LPCVD Growth of 3C-SiC on Si Mesas and SiO2/Si Substrates for MEMS Applications

This paper presents the development of LPCVD growth of 3C-SiC thin films grown on Si mesas and thermally oxidized SiO2 masks over Si with an area of 150 × 100μm^2 and SiO2/Si substrates. The growth has been performed via chemical vapor deposition using SiH4 and C2H4 precursor gases with carrier gas of H2. 3C-SiC films on these substrates were characterized by optical microscopy, X-ray diffraction （ XRD ）, X-ray photoelectron spectroscopy （ XPS ）, scanning electron microscopy （SEM） and room temperature Hall effect measurements. It is shown that there were no voids at the interface between 3C-SiC and SiO2.

16×0．8nm Si基SiO2阵列波导光栅设计、制备及测试

叙述了一个完整的16通道硅基二氧化硅阵列波导光栅(AWG)的设计、制备及测试过程。通道间隔为0．8nm(100GHz)，解复用器的插入损耗为16．8dB，其中材料损耗为11．95dB，相邻通道串扰小于一17dB，通道插损非均匀性小于2．2dB。

p型纳米硅与a-Si∶H不锈钢底衬nip太阳电池

报道了选用厚度为0．05mm的不锈钢箔作衬底，B掺杂P型氢化纳米硅作窗口层，制备成功开路电压和填充因子分别达到0．90V和0．70的nip非晶硅基薄膜单结太阳电池．UV-VIS透射谱和微区Raman谱证实所用p层具有典型氢化纳米硅的宽能隙和含有硅结晶颗粒的微结构特征．明确指出导致这种氢化纳米硅能隙展宽的物理机制是量子尺寸效应．

SiO2/Si波导应力双折射数值分析

采用有限元法对SiO2/Si掩埋光波导制备工艺中的应力变化进行了系统的分析,在此基础上,应用有限差分束传播法(FDBPM)对应力光波导的双折射进行了计算.结果表明上包层的玻璃化过程是SiO2/Si波导形成水平方向和垂直方向应力差的主要原因,相应的应力双折射系数B在10-4量级.进一步的分析表明上包层B,P重掺杂可明显减小波导的双折射系数.

Sensitivity of Total-Dose Radiation Hardness of SIMOX Buried Oxides to Doses of Nitrogen Implantation into Buried Oxides

In order to improve the total-dose radiation hardness of the buried oxides(BOX) in the structure of separa tion-by-implanted-oxygen(SIMOX) silicon-on-insulator(SOI), nitrogen ions are implanted into the buried oxides with two different doses,2 × 1015 and 3 × 1015 cm-2 , respectively. The experimental results show that the radiation hardness of the buried oxides is very sensitive to the doses of nitrogen implantation for a lower dose of irradiation with a Co-60 source. Despite the small difference between the doses of nitrogen implantation, the nitrogen-implanted 2 × 1015 cm-2 BOX has a much higher hardness than the control sample (i. e. the buried oxide without receiving nitrogen implantation) for a total-dose irradiation of 5 × 104rad(Si), whereas the nitrogen-implanted 3 × 1015 cm-2 BOX has a lower hardness than the control sample. However,this sensitivity of radiation hardness to the doses of nitrogen implantation reduces with the increasing total-dose of irradiation (from 5 × 104 to 5 × 105 rad (Si)). The radiation hardness of BOX is characterized by MOS high-frequency (HF) capacitance-voltage (C-V) technique after the top silicon layers are removed. In addition, the abnormal HF C-V curve of the metal-silicon-BOX-silicon(MSOS) structure is observed and explained.

用于光网络通信的Si基光子集成器件的研究

报导了可用于光网络系统终端OADM和OXC的Si基长波长量子阱窄带响应光电接收器，MOEMS和F-P TO宽频域光学滤波器，M—Z型TO光开关和MMI多路分束器以及可变光强衰减器．用应变层SiGe/Si MQW研制的RCE光电接收器响应谱半宽FWHM<6mm，外量子效率η>4．2％；采用表面微机械加工的桥式光学滤波器，当外加电压0→50V，连续可调谐范围达90nm；采用全平面工艺研制的F-P腔TO滤波器，当外加电流0→57mA时，连续可调谐范围达23nm，FWHM<0．5nm．在SOI Si基片上研制的M—ZTO波导光开关，开关时间<30μs，功耗～100mW．开关消光比-13dB和-10dB，1×4MMI多路分束器输出光场的不均衡性<0．36dB，总插入损耗6．9dB．用背向对接的MMI构成的M-Z干涉仪实现了光强的可变调最大衰减量26dB，响应时间100μs，插入损耗4．8～7dB．

(p)nc-Si:H/(n)c-Si异质结变容二极管

采用等离子体增强化学气相沉积技术和电子束蒸发技术制备了一种新型的线性缓变异质结变容二极管--Au/Cr合金(电极)/multi-layer(p)nc-Si:H/(n)c-Si/(电极)Au/Ge合金结构.I-V,C-V,G-f以及DLTS的测试结果表明:其电容变化系数远大于单晶硅线性缓变异质结的电容变化系数,正向导电机制符合隧穿辅助辐射-复合模型,这是nc-Si:H层中nc-Si晶粒的量子效应所致;反向电流主要由异质结中空间电荷区的产生电流决定,且反向漏电流小,反向击穿电压高,表现出较好的整流特性.

纳米非晶硅(na-Si:H)P-i-n太阳电池

该文报道了通过适当氢稀释(RH=15)和合适的衬底温度(Ts=170℃)下,用PECVD制备得到的宽带隙氢化纳米非晶硅(na-Si:H)薄膜,并将其用作pin太阳电池的本征层.经过电池结构和工艺条件的优化设计,在p/i,i/n界面插入渐变带隙缓冲层,制备出了glass/ITO/p-a-SiC:H/i-na-Si:H/n-nc-Si:H/Al结构的pin太阳电池.电池初始开路电压(Voc)高达0.94V,同时还能保证0.72的填充因子(FF).光电转换效率(Eff)达到8.35%(AM1.5,100mW/cm2).