Mechanism of motion of an optical fiber aligned by a solder droplet

Solder is often used as an adhesive to attach optical fibers to a circuit board. In this proceeding we will discuss efforts to model the motion of an optical fiber during the wetting and solidification of the adhesive solder droplet. The extent of motion is determined by several competing forces, during three “stages” of solder joint formation. First, capillary forces of the liquid phase control the fiber position. Second, during solidification, the presence of the liquid-solid-vapor triple line as well as a reduced liquid solder volume leads to a change in the net capillary force on the optical fiber. Finally, the solidification front itself impinges on the fiber. Publicly-available finite element models are used to calculate the time-dependent position of the solidification front and shape of the free surface.

A computational study of segregation in granular material during heaping

A continuum model of the flow of granular material during silo filling using a viscoplastic constitutive relation is presented in this paper. The constitutive model is based on the Drucker-Prager plasticity yield function. The simulation results give a realistic representation of complex features of granular flows during filling processes, such as heap formation and non-zero inclination angle of the material-air interface. The model is also coupled within the same framework with novel micro-mechanical parametrisations and the process of segregation during filling of granular mixtures can also be modelled.