980 resultados para INP(110)


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A voltage-controlled ring oscillator (VCO) based on a full enhancement-mode InAIAs/InGaAs/InP high electron mobility transistor (HEMT) logic is proposed. An enhancement-mode HEMT (E-HEMT) is fabricated, whose threshold is demonstrated to be 10 mV. The model of the E-HEMT is established and used in the SPICE simulation of the VCO. The result proves that the full E-HEMT logic technology can be applied to the VCO. And compared with the HEMT DCFL technology, the complexity of our fabrication process is reduced and the reliability is improved.

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We have fabricated In_0.53Ga_0.47As/AlAs/InP resonant tunneling diodes (RTDs) based on the air-bridge technology by using electron beam lithography processing.The epitaxial layers of the RTD were grown on semi-insulating (100) InP substrates by molecular beam epitaxy.RTDs with a peak current density of 24.6 kA/cm~2 and a peak-to-valley current ratio of 8.6 at room temperature have been demonstrated.

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采用平面工艺制作的定向输出微腔半导体激光器是集成光学回路的理想光源.近十几年来,以微盘为代表的回音壁模式(whispering-gallery mode)微腔激光器引起人们很大的重视.但圆对称的微盘激光器缺乏定向的激光输出,人们往往利用输出波导与微盘实现消逝波耦合或通过改变微盘的对称性来实现定向输出.最近几年,多边形微腔如正三角形、正方形、长方形、六边形等多边形光学微腔也引起人们的重视.多边形光学微腔中也能有高Q值的类回音壁模式.而且由于不具有圆对称性,其模式特性有利于简单地实现定向光输出.

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A Geiger mode planar InGaAs/InP avalanche photodiode (APD) with a cascade peripheral junction structure to suppress edge breakdowns is designed by finite-element analysis. The photodiode breakdown voltage is reduced to 54.3V by controlling the central junction depth, while the electric field distribution along the device central axis is controlled by adjusting doping level and thickness of the lnP field control layer. Using a cascade junction structure at the periphery of the active area, premature edge breakdowns are effectively suppressed. The simulations show that the quadra-cascade structure is a good trade-off between suppression performance and fabrication complexity, with a reduced peak electric field of 5.2 × 10~5 kV/cm and a maximum hole ionization integral of 1. 201. Work presented in this paper provides an effective way to design high performance photon counting InGaAs/InP avalanche photodiodes.

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An InP-based one-dimensional photonic crystal quantum cascade laser is realized. With photo lithography instead of electron beam lithography and using inductively coupled plasma etching, four-period air-semiconductor couples are defined as Bragg reflectors at one end of the resonator. The spectral measurement at 80K shows the quasi-continuous-wave operation with the wavelength of 5.36μm for a 22μm-wide and 2mm-long epilayer-up bonded device.

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通过实验和理论计算,分析了InP/Si键合过程中,界面热应力的分布情况、影响键合结果的关键应力因素及退火温度的允许范围。分析结果表明,由剪切应力和晶片弯矩决定的界面正应力是晶片中心区域大面积键合失败的主要原因,为保证良好的键合质量,InP/Si键合退火温度应该在300~350℃范围内选取。具体实验验证表明,该理论计算值与实验结果相一致。最后,在300℃退火条件下,很好地实现了2inInP/Si晶片键合,红外图像显示,界面几乎没有空洞和裂隙存在,有效键合面积超过90%.

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We propose a fiber-to-waveguide coupler for side-illuminated p-i-n photodiodes to obtain high responsivity and low polarization dependence that is grown on InP substrate and is suitable for surface hybrid integration in low cost modules. The fiber-to-waveguide coupler is based on a diluted waveguide,which is composed of ten periods of undoped 120nm InP/80nm InGaAsP (1.05μm bandgap) multiple layers. Using the semi-vectorial three dimensional beam propagation method (BPM) with the central difference scheme,the coupling efficiency of fiber-to-waveguide under different conditions is simulated and studied,and the optimized conditions for fiber-to-waveguide coupling are obtained. For TE-like and TM-like modes,the calculated maximum coupling efficiency is higher than 94% and 92% ,respectively. The calculated polarization dependence is less than 0. ldB,showing good polarization independence.

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用Shubnikov-de Haas(SdH)振荡效应,研究了在1.4 K下不同量子阱宽度(10-35 nm)的InP基高电子迁移率晶体管材料的二维电子气特性.通过对纵向电阻SdH振荡的快速傅里叶变换分析,得到不同阱宽时量子阱中二维电子气各子带电子浓度和量子迁移率.研究发现,在Si掺杂浓度一定时,阱宽的改变对于量子阱中总的载流子浓度改变不大,但是随着阱宽的增加,阱中的电子从占据一个子带到占据两个子带,且第二子带上的载流子迁移率远大于第一子带迁移率.当量子阱宽度为20 nm时,处在第二子能级上的电子数与处在第一子能级上的电子数之比达到了最大值0.24.此时有最多的电子位于迁移率高的第二子能级,材料的迁移率也最大.此结果对于优化器件的设计有重要意义.

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采用键合技术在Si基上制备了InP-InGaAsP量子阱激光器,实现了电注入室温连续工作.采用低温直接键合的方法,将Si衬底和InP-InGaAsP外延片键合在一起,并制成条宽6μm的脊波导边发射激光器.室温连续工作的1.55μm激光器阈值电流为48mA,对应的阈值电流密度和微分电阻分别为2.13kA/cm~2和5.8Ω,在约220mA时输出光功率达15mW.

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对铁掺杂和高温退火非掺杂磷化铟制备的两种半绝缘材料的电学补偿和深能级缺陷进行了分析和比较.根据热激电流谱(TSC)测得的深能级缺陷结果,分析了这两种半绝缘InP材料中深能级缺陷对电学补偿的影响.在掺铁半绝缘InP材料中,由于存在高浓度的深能级缺陷参与电学补偿。降低了材料的补偿度和电学性能.相比之下,利用磷化饫气氛下高温退火非掺InP获得的半绝缘材料的深能级缺陷浓度很低,通过扩散掺入晶格的铁成为唯一的深受主补偿中心钉扎费米能级,材料表现出优异的电学性质.在此基础上给出了一个更为广泛的半绝缘InP材料的电学补偿模型.

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为实现基于InP/hGaAsP材料的二维光子晶体结构低损伤、高各向异性的干法刻蚀,研究了对InP材料基于C1_2,BCl_3气体的感应耦合等离子体刻蚀.从等离子体轰击使衬底升温的角度分析了刻蚀机理,发现离子轰击加热引起的侧蚀与物理溅射在侧壁再沉积之间处于平衡时可以得到高各向异性刻蚀,平衡点将随ICP功率增高而向偏压减小方向移动。从而在近203V偏压下得到陡直的侧壁.在优化气体组分后,成功实现了光于晶体结构高各向异性的低偏压刻蚀.

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InP基微光机电系统(MOEMS)可调谐器件的梁在实验中常出现弯曲变形的现象,其原因是在生长的时候,As原子进入InP梁,产生了内部梯度应力.使用有限元分析软件,建立了一种无须测量内部应力的模拟梁变形的方法.模拟了单臂梁和双臂梁的弯曲变形情况,理论与实验吻合.研究了As原子浓度和梁厚度对梁变形情况的影响,结果表明降低As原子浓度和增大梁厚度都有助于抑制梁的变形.

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研究了原生和高温退火处理后非掺n型和半绝缘InP单晶材料中产生的缺陷.在磷气氛下退火后,n型和半绝缘InP单晶中均明显产生相当数量的深能级缺陷,而在磷化铁气氛下退火后,InP的缺陷数量明显减少.在退火过程中缺陷的产生与磷和铁的内扩散有直接关系.向内扩散的磷原子和铁原子占据晶格中铟位后,分别产生反位缺陷和铁深受主.实验结果表明,铁通过扩散充分占据了铟位,抑制了铟空位、磷反位等缺陷的形成,而磷气氛下退火后产生的缺陷有铟空位、磷反位等.对InP中的缺陷属性进行了分析.

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比较了掺Fe和非掺退火半绝缘(SI)InP材料中Fe杂质的分布,掺杂激活机理以及Fe原子与点缺陷的相互作用.原生掺Fe SI-InP中Fe的替位激活主要通过填隙-跳跃机制,但Fe原子易在位错周围聚集,与空位形成复合体缺陷,占据填隙位等,从而降低Fe的激活效率.在FeP2气氛下退火非掺InP获得的SI-InP材料中,Fe原子的激活主要通过扩散过程的"踢出-替位"机制.退火前材料中存在的In空位使Fe原子通过扩散充分占据In位,同时抑制了材料中深能级缺陷的形成.因此,这种SI-InP材料的Fe激活效率高、电学性能好.

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采用表面微机械技术制作了一种1310 nm基于InP/空气隙分布布拉格反射镜的微机械可调谐Fabry-Perot光滤波器.该滤波器的通光孔直径约为70 μm,在1.4 V的调谐电压下,调谐范围达到15 nm.并采用光学传输矩阵方法,分析了斜入射对这种可调谐光滤波器透射谱的峰值半高宽的影响.