53 resultados para RHEED


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在GaAs基In x Ga1-xAs( x =0.15)应变层上生长了InAs 量子点(QD)层,通过分析各层之间的应力状况和位错的演变过程,配合生长过程中对反射式高能电子衍射仪(RHEED)实时监测,并观察生长后的表面形貌,发现可以通过控制应变层厚度来控制应变层表面布纹结构的宽度,而且在应变层厚度低于位错增殖的临界厚度时布纹宽度较窄.如果同时控制QD层在刚刚出点,则QD主要沿着较窄的布纹结构排列,从而得到有序排列的QD.

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异质外延法是目前制备新型SOI材料的技术途径之一。采用低压化学气相沉积技术(LPCVD)在硅衬底上先外延r-A1-2O-3绝缘单晶薄膜,制备出硅衬底上外延氧化物外延结构r-Al-2O-3/Si(EOS),然后采用类似SOS薄膜生长的常压CVD(APCVD)方法在EOS上外延硅单晶薄膜,形成新型硅基双异质SOl材料Si/r-Al-2O-3/Si。利用反射高能电子衍射(RHEED)、X射线衍射(XRD)、俄歇电子能谱(AES)及MOS电学测量等技术表征分析了Si(100)/r-Al-2O-3(100)/Si(100)SOI异质结构的晶体结构、组分和电学性能。测试结果表明,已成功实现了高质量的新型双异质外延SOI结构材料Si(100)/ r-Al-2O-3(100)/Si(100),r-Al-2O-3与Si外延薄膜均为单晶,r-Al-2O-3薄膜具有良好绝缘性能,SOI结构界面清晰陡峭,该SOI材料可应用于CMOS电路的研制。

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在冷壁式不锈钢超高真空系统上,利用低压化学气相淀积(LPCVD)方法在直径为50 mm的单晶Si(100)和Si(111)晶向衬底上生长出了高取向无坑洞的晶态立方相碳化硅(3C-SiC)外延材料,利用反射高能电子衍射(RHEED)和扫描电镜(SEM)技术详细研究了Si衬底的碳化过程、碳化层的表面形貌及缺陷结构,获得了界面平整光滑、没有空洞形成的3C-SiC外延材料,并采用X- 射线衍射(XRD)、双晶X- 射线衍射(DXRD)和霍尔(Hall)测试等技术研究了外延材料的结构和电学特性。

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利用MOCVD(metalorganic chemical vapor deposition)和APCVD(atmosphere chemical vapor deposition)硅外延技术在Si(100)衬底上成功地制备了双异质Si/γ-Al_2O_3/Si SOI材料。利用反射式高能电子衍射(RHEED)、X射线衍射(XRD)及俄歇能谱(AES)对材料进行了表征。测试结果表明,外延生长的γ-Al_2O_3和Si薄膜都是单晶薄膜,其结晶取向为(100)方向,外延层中Al与O化学配比为2:3。同时,γ-Al_2O_3外延层具有良好的绝缘性能,其介电常数为8.3,击穿场强为2.5MV/cm。AES的结果表明,Si/γ-Al_2O_3/Si双异质外延SOI材料两个异质界面陡峭清晰。

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采用金属蒸气真空弧(MEVVA)离子源以低束流方式将Nd离子注入到外延硅片中,经高温快速退火处理,制备了结晶良好的钕硅掺杂层。用扫描电子显微镜(SEM)、反射式高能电子衍射(RHEED)和X射线衍射(XRD)分析了在不同退火条件下样品注入层相结构的变化。研究结果表明,经高温热处理,注入层形成结晶良好的钕硅化合物,出现由Nd_5Si_4相向NdSi相转变的趋势。并对其转变过程进行了初步探讨。

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Highly oriented voids-free 3C-SiC heteroepitaxial layers are grown on φ50mm Si (100) substrates by low pressure chemical vapor deposition (LPCVD). The initial stage of carbonization and the surface morphology of carbonization layers of Si(100) are studied using reflection high energy electron diffraction (RHEED) and scanning electron microscopy (SEM). It is shown that the optimized carbonization temperature for the growth of voids-free 3S-SiC on Si (100) substrates is 1100 ℃. The electrical properties of SiC layers are characterized using Van der Pauw method. The I-V, C-V, and the temperature dependence of I-V characteristics in n-3C-SiC-p-Si heterojunctions with AuGeNi and Al electrical pads are investigated. It is shown that the maximum reverse breakdown voltage of the n-3C-SiC-p-Si heterojunction diodes reaches to 220V at room temperature. These results indicate that the SiC/Si heterojunction diode can be used to fabricate the wide bandgap emitter SiC/Si heterojunction bipolar transistors (HBT's).

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利用SiH_4和GeH_4作为源气体,对UHV/CVD生长Si_(1-x)Ge_x/Si外延层的表面反应机理进行了研究,通过TPD、RHEED等实验观察了Si(100)表面SiH_4的饱和吸附、热脱附过程,得出SiH_4的分解应该是每个SiH_4分子的4个H原子全部都吸附到了Si表面,SiH_4的吸附率正比于表面空位的4次方,并分析了GeH_4的表面吸附机制。在此基础上建立了UHV/CVD生长Si_(1-x)Ge_x/Si的表面反应动力学模型,利用模型对实验结果进行了模拟,二者符合得很好。

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GaN epilayers were grown on (0001) sapphire substrates by NH3-MBE and RF-MBE (radio frequency plasma). The polarities of the epilayers were investigated by in-situ RHEED, chemical solution etching and AFM surface examination. By using a RF-MBE grown GaN layer as template to deposit GaN epilayer by NH3-MBE method, we found that not only Ga-polarity GaN films were repeatedly obtained, but also the electron mobility of these Ga-polarity films was significantly improved with a best value of 290 cm(2)/V.s at room temperature. Experimental results show it is an easy and stable way for growth of high quality Ga-polarity GaN films.

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In this paper, we report the fabrication of Si-based double hetero-epitaxial SOI materials Si/gamma-Al2O3/Si. First, single crystalline gamma-Al2O3 (100) insulator films were grown epitaxially on Si(100) by LPCVD, and then, Si(100) epitaxial films were grown on gamma-Al2O3 (100)/Si(100) epi-substrates using a CVD method similar to silicon on sapphire (SOS) epitaxial growth. The Si/gamma-Al2O3 (100)/Si(100) SOI materials are characterized in detail by RHEED, XRD and AES techniques. The results demonstrate that the device-quality novel SOI materials Si/gamma-Al2O3 (100)/Si(100) has been fabricated successfully and can be used for application of MOS device.

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The gamma-Al2O3 films were grown on Si (100) substrates using the sources of TMA (Al (CH3)(3)) and O-2 by very low-pressure chemical vapor deposition (VLP-CVD). It has been found that the gamma-Al2O3 film has a mirror-like surface and the RMS was about 2.5nm. And the orientation relationship was gamma-Al2O3(100)/Si(100). The thickness uniformity of gamma-Al2O3 films for 2-inch epi-wafer was less than 5%. The X-ray diffraction (XRD) and reflection high-energy electron diffraction (RHEED) results show that the crystalline quality of the film was improved after the film was annealed at 1000degreesC in O-2 atmosphere. The high-frequency C-V and leakage current of Al/gamma-Al2O3/Si capacitor were also measured to verify the annealing effect of the film. The results show that the dielectric constant increased from 4 to 7 and the breakdown voltage for 65-nm-thick gamma-Al2O3 film on silicon increases from 17V to 53V.

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Self-assembled InAs quantum wires (QWRs) embedded in In0.52Al0.48As In0.53Ga0.47As, and (In0.52Al0.48As)(2)/(In(0.53)Ga(0.47)AS)(2)-short-period-lattice matrixes on InP (001) were fabricated with molecular beam epitaxy (MBE). These QWR lines are along [110], x4 direction in the 2x4 reconstructed (001) surface as revealed with high energy electron diffraction (RHEED). Alignment of quantum wires in a multilayer structure depends on the composition of spacer layers.

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We present some results on the effect of initial buffer layer on the crystalline quality of Cubic GaN epitaxial layers grown on GaAs(100) substrates by metalorganic chemical vapor deposition. Photoluminescence and Hall measurements were performed to characterize the electrical and optical properties of cubic GaN. The crystalline quality subsequently grown high-temperature (HT) cubic GaN layers strongly depended on thermal effects during the temperature ramping process after low temperature (LT) growth of the buffer layers. Atomic force microscope (AFM) and reflection high-energy electron diffraction (RHEED) were employed to investigate this temperature ramping process. Furthermore, the role of thermal treatment during the temperature ramping process was identified. Using the optimum buffer layer, the full width at half maxim (FWHM) at room temperature photoluminescence 5.6 nm was achieved. To our knowledge, this is the best FWHM value for cubic GaN to date. The background carrier concentration was as low as 3 x 10(13) cm(-3). (C) 2000 Published by Elsevier Science S.A. All rights reserved.

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Carbonized buffer layers were formed with C2H4 on Si(100) and Si(111) substrates using different methods and SIC epilayers were grown on each buffer layer at 1050 degrees C with simultaneous supply of C2H4 and Si2H6. The structure of carbonized and epitaxy layers was analyzed with in situ RHEED. The buffer layers formed at 800 degrees C were polycrystalline on both Si(100) and Si(111) substrates whereas they were single crystals, with twins on Si(100) and without tu ins on Si(111)substrates. when formed with a gradual rise in substrate temperature from 300 degrees C to growth temperature. Raising the substrate temperature slowly results in the formation of more twins. Epilayers grown on carbonized polycrystalline lavers are polycrystalline. Single crystal epilayers without twins grow on single crystalline buffer layers without twins or with a few twins. (C) 1999 Elsevier Science B.V. All rights reserved.

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In situ FTIR spectroscopic and electrochemical data and ex situ (emersion) electron diffraction (LEED) and RHEED) and Auger spectroscopic data are presented on the structure and reactivity, with respect to the electro-oxidation of CO, of the Ru(0001) single-crystal surface in perchloric acid solution. In both the absence and the presence of adsorbed CO, the Ru(0001) electrode shows the potential-dependent formation of well-defined and ordered oxygen-containing adlayers. At low potentials (e.g., from -80 to +200 mV vs Ag/AgCl), a (2 × 2)-O phase, which is unreactive toward CO oxidation, is formed, in agreement with UHV studies. Increasing the potential results in the formation of (3 × 1) and (1 × 1) phases at 410 and 1100 mV, respectively, with a concomitant increase in the reactivity of the surface toward CO oxidation. Both linear (CO ) and three-fold-hollow (CO ) binding CO adsorbates (bands at 2000-2040 and 1770-1800 cm , respectively) were observed on the Ru(0001) electrode. The in situ FTIR data show that the adsorbed CO species remain in compact islands as CO oxidation proceeds, suggesting that the oxidation occurs at the boundaries between the CO and O domains. At low CO coverages, reversible relaxation (at lower potentials) and compression (at higher potentials) of the CO adlayer were observed and rationalized in terms of the reduction and formation of surface O adlayers. The data obtained from the Ru(0001) electrode are in marked contrast to those observed on polycrystalline Ru, where only linear CO is observed.

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The structure of a Pt(111) electrode after treatment in an electrolyte and subsequent transfer to an UHV chamber was investigated ex situ by combined low energy electron diffraction (LEED), reflection high energy electron diffraction (RHEED), and Auger electron spectroscopy (AES). Treatment of the sample in a CO saturated 0.1 M HClO solution at potentials between -0.2 and 0.2 V versus Ag/AgCl caused a maximum CO coverage of about 0.75 as probed by cyclic voltammetry, which dropped by partial desorption to about 0.25 upon transfer to the UHV chamber. This adlayer exhibited a (distorted) 3×3 R30° pattern by RHEED (but not with LEED) exhibiting an average domain size of 2.3 nm at room temperature. This is identified with the same phase reported before from gas phase studies, as also corroborated by the similarities of the vibrational spectroscopic data. The same structure (albeit even more poorly ordered) was found after dissociative adsorption of methanol.