990 resultados para Si(100)


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利用MOCVD(metalorganic chemical vapor deposition)和APCVD(atmosphere chemical vapor deposition)硅外延技术在Si(100)衬底上成功地制备了双异质Si/γ-Al_2O_3/Si SOI材料。利用反射式高能电子衍射(RHEED)、X射线衍射(XRD)及俄歇能谱(AES)对材料进行了表征。测试结果表明,外延生长的γ-Al_2O_3和Si薄膜都是单晶薄膜,其结晶取向为(100)方向,外延层中Al与O化学配比为2:3。同时,γ-Al_2O_3外延层具有良好的绝缘性能,其介电常数为8.3,击穿场强为2.5MV/cm。AES的结果表明,Si/γ-Al_2O_3/Si双异质外延SOI材料两个异质界面陡峭清晰。

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采用高真空MOCVD外延技术,利用TMA(Al(CH_3)_3)和O_2作为反应源,在Si(100)衬底上外延生长γ-Al_2O_3绝缘膜形成γ-Al_2O_3/Si异质结构材料。同时,引入外延后退火工艺以便改善γ-Al_2O_3薄膜的晶体质量及电学性能。测试结果表明,通过在O_2常压下的退火工艺可以有效地消除γ-Al_2O_3外延层的残余热应力及孪晶缺陷,改善外延层的晶体质量,同时可以提高MOS电容的抗击穿能力,降低漏电电流。

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采用常规磁控溅射方法,通过优化工艺,在Si(100),Si(111)多种基片上沉积ZnO薄膜。利用透射电镜(TEM)、X射线衍射(XRD)和X射线摇摆曲线(XRC),对ZnO薄膜的微区形貌、结晶情况、C轴择优取向进行了详细的测试分析。结果表明,所制备的ZnO薄膜具有理想的结构特性,大多数样品测得ZnO(002)晶面XRC的半高宽(FWHM)1°左右,最小值达0.353°,优于目前国内外同类研究的最佳结果2°。并对ZnO/Si(100)与ZnO/Si(111)衬底的结果进行了比较和讨论。

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利用SiH_4和GeH_4作为源气体,对UHV/CVD生长Si_(1-x)Ge_x/Si外延层的表面反应机理进行了研究,通过TPD、RHEED等实验观察了Si(100)表面SiH_4的饱和吸附、热脱附过程,得出SiH_4的分解应该是每个SiH_4分子的4个H原子全部都吸附到了Si表面,SiH_4的吸附率正比于表面空位的4次方,并分析了GeH_4的表面吸附机制。在此基础上建立了UHV/CVD生长Si_(1-x)Ge_x/Si的表面反应动力学模型,利用模型对实验结果进行了模拟,二者符合得很好。

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以Si_2H_6和GeH_4作为源气体,用UHV/CVD方法在Si(100)衬底上生长了Si_(1-x)Ge_x合金材料和Si_(1-x)Ge_x/Si多量子阱结构。用原子力显微镜、X光双晶衍射和透射电子显微镜对样品的表面形貌、均匀性、晶格质量、界面质量等进行了研究。结果表明样品的表面平整光滑,平均粗糙度为1.2nm;整个外延片各处的晶体质量都比较好,各处生长速率平均偏差3.31%,合金组分x值的平均偏差为2.01%;Si_(1-x)Ge_x/Si多量子阱材料的X光双晶衍射曲线中不仅存在多级卫星峰,而且在卫星峰之间观察到了Pendellosung条纹,表明晶格质量和界面质量都很好;Si_(1-x)Ge_x/Si多量子阱材料的TEM照片中观察不到位错的存在。

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In this paper, we report the fabrication of Si-based double hetero-epitaxial SOI materials Si/gamma-Al2O3/Si. First, single crystalline gamma-Al2O3 (100) insulator films were grown epitaxially on Si(100) by LPCVD, and then, Si(100) epitaxial films were grown on gamma-Al2O3 (100)/Si(100) epi-substrates using a CVD method similar to silicon on sapphire (SOS) epitaxial growth. The Si/gamma-Al2O3 (100)/Si(100) SOI materials are characterized in detail by RHEED, XRD and AES techniques. The results demonstrate that the device-quality novel SOI materials Si/gamma-Al2O3 (100)/Si(100) has been fabricated successfully and can be used for application of MOS device.

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We have developed a low-temperature (LT) growth technique. Even with Ge fraction x upto 90%, the total thickness of fully relaxed GexSi1-x buffers can he reduced to 1.7 mu m with dislocation density lower than 5 x 10(6) cm(-2). The surface roughness is no more than 6 nm. The strain relaxation is quite inhomogeneous From the beginning. Stacking faults generate and form the mismatch dislocations in the interface of GeSi/LT-Si. (C) 1999 Elsevier Science B.V. All rights reserved.

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Carbonized buffer layers were formed with C2H4 on Si(100) and Si(111) substrates using different methods and SIC epilayers were grown on each buffer layer at 1050 degrees C with simultaneous supply of C2H4 and Si2H6. The structure of carbonized and epitaxy layers was analyzed with in situ RHEED. The buffer layers formed at 800 degrees C were polycrystalline on both Si(100) and Si(111) substrates whereas they were single crystals, with twins on Si(100) and without tu ins on Si(111)substrates. when formed with a gradual rise in substrate temperature from 300 degrees C to growth temperature. Raising the substrate temperature slowly results in the formation of more twins. Epilayers grown on carbonized polycrystalline lavers are polycrystalline. Single crystal epilayers without twins grow on single crystalline buffer layers without twins or with a few twins. (C) 1999 Elsevier Science B.V. All rights reserved.

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沿Si的(100)面注入He离子,能量为30keV、剂量为5×1016ions/cm2。注入后样品切成几块,在真空炉中分别做退火处理,退火温度从600℃到1000℃,退火时间均为30min。利用原子力显微镜研究了各个样品表面形貌的演化。发现样品表面形貌与退火温度相关联。假设在气泡中He原子与空位的比值很高,导致样品内部存在高压的He泡,从而使样品表面形貌发生变化。探讨了在Si中He泡随退火温度的演化和He原子在材料中的释放机制及其对表面的影响。

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In this work we employ the state-of-the-art pseudopotential method, within a generalized gradient approximation to the density functional theory, combined with a recently developed method for the calculation of HREELS spectra to study a series of different proposed models for carbon incorporation on the silicon (001) surface. A fully discussion on the geometry, energetics and specially the comparison between experimental and theoretical STM images and electron energy loss spectra indicate that the Si(100)-c(4 x 4) is probably induced by Si-C surface dinners, in agreement with recent experimental findings. (C) 2009 Elsevier B.V. All rights reserved.

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Ferroelectric SrBi4Ti4O15 thin films were successfully prepared on a Pt(111)/Ti/SiO2/Si(100) substrate for the first time by spin coating, using the polymeric precursor method. X-ray diffraction patterns of the films indicate that they are polycrystalline in nature. Atomic force microscopy (AFM) analyses showed that the surface of these films is smooth, dense and crack-free with low surface roughness (6.4 nm). At room temperature and at a frequency of 1 MHz, the dielectric constant and the dissipation factor were, respectively, 150 and 0.022. The C-V characteristics of perovskite thin film prepared at low temperature show normal ferrolectric behaviour. The remanent polarization and coercive field for the films deposited were 5.4 mu C/cm(2) and 8 5 kV/cm, respectively. All the capacitors showed good polarization fatigue characteristics at least up to 1 x 10(10) bipolar pulse cycles indicating that SrBi4Ti4O15 thin films can be a promising material for use in nonvolatile memories. (c) 2005 Elsevier B.V. All rights reserved.

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Coherent Ge(Si)/Si(001) quantum dot islands grown by solid source molecular beam epitaxy at a growth temperature of 700degreesC were investigated using transmission electron microscopy working at 300 kV. The [001] zone-axis bright-field diffraction contrast images of the islands show strong periodicity with the change of the TEM sample substrate thickness and the period is equal to the effective extinction distance of the transmitted beam. Simulated images based on finite element models of the displacement field and using multi-beam dynamical diffraction theory show a high degree of agreement. Studies for a range of electron energies show the power of the technique for investigating composition segregation in quantum dot islands. (C) 2003 Elsevier B.V. All rights reserved.

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Highly efficient solar cells (conversion efficiency 11.9%, fill factor 70%) based on the vertically aligned single-crystalline nanostructures are fabricated without any pre-fabricated p-n junctions in a very simple, single-step process of Si nanoarray formation by etching p-type Si(100) wafers in low-temperature environment-friendly plasmas of argon and hydrogen mixtures.

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Despite major advances in the fabrication and characterization of SiC and related materials, there has been no convincing evidence of the synthesis of nanodevice-quality nanoislanded SiC films at low, ultralarge scale integration technology-compatible process temperatures. The authors report on a low-temperature (400 °C) plasma-assisted rf magnetron sputtering deposition of high-quality nanocrystalline SiC films made of uniform-size nanoislands that almost completely cover the Si(100) surface. These nanoislands are chemically pure, highly stoichiometric, have a typical size of 20-35 nm, and contain small (∼5 nm) nanocrystalline inclusions. The properties of nanocrystalline SiC films can be effectively controlled by the plasma parameters.

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Precise control of composition and internal structure is essential for a variety of novel technological applications which require highly tailored binary quantum dots (QDs) with predictable optoelectronic and mechanical properties. The delicate balancing act between incoming flux and substrate temperature required for the growth of compositionally graded (Si1-xC x; x varies throughout the internal structure), core-multishell (discrete shells of Si and C or combinations thereof) and selected composition (x set) QDs on low-temperature plasma/ion-flux-exposed Si(100) surfaces is investigated via a hybrid numerical simulation. Incident Si and C ions lead to localized substrate heating and a reduction in surface diffusion activation energy. It is shown that by incorporating ions in the influx, a steady-state composition is reached more quickly (for selected composition QDs) and the composition gradient of a Si1-xCx QD may be fine tuned; additionally (with other deposition conditions remaining the same), larger QDs are obtained on average. It is suggested that ionizing a portion of the influx is another way to control the average size of the QDs, and ultimately, their internal structure. Advantages that can be gained by utilizing plasma/ion-related controls to facilitate the growth of highly tailored, compositionally controlled quantum dots are discussed as well.