An automatic step adjustment method for average power analysis technique used in fiber amplifiers

An automatic step adjustment (ASA) method for average power analysis (APA) technique used in fiber amplifiers is proposed in this paper for the first time. In comparison with the traditional APA technique, the proposed method has suggested two unique merits such as a higher order accuracy and an ASA mechanism, so that it can significantly shorten the computing time and improve the solution accuracy. A test example demonstrates that, by comparing to the APA technique, the proposed method increases the computing speed by more than a hundredfold under the same errors. By computing the model equations of erbium-doped fiber amplifiers, the numerical results show that our method can improve the solution accuracy by over two orders of magnitude at the same amplifying section number. The proposed method has the capacity to rapidly and effectively compute the model equations of fiber Raman amplifiers and semiconductor lasers. (c) 2006 Optical Society of America

Fast calculation technique for scattering in T-matrix method

In scattering calculations using the T-matrix method, the calculation of the T-matrix involves multiplication and inversion of matrices. These two types of matrix operations are time-consuming, especially for the matrices with large size. Petrov et al. [D. Petrov, Y. Shkuratov, G. Videen, Opt. Lett. 32 (2007) 1168] proposed an optimized matrix inversion technique, which suggests the inversion of two matrices, each of which contains half the number of rows. This technique reduces time-consumption significantly. On the basis of this approach, we propose another fast calculation technique for scattering in the T-matrix method, which obtains the scattered fields through carrying out only the operations between matrices and the incident field coefficient. Numerical results show that this technique can decrease time-consumption by more than half that of the optimized matrix inversion technique by Petrov et al. (c) 2008 Elsevier B.V. All rights reserved.

Real-time non-destructive testing of dynamic holograms in doubly-doped LiNbO3 crystals using phase-conjugate technique

Nankai University

高抗冲聚苯硫醚（PPS）的研究；PC/PBA-cs-PMMA共混体系的研究

聚苯硫醚（PPS）是特种工程塑料中应用最广、价格最低的品种。但由于其耐冲击性差，限制了其做为结构材料的应用。本论文通过多种研究方法，研究了PPS抗冲击性差的根本原因和改善途径，从改变其聚集态结构入手，使韧性得到了很大改善，为高抗冲PPS的研制提供和积累了丰富了可靠的数据，其创新性成果体现在：提出了含刚性非晶相、可动（类液）非晶相和晶相的PPS三相模型并计算了各相的相对含量、测定了各相的密度；发现了PPS的冲击强度与其结晶度呈近似线性的关系。是十分有意义的基础性工作。用核壳乳液聚合物做为PC的增韧剂，有效地控制了共混物的形态结构、计算出了界面层厚度与界面张力，为制备具有综合性能的改性PC材料奠定了理论和实践基础。

ELECTRONIC-STRUCTURES OF THE ALKALI-CONTAINING BUCKMINSTERFULLERENES (A-DELTA-C60) (A=LI,NA,K,RB,CS) AND THE HALOGEN-CONTAINING BUCKMINSTERFULLERENES (H-DELTA-C60) (H=F,CL,BR,I)

The geometrical parameters and electronic structures of C60, (A partial derivative C60) (A = Li, Na, K, Rb, Cs) and (H partial derivative C60) (H = F, Cl, Br, I) have been calculated by the EHMO/ASED (atom superposition and electron delocalization) method. When putting a central atom into the C60 cage, the frontier and subfrontier orbitals of (A partial derivative C60) (A = Li, Na, K, Rb, Cs) and (H partial derivative C60) (H = F, Cl) relative to those of C60 undergo little change and thus, from the viewpoint of charge transfer, A (A = Li, Na, K, Rb, Cs) and H (H = F, Cl) are simply electron donors and acceptors for the C60 cage resPeCtively. Br is an electron acceptor but it does influence the frontier and subfrontier MOs for the C60 cage, and although there is no charge transfer between I and the C60 cage, the frontier and subfrontier MOs for the C60 cage are obviously influenced by I. The stabilities DELTAE(X) (DELTAE(X) = (E(X) + E(C60)) - E(x partial derivative C60)) follow the sequence I < Br < None < Cl < F < Li < Na < K < Rb < Cs while the cage radii r follow the inverse sequence. The stability order and the cage radii order have been explained by means of the (exp-6-1) potential.

DELINEATION OF DEFECTS IN SIMOX STRUCTURES USING A CHEMICAL ETCHING TECHNIQUE

Residual defects in the overlayer of fully annealed SIMOX material have been studied by means of a chemical etching technique. The etching procedure has been calibrated and an optimum recipe is reported. Observations using optical microscopy and transmission electron microscopy have been used to quantify the defect densities and good agreement between the two techniques has been established, confirming that the optimised chemical etching process can be used with confidence to determine the dislocation density for values < 10(7) cm-2.

METASTABLE DEFECT IN AMORPHOUS-SILICON SOLAR-CELLS INVESTIGATED BY JUNCTION RECOVERY TECHNIQUE

The effect of metastable defects caused by light soaking and carrier injection on the transport of carriers in undoped a-Si:H has been investigated by a junction recovery technique. The experiments show that after light soaking or carrier injection the product of mu-p-tau-p decreases, but no detectable change in the distribution of shallow valence band tail states was found.

Lapping technique of InP single crystal wafer

The wafer processing of Indium Phosphide (InP) is so important that it is getting more and more attentions. Lapping is a basic step just following the ingot cutting. In this paper, the influences of various processing parameters on the lapped wafer quality and lapping rate have been checked, the double-crystal X-ray diffraction results about lapped wafers also were presented here. According to the experimental results, the optimum lapping conditions have been obtained.

ALKALINE POLISHING OF INP USING DOUBLE-POURING TECHNIQUE

于2010-11-17批量导入

A STUDY OF THE COMPOSITION DISTRIBUTION AT THE TI/AL2O3 INTERFACE USING THE MCS(+)-SIMS TECHNIQUE

In this article, the MCs(+)-SIMS technique has been used to characterize Ti/Al2O3 metal/insulator interfaces. Our experiment shows that by detecting MCs(+) secondary ions, the matrix and interface effects are reduced, and good depth profiles have been obtained. The experimental result also shows that with the increase of the annealing temperature (RT, 300 degrees C, 600 degrees C, 850 degrees C), the interface gets broadened gradually, indicating diffusion and reaction take place at the interface, and the interface reaction is enhanced with the increase in annealing temperature. When the temperature increases, the AlCs+ signal forms two plateaus in the Ti layer, indicating Al from the decomposition of Al2O3 diffuses into the Ti layer and exists as two new forms (phases). Also, with the increase of the annealing temperature, oxygen diffuses into the Ti layer gradually, and makes the O signal in the Ti layer increase significantly in the 850 degrees C annealed sample.