Ni基电极淀积前后表面处理对p-GaN欧姆接触的影响

在p-GaN上蒸发Ni/Au电极前,采用王水、HCl、缓冲HF进行前表面处理,O_2气氛下退火后,比较各电极样品的I-V特性和表面形貌.结果显示无表面处理时接触电阻最小,且溶剂处理后残留的电解质会影响电极的电流特性和稳定性.用俄歇电子能谱(AES)测试不同元素随深度分布情况,发现高温退火过程中NiO的形成有自动清洁p-GaN表面的作用,因此对于Ni基电极前表面处理不是必需的.再将样品用10%草酸溶液处理,其I-V特性显示接触电阻率明显下降;X射线光电子能谱(XPS)测试显示草酸溶液处理后电极表面Ni含量显著减少,而Au元素信号峰增强,说明表面高阻P型NiO被有效除去,对改善接触性能具有实际意义.

NiO removal of Ni/Au Ohmic contact to p-GaN after annealing

The Ni/Au contact was treated with oxalic acid after annealing in O_2 ambient, and its I-V characteristic showed the property of contact has been obviously improved. An Auger electron spectroscopy (AES) depth pro-file of the contact as-annealed showed that the top layer was highly resistive NiO, while an X-ray photo-electron spectroscopy (XPS) of oxalic acid treated samples indicated that the NiO has been removed effectively. A scanning electron microscope (SEM) was used to observe the surface morphology of the contacts, and it was found that the lacunaris surface right after annealing became quite smooth with lots of small Au exposed areas after oxalic acid treatment. When the test probe or the subsequently deposited Ti/Au was directly in contact with these small Au areas, they worked as low resistive current paths and thus decrease the specific contact resistance.

Ni?莫来石界面反应的XPS研究

国家自然科学基金

Pt-Ni/p-InP低阻欧姆接触的机理研究

利用X射线衍射和AES(俄歇)方法，深入地研究了RF磁探溅射淀积的Pt-Ni/p-InP(100)非合金膜系在热退火过程中Pt和Ni与衬底InP中的In和P形成稳定化合物的行为，揭示了比接触电阻降低于3×10~(-6)Ω·cm~2的根本原因。

Ni＋注入n-GaP DLTS谱中Ni杂质能级的识别

在不同条件下退火的Ni~+注入n-GaP DLTS谱中观测到表观激活能在0.60～0.70eV范围内的多个多子峰和少子峰。对各样品掺杂层内的能带弯曲及Ni杂质各荷电状态浓度空间分布在DLTS测量的零偏-反偏过程中的变化进行了计算。结合分析实测各能级热发射率数据,对其中起源于Ni_(Ga)中心的DLTS峰作出了判断。

Ni/Si,Pt/Si,Ir/Si系的As离子注入和退火

于2010-11-23批量导入