996 resultados para Resistenze al moto rotabili passeggeri e merci
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Capacitance-voltage, photoluminescence (PL), and deep level transient spectroscopy techniques were used to investigate deep electron states in n-type Al-doped ZnS1-xTex epilayers grown by molecular beam epitaxy. The integrated intensity of the PL spectra obtained from Al-doped ZnS0.977Te0.023 is lower than that of undoped ZnS0.977Te0.023, indicating that some of the Al atoms form nonradiative deep traps. Deep level transient Fourier spectroscopy (DLTFS) spectra of the Al-doped ZnS1-xTex (x=0, 0.017, 0.04, and 0.046, respectively) epilayers reveal that Al doping leads to the formation of two electron traps 0.21 and 0.39 eV below the conduction band. DLTFS results suggest that in addition to the roles of Te as a component of the alloy as well as isoelectronic centers, Te is also involved in the formation of an electron trap, whose energy level with respect to the conduction band decreases as Te composition increases. Our results show that only a small fraction of Al atoms forms nonradiative deep defects, indicating clearly that Al is indeed a very good donor impurity for ZnS1-xTex epilayers in the range of Te composition being studied in this work. (C) 1997 American Institute of Physics. [S0021-8979(97)08421-1].
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The differences between the interdiffusion characteristics of Ag/YBa2Cu3O7-x and Al/YBa2Cu3O7-x contact interfaces have been revealed by secondary ion mass spectrometry (SIMS). The different electrical properties of Ag/YBa2Cu3O7-x and YBa2Cu3O7-x films after high temperature treatment are well understood by the SIMS results.
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采用射频磁控技术和退火处理制备掺Al的纳米Si-SiO_2复合薄膜.通过X射线衍射(XRD)、X射线光电子能谱(XPS)和傅里叶变换红外光谱(FTIR)表征了薄膜的结构,组分和成键情况.掺Al在SiO_2中造成氧空位,使薄膜光致发光强度增强,并出现新的发光峰.退火温度对掺Al薄膜的光致发光的峰位和峰强有较大影响.
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A Si doped AlGaN/GaN HEMT structure with high Al content (x= 44%) in the barrier layer is grown on sapphire substrate by RF-MBE. The structural and electrical properties of the heterostructure are investigated by the triple axis X-ray diffraction and Van der Pauw-Hall measurement, respectively. The observed prominent Bragg peaks of the GaN and AlGaN and the Hall results show that the structure is of high quality with smooth interface.fabricated and characterized. Better DC characteristics, maximum drain current of 1.0A/mm and extrinsic transconductance of 218mS/mm are obtained when compared with HEMTs fabricated using structures with lower Al mole fraction in the AlGaN barrier layer. The results suggest that the high Al content in the AlGaN barrier layer is promising in improving material electrical properties and device performance.
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The 940 nm Al-free active region laser diodes and bars with a broad waveguide were designed and fabricated. The stuctures were grown by metal organic chemical vapour deposition. The devices show excellent performances. The maximum output power of 6.7 W in the 100 f^m broad-area laser diodes has been measured, and is 2. 5 times higher than that in the Al-containing active region laser diodes with a narrow waveguide and 1. 7 times higher than that in Al-free active region laser diodes with a narrow waveguide. The 19 % fill-factor laser diode bars emit 33 W, and they can operate at 15W with low degradation rates.
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应用光致发光(PL)、电容-电压(C-V)、深能级瞬态谱(DLTS)和光电导(PC)技术系统研究Al掺杂ZnS_(1-x)Te_x中与Al有关的类DX中心。实验结果表明,ZnS_(1-x)Te_x中存在与Ⅲ-Ⅴ族半导体DX中心相类似的性质。获得与Al有关的类DX中心光离化能E_i(~1.0eV和2.0eV)和发射势垒E_e(0.21eV和0.39eV),这表明ZnS_(1-x)Te_x大晶格弛豫的出现是由类DX中心引起。
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于2010-11-23批量导入
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于2010-11-23批量导入
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应用电容-电压、光致荧光和深能级瞬态谱技术研究了分子束外延生长的n型Al掺杂ZnS_(1-x)Te_x外延层深中心。Al掺杂ZnS_(0.977)Te_(0.023)的光致荧光强度明显低于不掺杂的ZnS_(0.977)Te_(0.023),这表明一部分Al原子形成非辐射深中心。Al掺杂ZnS_(1-x)Te_x(x=0,0.017,0.04和0.046)的深能级瞬态傅里叶谱表明,Al引进导带下的0.21和0.39eV电子陷阱,Te除了作为材料合金的成分和等电子中心外,还涉及到一个电子陷阱的形成,其相对导带的能级位置随Te组分增加而减小。实验结果还表明仅有少量掺杂的Al原子形成非辐射中心,这说明Al对于Te组分范围内(x≤0.046)的ZnS_(1-x)Te_x外延层的确是一种非常好的施主杂质。
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于2010-11-23批量导入
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于2010-11-23批量导入
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于2010-11-23批量导入
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用卢瑟福背散射沟道技术研究了1MeVSi~+在衬底加温和室温下以不同剂量注入Al_(0.3)Ga_(0.7)As/GaAs超晶格和GaAs后的晶格损伤。在衬底加温下, 观察到Al_(0.3)Ga_(0.7)As/GaAs超晶格和GaAs都存在一个动态退火速率与缺陷产生速率相平衡的剂量范围, 以及两种速率失去平衡的临界剂量。用热尖峰与碰撞模型解释了晶格损伤积累与注入剂量和衬底温度的关系。
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于2010-11-23批量导入
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于2010-11-23批量导入