609 resultados para PSEUDOMORPHIC INGAAS HEMT


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近年来,经济社会和武器装备的信息化对半导体光电子学器件提出了更高的要求,无论是国防还是民用工程都需要有自己的关键器件.光电探测器组件作为关键器件之一,世界各国都给予了高度重视,也取得了很大的进展.文中主要介绍了Ⅲ-Ⅴ族半导体全(多)光谱焦平面探测器的研究进展情况,包括量子阱红外探测器(QWIP)、AlGaN紫外焦平面探测器、InGaAs近红外室温焦平面探测器和Sb化物焦平面探测器等.

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利用模型固体理论、k.p理论和Pikus-Bir理论,研究了InGaAs/GaAsP应变补偿量子阱,得出了较为简单通用的设计方法;进而研究了阱宽、InGaAs中In组分和GaAsP中P组分等参数对跃迁波长的影响。理论计算发现,与InGaAs/GaAs普通量子阱相比,InGaAs/GaAsP应变补偿量子阱能提供更深的载流子阱和更大的增益。按照提出的理论设计方法,研制了含InGaAs/GaAsP应变补偿量子阱的垂直腔面发射激光器(VCSEL),理论计算和实验结果相吻合。

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采用GaAs/AIGaAs和InGaAs/AIGaAs多量子阱,研制出了双色同像素读取结构的中波/长波量子阱红外探测器及160x128元中波/长波双色多量子阱红外探测器芯片。器件的材料结构生长是采用分子束外延技术,在5.08cm半绝缘GaAs衬底上完成的。发展了双色大面阵制备工艺。二维光栅的制备使用标准光刻和离子束刻蚀技术。在77K时,对量子阱红外探测器测试,得到中、长波段峰值探测率分别为Dλ=(1.61-1.90)x10~(10)cmHz~(1/2)W~-1和(1.54-2.67)x10^10cmHz~(1/2)W~-1)。中、长波段峰值波长分别为(2.7-3.8)μm和8.3μm。

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提出了利用分子束外延方法生长In_(0.5)Ga_(0.5)As/In_(0.5)Al_(0.5)As应变耦合量子点,并分析量子点的形貌和光学性质随GaAs隔离层厚度变化的特点.实验结果表明,随着耦合量子点中的GaAs隔离层厚度从2 nm增加到10 nm,In_(0.5)Ga_(0.5)As量子点的密度增大、均匀性提高,Al原子扩散和浸润层对量子点PL谱的影响被消除,而且InAlAs材料的宽禁带特征使其成为InGaAs量子点红外探测器中的暗电流阻挡层.由此可见,选择合适的GaAs隔离层厚度形成InGaAs/InAlAs应变耦合量子点将有益于InGaAs量子点红外探测器的研究.

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研制了有源区为InGaAs张应变体材料的1.55μm偏振不灵敏半导体光放大器(SOA)。采用束传播法计算了偏离镜面垂直方向7°的埋层波导结构模式场分布,并用平面波展开法设计了多层抗反射膜,在TE模和TM模反射率同时小于10^-4时膜厚允许误差为3%。对放大自发发射谱(ASE)和增益谱的分析表明,他们具有基本一致的偏振灵敏度。对一腔长800μm的SOA在注入电流250mA时,测量得出TE模和TM模的ASE谱偏振灵敏度小于0.5dB,增益谱3dB带宽为63nm,1550nm处光纤到光纤增益为11.9dB,3dB饱和输出功率为5.6dB,在1570nm处的噪声指数为7.8dB。而一腔长1000μmSOA耦合封装后得到的最大增益为15dB。

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Continuous wave operation of a semiconductor laser diode based on five stacks of InAs quantum dots (QDs) embedded within strained InGaAs quantum wells as an active region is demonstrated. At room temperature, 355-mW output power at ground state of 1.33-1.35 microns for a 20-micron ridge-waveguide laser without facet coating is achieved. By optimizing the molecular beam epitaxy (MBE) growth conditions, the QD density per layer is raised to 4*10^(10) cm^(-2). The laser keeps lasing at ground state until the temperature reaches 65 Celsius degree.

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报道了应用于医疗器械的InP基1730nm波段半导体激光器.外延片采用低压金属有机物化学气相沉积法(MOCVD)生长,有源区为5个周期的InGaAs量子阱层和InGaAsP垒层.器件采用pnpn结限制掩埋结构,有源区脊宽2μm、腔长300μm.室温下腔面镀膜后激光器管芯的阈值电流为18±5mA,8mW输出功率时的工作电流为60±5mA.采用TO封装后,100mA工作电流下激光器的输出功率大于5mW,输出波长为1732±10nm,高温恒流加速老化筛选实验表明,器件具有长期工作的可靠性,满足实用化要求。

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With the principles of microwave circuits and semiconductor device physics, two microwave power device test circuits combined with a test fixture are designed and simulated, whose properties are evaluated by a parameter network analyzer within the frequency range from 3 to 8GHz. The simulation and experimental results verify that the test circuit with a radial stub is better than that without. As an example, a C-band AlGaN/GaN HEMT microwave power device is tested with the designed circuit and fixture. With a 5.4GHz microwave input signal, the maximum gain is 8.75dB, and the maximum output power is 33.2dBm.

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A near-infrared single-photon detection system is established by using pigtailed InGaAs/InP avalanche photodiodes. With a 50GHz digital sampling oscilloscope, the function and process of gated-mode (Geiger-mode) single-photon detection are intuitionally demonstrated for the first time. The performance of the detector as a gated-mode single-photon counter at wavelengths of 1310 and 1550nm is investigated. At the operation temperature of 203K,a quantum efficiency of 52% with a dark count probability per gate of 2. 4 * 10~(-3), and a gate pulse repetition rate of 50kHz are obtained at 1550nm. The corresponding parameters are 43% , 8. 5 * 10~(-3), and 200kHz at 238K.

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RTD基集成电路所具有的超高速、低功耗和自锁存的特性,使其在数字电路、混合信号电路以及光电子系统中有着重要的应用。首先对RTD与化合物半导体HEMT,HBT以及硅CMOS器件的集成工艺进行了介绍。在MOBILE电路及其进和延伸的基础上,对高速ADC/DAC电路和低功耗的存储器电路进行了具体的分析。最后对RTD基电路面临的主要问题和挑战进行了讨论,提出基于硅基RTD与线性阈值门(LTG)逻辑相结合是未来纳米级超大规模集成电路的最佳发展方向.

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报道了激射波长为5.4和7.84μm的应变补偿In1-xGaxAs/In1-yAlyAs量子级联激光器的单模激射.以高质量的应变补偿量子级联激光器材料为支撑,通过减小FP腔长,开辟实现单模器件的新途径.首次实现阈值电流仅为50mA、腔长为145μm的激射波长在λ≈5.4μm的单模激射和阈值电流仅为80mA、腔长为170μm的激射波长在λ≈7.84um的单模激射.这是目前InGaAs/InAlAs材料体系最短腔长的边发射量子级联激光器.

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介绍了一种利用光外差技术测量光电探测器超宽带频率响应的测试方法。将一个可调谐外腔激光器和一个固定波长的分布反馈激光器(DFB-LD’s)产生的激光输入到光电探测器进行混频。通过对可调激光器腔长的控制,可以在光电探测器产生从DC到上百GHz的拍频信号,在无需额外校准光源的情况下就可以进行光电探测器超宽带频率响应特性的测试,这是该方法最突出的优点。实验证明该方法比较准确、简便、易于操作。在实验中,对两个不同的InGaAs p-i—n探测器进行测量,得到器件的3dB带宽分别为14.4GHz和40GHz。该测量方法对同类实验的研究和应用都具有实用意义。

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The growth,fabrication,and characterization of 0.2μm gate-length AlGaN/GaN HEMTs,with a high mobility GaN thin layer as a channel,grown on (0001) sapphire substrates by MOCVD,are described.The unintentionally doped 2.5μm thick GaN epilayers grown with the same conditions as the GaN channel have a room temperature electron mobility of 741cm2/(V·s) at an electron concentration of 1.52×1016 cm-3.The resistivity of the thick GaN buffer layer is greater than 108Ω·cm at room temperature.The 50mm HEMT wafers grown on sapphire substrates show an average sheet resistance of 440.9Ω/□ with uniformity better than 96%.Devices of 0.2μm×40μm gate periphery exhibit a maximum extrinsic transconductance of 250mS/mm and a current gain cutoff frequency of77GHz.The AlGaN/GaN HEMTs with 0.8mm gate width display a total output power of 1.78W (2.23W/mm) and a linear gain of 13.3dB at 8GHz.The power devices also show a saturated current density as high as 1.07A/mm at a gate bias of 0.5V.

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利用分子束外延技术,在高温下(540℃)生长了具有三维空间有序的白组织InGaAs/GaAs量子点超晶格结构,利用傅里叶变换红外光谱仪测量到了明显的垂直人射吸收峰,中心响应波长在11μm.作为对比,在低温下(480℃)生长了相同的结构,傅里叶变换红外光谱几乎没有测量到明显的垂直人射吸收峰.高分辨率X射线双晶衍射测量表明高温生长的量子点超晶格具有更好的晶体质量,原子力显微镜测量表明在高温540℃下生长的量子点具有明显的横向有序;而在低温480℃下生长的量子点并没有显示出横向有序.在进行垂直人射的吸收测量时,为了扣除量子点超晶格的周期结构带来的干涉效应,提出使用生长条件完全相同但量子点区没有掺杂的样品作为背景,提高了测量的准确性及分辨率.结果表明空间有序的量子点超品格结构比空间无序的量子点超晶格更适宜作红外探测器结构.

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Space ordered 1.3μm self-assembled InAs QDs are grown on GaAs(100) vicinal substrates by MOCVD. Photoluminescence measurements show that the dots on vicinal substrates have a much higher PL intensity and a narrower FWHM than those of dots on exact substrates, which indicates better material quality. To obtain 1.3μm emissions of InAs QDs, the role of the so called InGaAs strain cap layer (SCL) and the strain buffer layer (SBL) in the strain relaxation process in quantum dots is studied. While the use of SBL results only in a small change of emission wavelength,SCL can extend the QD's emission over 1.3μm due to the effective strain reducing effect of SCL.