方法EIM(Effective Index Method)和二维束传播算法(2D-BPM)对SOI(Silicon-on-insulator)波导弯曲损耗的改善方法进行了模拟分析.模拟发现,在波导连接处引入偏移量和在波导外侧刻槽等两种不同方法都能有效减小弯曲损耗,并且后者的效果更明显.同时通过实验获得了验证.对R=16mm、横向位移为70μm的弯曲波导,通过刻槽方法将插入损耗降低了5dB,基本消除了弯曲所带来的附加损耗.

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SOI(Silicon-on-insulator, 绝缘衬底上的硅)是一种折射率差大、波导传输损耗小的新型材料, SOI基光电子器件具有与微电子工艺兼容、能够实现OEIC单片集成等优点, 近年来受到越来越多的重视. 文中重点研究了SOI波导器件的新进展, 采用高效数值模拟方法研究得出了精确的SOI矩形和梯形大截面脊形波导的单模条件, 设计和制作了单模脊形光波导、多模干涉耦合器(MMI)、可变光衰减器(VOA)、马赫-曾德尔干涉型2×2热光波导光开关, 在此基础上首次研制出4×4和8(8 SOI平面集成波导光开关矩阵.

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A novel structure of spot-size converter is designed to allow low loss and large alignment tolerance between single-mode rib waveguide devices and fiber arrays theoretically. The spot-size converter consists of a tapered rib core region and a double-cladding region. Through optimizing parameters,an expanded mode field can be tightly confined in the inner cladding and thus radiation loss be reduced largely at the tapered region. The influence of refractive index and thickness of the inner cladding on coupling loss is analyzed in particular. A novel,easy method of fabricating tapered rib spot-size converter based on silicon-on-insulator material is proposed.

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A silicon-on-insulator based channel-shifted multimode interference coupler is designed and fabricated. A two dimensional beam propagation method is used to analyze the dependence of coupler′s performances on the width and length of the multimode waveguide. The device fabricated has a power shift ratio of 73 and an excess loss of about 2.2 dB. An enhancement of fabrication accuracies could further improve the coupler performances.

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Silicon-on-insulator (SOI) technology offers tremendous potential for integration of optoelectronic functionson a silicon wafer. In this letter, a 1 * 1 multimode interference (MMI) Mach-Zender interferometer(MZI) thermo-optic modulator fabricated by wet-etching method is demonstrated. The modulator has anextinction ratio of -11.0 dB, extra loss of -4.9 dB and power consumption of 420 mW. The response timeis less than 30μs.

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SOI(Silicon-on-Insulator)光电子集成已成为十分引人注目的研究课题,其工艺与CMOS工艺完全兼容,可以实现低成本的SOI基整片集成光电子回路。本文综述了近几年来SOI集成光电子器件的发展以及一些最新的研究进展,着重分析几种最新型光无源器件的工作原理和结构,包括SOI光波导、SOI光波导耦合器、SOI光波导开关、相位阵列波导光栅(PAWG)、基于SOI的光探测器等,并介绍了中国科学院半导体所集成光电子国家重点实验室的研究进展。

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分析了SOI(silicon-on-insulator)2×2电光开关工作时热光效应对等离子色散效应的影响。采用二维半导器件模拟器PISCES-Ⅱ对器件进行模块。结果表明,热光效应对等离子色散效应的影响与调制区长度密切相关,当调制区长度较短时,热光效应的影响不容忽视;当调制区长度大于500μm时,这种影响可以忽略不计