X-Band GaN Power HEMTs with Power Density of 2.23W/mm Grown on Sapphire by MOCVD


Autoria(s): Wang Xiaoliang; Liu Xinyu; Hu Guoxin; Wang Junxi; Ma Zhiyong; Wang Cuimei; Li Jianping; Ran Junxue; Zheng Yingkui; Qian He; Zeng Yiping; Li Jinmin
Data(s)

2005

Resumo

The growth,fabrication,and characterization of 0.2μm gate-length AlGaN/GaN HEMTs,with a high mobility GaN thin layer as a channel,grown on (0001) sapphire substrates by MOCVD,are described.The unintentionally doped 2.5μm thick GaN epilayers grown with the same conditions as the GaN channel have a room temperature electron mobility of 741cm2/(V·s) at an electron concentration of 1.52×1016 cm-3.The resistivity of the thick GaN buffer layer is greater than 108Ω·cm at room temperature.The 50mm HEMT wafers grown on sapphire substrates show an average sheet resistance of 440.9Ω/□ with uniformity better than 96%.Devices of 0.2μm×40μm gate periphery exhibit a maximum extrinsic transconductance of 250mS/mm and a current gain cutoff frequency of77GHz.The AlGaN/GaN HEMTs with 0.8mm gate width display a total output power of 1.78W (2.23W/mm) and a linear gain of 13.3dB at 8GHz.The power devices also show a saturated current density as high as 1.07A/mm at a gate bias of 0.5V.

The growth,fabrication,and characterization of 0.2μm gate-length AlGaN/GaN HEMTs,with a high mobility GaN thin layer as a channel,grown on (0001) sapphire substrates by MOCVD,are described.The unintentionally doped 2.5μm thick GaN epilayers grown with the same conditions as the GaN channel have a room temperature electron mobility of 741cm2/(V·s) at an electron concentration of 1.52×1016 cm-3.The resistivity of the thick GaN buffer layer is greater than 108Ω·cm at room temperature.The 50mm HEMT wafers grown on sapphire substrates show an average sheet resistance of 440.9Ω/□ with uniformity better than 96%.Devices of 0.2μm×40μm gate periphery exhibit a maximum extrinsic transconductance of 250mS/mm and a current gain cutoff frequency of77GHz.The AlGaN/GaN HEMTs with 0.8mm gate width display a total output power of 1.78W (2.23W/mm) and a linear gain of 13.3dB at 8GHz.The power devices also show a saturated current density as high as 1.07A/mm at a gate bias of 0.5V.

于2010-11-23批量导入

zhangdi于2010-11-23 13:03:56导入数据到SEMI-IR的IR

Made available in DSpace on 2010-11-23T05:03:56Z (GMT). No. of bitstreams: 1 4397.pdf: 519677 bytes, checksum: bcd8981836120e5215a3d9b79bc0ad42 (MD5) Previous issue date: 2005

Institute of Semiconductors, Chinese Academy of Sciences;Institute of Microelectronics, Chinese Academy of Sciences

Identificador

http://ir.semi.ac.cn/handle/172111/16865

http://www.irgrid.ac.cn/handle/1471x/103070

Idioma(s)

英语

Fonte

Wang Xiaoliang;Liu Xinyu;Hu Guoxin;Wang Junxi;Ma Zhiyong;Wang Cuimei;Li Jianping;Ran Junxue;Zheng Yingkui;Qian He;Zeng Yiping;Li Jinmin.X-Band GaN Power HEMTs with Power Density of 2.23W/mm Grown on Sapphire by MOCVD,半导体学报,2005,26(10):1865-1870

Palavras-Chave #微电子学
Tipo

期刊论文