High-Performance WSe2 CMOS Technology and Integrated Circuits.

Because of their extraordinary structural and electrical properties, two dimensional materials are currently being pursued for applications such as thin-film transistors and integrated circuit. One of the main challenges that still needs to be overcome for these applications is the fabrication of air-stable transistors with industry-compatible complementary metal oxide semiconductor (CMOS) technology. In this work, we experimentally demonstrate a novel high performance air-stable WSe2 CMOS technology with almost ideal voltage transfer characteristic, full logic swing and high noise margin with different supply voltages. More importantly, the inverter shows large voltage gain (~38) and small static power (Pico-Watts), paving the way for low power electronic system in 2D materials.

Security through Obscurity: Layout Obfuscation of Digital Integrated Circuits using Don't Care Conditions

Contemporary integrated circuits are designed and manufactured in a globalized environment leading to concerns of piracy, overproduction and counterfeiting. One class of techniques to combat these threats is circuit obfuscation which seeks to modify the gate-level (or structural) description of a circuit without affecting its functionality in order to increase the complexity and cost of reverse engineering. Most of the existing circuit obfuscation methods are based on the insertion of additional logic (called “key gates”) or camouflaging existing gates in order to make it difficult for a malicious user to get the complete layout information without extensive computations to determine key-gate values. However, when the netlist or the circuit layout, although camouflaged, is available to the attacker, he/she can use advanced logic analysis and circuit simulation tools and Boolean SAT solvers to reveal the unknown gate-level information without exhaustively trying all the input vectors, thus bringing down the complexity of reverse engineering. To counter this problem, some ‘provably secure’ logic encryption algorithms that emphasize methodical selection of camouflaged gates have been proposed previously in literature [1,2,3]. The contribution of this paper is the creation and simulation of a new layout obfuscation method that uses don't care conditions. We also present proof-of-concept of a new functional or logic obfuscation technique that not only conceals, but modifies the circuit functionality in addition to the gate-level description, and can be implemented automatically during the design process. Our layout obfuscation technique utilizes don’t care conditions (namely, Observability and Satisfiability Don’t Cares) inherent in the circuit to camouflage selected gates and modify sub-circuit functionality while meeting the overall circuit specification. Here, camouflaging or obfuscating a gate means replacing the candidate gate by a 4X1 Multiplexer which can be configured to perform all possible 2-input/ 1-output functions as proposed by Bao et al. [4]. It is important to emphasize that our approach not only obfuscates but alters sub-circuit level functionality in an attempt to make IP piracy difficult. The choice of gates to obfuscate determines the effort required to reverse engineer or brute force the design. As such, we propose a method of camouflaged gate selection based on the intersection of output logic cones. By choosing these candidate gates methodically, the complexity of reverse engineering can be made exponential, thus making it computationally very expensive to determine the true circuit functionality. We propose several heuristic algorithms to maximize the RE complexity based on don’t care based obfuscation and methodical gate selection. Thus, the goal of protecting the design IP from malicious end-users is achieved. It also makes it significantly harder for rogue elements in the supply chain to use, copy or replicate the same design with a different logic. We analyze the reverse engineering complexity by applying our obfuscation algorithm on ISCAS-85 benchmarks. Our experimental results indicate that significant reverse engineering complexity can be achieved at minimal design overhead (average area overhead for the proposed layout obfuscation methods is 5.51% and average delay overhead is about 7.732%). We discuss the strengths and limitations of our approach and suggest directions that may lead to improved logic encryption algorithms in the future. References: [1] R. Chakraborty and S. Bhunia, “HARPOON: An Obfuscation-Based SoC Design Methodology for Hardware Protection,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 28, no. 10, pp. 1493–1502, 2009. [2] J. A. Roy, F. Koushanfar, and I. L. Markov, “EPIC: Ending Piracy of Integrated Circuits,” in 2008 Design, Automation and Test in Europe, 2008, pp. 1069–1074. [3] J. Rajendran, M. Sam, O. Sinanoglu, and R. Karri, “Security Analysis of Integrated Circuit Camouflaging,” ACM Conference on Computer Communications and Security, 2013. [4] Bao Liu, Wang, B., "Embedded reconfigurable logic for ASIC design obfuscation against supply chain attacks,"Design, Automation and Test in Europe Conference and Exhibition (DATE), 2014 , vol., no., pp.1,6, 24-28 March 2014.

An algorithm for the inclusion of RC compact models of packages into board level thermal simulation tools

International audience

Direct Write Fabrication of Waveguides and Interconnects for Optical Printed Wiring Boards

Current copper based circuit technology is becoming a limiting factor in high speed data transfer applications as processors are improving at a faster rate than are developments to increase on board data transfer. One solution is to utilize optical waveguide technology to overcome these bandwidth and loss restrictions. The use of this technology virtually eliminates the heat and cross-talk loss seen in copper circuitry, while also operating at a higher bandwidth. Transitioning current fabrication techniques from small scale laboratory environments to large scale manufacturing presents significant challenges. Optical-to-electrical connections and out-of-plane coupling are significant hurdles in the advancement of optical interconnects. The main goals of this research are the development of direct write material deposition and patterning tools for the fabrication of waveguide systems on large substrates, and the development of out-of-plane coupler components compatible with standard fiber optic cabling. Combining these elements with standard printed circuit boards allows for the fabrication of fully functional optical-electrical-printed-wiring-boards (OEPWBs). A direct dispense tool was designed, assembled, and characterized for the repeatable dispensing of blanket waveguide layers over a range of thicknesses (25-225 µm), eliminating waste material and affording the ability to utilize large substrates. This tool was used to directly dispense multimode waveguide cores which required no UV definition or development. These cores had circular cross sections and were comparable in optical performance to lithographically fabricated square waveguides. Laser direct writing is a non-contact process that allows for the dynamic UV patterning of waveguide material on large substrates, eliminating the need for high resolution masks. A laser direct write tool was designed, assembled, and characterized for direct write patterning waveguides that were comparable in quality to those produced using standard lithographic practices (0.047 dB/cm loss for laser written waveguides compared to 0.043 dB/cm for lithographic waveguides). Straight waveguides, and waveguide turns were patterned at multimode and single mode sizes, and the process was characterized and documented. Support structures such as angled reflectors and vertical posts were produced, showing the versatility of the laser direct write tool. Commercially available components were implanted into the optical layer for out-of-plane routing of the optical signals. These devices featured spherical lenses on the input and output sides of a total internal reflection (TIR) mirror, as well as alignment pins compatible with standard MT design. Fully functional OEPWBs were fabricated featuring input and output out-of-plane optical signal routing with total optical losses not exceeding 10 dB. These prototypes survived thermal cycling (-40°C to 85°C) and humidity exposure (95±4% humidity), showing minimal degradation in optical performance. Operational failure occurred after environmental aging life testing at 110°C for 216 hours.

A Functional Verification Methodology Based on Parameter Domains for Efficient Input Stimuli Generation and Coverage Modeling

Modern Integrated Circuit (IC) design is characterized by a strong trend of Intellectual Property (IP) core integration into complex system-on-chip (SOC) architectures. These cores require thorough verification of their functionality to avoid erroneous behavior in the final device. Formal verification methods are capable of detecting any design bug. However, due to state explosion, their use remains limited to small circuits. Alternatively, simulation-based verification can explore hardware descriptions of any size, although the corresponding stimulus generation, as well as functional coverage definition, must be carefully planned to guarantee its efficacy. In general, static input space optimization methodologies have shown better efficiency and results than, for instance, Coverage Directed Verification (CDV) techniques, although they act on different facets of the monitored system and are not exclusive. This work presents a constrained-random simulation-based functional verification methodology where, on the basis of the Parameter Domains (PD) formalism, irrelevant and invalid test case scenarios are removed from the input space. To this purpose, a tool to automatically generate PD-based stimuli sources was developed. Additionally, we have developed a second tool to generate functional coverage models that fit exactly to the PD-based input space. Both the input stimuli and coverage model enhancements, resulted in a notable testbench efficiency increase, if compared to testbenches with traditional stimulation and coverage scenarios: 22% simulation time reduction when generating stimuli with our PD-based stimuli sources (still with a conventional coverage model), and 56% simulation time reduction when combining our stimuli sources with their corresponding, automatically generated, coverage models.

Micropatterning of single-walled carbon nanotube forest

In this work, high-aligned single-walled carbon nanotube (SWCNT) forest have been grown using a high-density plasma chemical vapor deposition technique (at room temperature) and patterned into micro-structures by photolithographic techniques, that are commonly used for silicon integrated circuit fabrication. The SWCNTs were obtained using pure methane plasma and iron as precursor material (seed). For the growth carbon SWCNT forest the process pressure was 15 mTorr, the RF power was 250W and the total time of the deposition process was 3 h. The micropatterning processes of the SWCNT forest included conventional photolithography and magnetron sputtering for growing an iron layer (precursor material). In this situation, the iron layer is patterned and high-aligned SWCNTs are grown in the where iron is present, and DLC is formed in the regions where the iron precursor is not present. The results can be proven by Scanning Electronic Microscopy and Raman Spectroscopy. Thus, it is possible to fabricate SWCNT forest-based electronic and optoelectronic devices. (C) 2010 Elsevier B.V. All rights reserved.

The effects of silica fillers on the gelation and vitrification of highly filled epoxy-amine thermosets

Highly filled thermosets are used in applications such as integrated circuit (IC) packaging. However, a detailed understanding of the effects of the fillers on the macroscopic cure properties is limited by the complex cure of such systems. This work systematically quantifies the effects of filler content on the kinetics, gelation and vitrification of a model silica-filled epoxy/amine system in order to begin to understand the role of the filler in IC packaging cure. At high cure temperatures (100 degreesC and above) there appears to be no effect of fillers on cure kinetics and gelation and vitrification times. However, a decrease in the gelation and vitrification times and increase the reaction rate is seen with increasing filler content at low cure temperatures (60-90 degreesC). An explanation for these results is given in terms of catalysation of the epoxy amine reaction by hydrogen donor species present on the silica surface and interfacial effects.

Application of Gage R&R methodology for improving the training and evaluation of automatic optical inspection machine operators

The current level of demand by customers in the electronics industry requires the production of parts with an extremely high level of reliability and quality to ensure complete confidence on the end customer. Automatic Optical Inspection (AOI) machines have an important role in the monitoring and detection of errors during the manufacturing process for printed circuit boards. These machines present images of products with probable assembly mistakes to an operator and him decide whether the product has a real defect or if in turn this was an automated false detection. Operator training is an important aspect for obtaining a lower rate of evaluation failure by the operator and consequently a lower rate of actual defects that slip through to the following processes. The Gage R&R methodology for attributes is part of a Six Sigma strategy to examine the repeatability and reproducibility of an evaluation system, thus giving important feedback on the suitability of each operator in classifying defects. This methodology was already applied in several industry sectors and services at different processes, with excellent results in the evaluation of subjective parameters. An application for training operators of AOI machines was developed, in order to be able to check their fitness and improve future evaluation performance. This application will provide a better understanding of the specific training needs for each operator, and also to accompany the evolution of the training program for new components which in turn present additional new difficulties for the operator evaluation. The use of this application will contribute to reduce the number of defects misclassified by the operators that are passed on to the following steps in the productive process. This defect reduction will also contribute to the continuous improvement of the operator evaluation performance, which is seen as a quality management goal.

Projecto e implementação de um sistema de alimentação para um transformador de alta tensão

Neste trabalho pretende-se estudar, dimensionar e implementar experimentalmente de um sistema de alimentação para transformadores de alta tensão a alta frequência. Este sistema será constituído por dois elementos principais, um rectificador monofásico em ponte totalmente controlado e por um inversor de tensão. Inicialmente realizou-se um estudo sobre as diferentes topologias possíveis para o rectificador considerando diferentes tipos de carga. Realizou-se, também, um estudo sobre o circuito de geração dos impulsos de disparo dos tiristores, executado com base num circuito integrado TCA 785, dimensionou-se os elementos constituintes do circuito de disparo, e de um sistema de controlo da tensão de saída do rectificador. Posteriormente estudou-se o funcionamento do inversor de tensão, definindo-se os modos de operação e dimensionou-se um circuito ressonante tendo em conta os parâmetros construtivos do transformador que se pretende utilizar. Finalmente procedeu-se à implementação prática dos sistemas previamente dimensionados e simulados e à apresentação dos respectivos resultados.

Projecto de um conversor redutor CC-CC comutado para SoC

A evolução da tecnologia CMOS tem possibilitado uma maior densidade de integração de circuitos tornando possível o aumento da complexidade dos sistemas. No entanto, a integração de circuitos de gestão de potência continua ainda em estudo devido à dificuldade de integrar todos os componentes. Esta solução apresenta elevadas vantagens, especialmente em aplicações electrónicas portáteis alimentadas a baterias, onde a autonomia é das principais características. No âmbito dos conversores redutores existem várias topologias de circuitos que são estudadas na área de integração. Na categoria dos conversores lineares utiliza-se o LDO (Low Dropout Regulator), apresentando no entanto baixa eficiência para relações de conversão elevadas. Os conversores comutados são elaborados através do recurso a circuitos de comutação abrupta, em que a eficiência deste tipo de conversores não depende do rácio de transformação entre a tensão de entrada e a de saída. A diminuição física dos processos CMOS tem como consequência a redução da tensão máxima que os transístores suportam, impondo o estudo de soluções tolerantes a “altatensão”, com o intuito de manter compatibilidade com tensões superiores que existam na placa onde o circuito é incluído. Os sistemas de gestão de energia são os primeiros a acompanhar esta evolução, tendo de estar aptos a fornecer a tensão que os restantes circuitos requerem. Neste trabalho é abordada uma metodologia de projecto para conversores redutores CCCC comutados em tecnologia CMOS, tendo-se maximizado a frequência com vista à integração dos componentes de filtragem em circuito integrado. A metodologia incide sobre a optimização das perdas totais inerentes à comutação e condução, dos transístores de potência e respectivos circuitos auxiliares. É apresentada uma nova metodologia para o desenvolvimento de conversores tolerantes a “alta-tensão”.

Acesso remoto via infra-estrutura de teste IEEE1149.1 a dispositivos lógicos programáveis

Actualmente verifica-se que a complexidade dos sistemas informáticos tem vindo a aumentar, fazendo parte das nossas ferramentas diárias de trabalho a utilização de sistemas informáticos e a utilização de serviços online. Neste âmbito, a internet obtém um papel de destaque junto das universidades, ao permitir que alunos e professores possam interagir mais facilmente. A internet e a educação baseada na Web vêm oferecer acesso remoto a qualquer informação independentemente da localização ou da hora. Como consequência, qualquer pessoa com uma ligação à internet, ao poder adquirir informações sobre um determinado tema junto dos maiores peritos, obtém vantagens significativas. Os laboratórios remotos são uma solução muito valorizada no que toca a interligar tecnologia e recursos humanos em ambientes que podem estar afastados no tempo ou no espaço. A criação deste tipo de laboratórios e a sua utilidade real só é possível porque as tecnologias de comunicação emergentes têm contribuído de uma forma muito relevante para melhorar a sua disponibilização à distância. A necessidade de criação de laboratórios remotos torna-se imprescindível para pesquisas relacionadas com engenharia que envolvam a utilização de recursos escassos ou de grandes dimensões. Apoiado neste conceito, desenvolveu-se um laboratório remoto para os alunos de engenharia que precisam de testar circuitos digitais numa carta de desenvolvimento de hardware configurável, permitindo a utilização deste recurso de uma forma mais eficiente. O trabalho consistiu na criação de um laboratório remoto de baixo custo, com base em linguagens de programação open source, sendo utilizado como unidade de processamento um router da ASUS com o firmware OpenWrt. Este firmware é uma distribuição Linux para sistemas embutidos. Este laboratório remoto permite o teste dos circuitos digitais numa carta de desenvolvimento de hardware configurável em tempo real, utilizando a interface JTAG. O laboratório desenvolvido tem a particularidade de ter como unidade de processamento um router. A utilização do router como servidor é uma solução muito pouco usual na implementação de laboratórios remotos. Este router, quando comparado com um computador normal, apresenta uma capacidade de processamento e memória muito inferior, embora os testes efectuados provassem que apresenta um desempenho muito adequado às expectativas.

Oxidative Leaching of metals from electronic waste with solutions based on quaternary ammonium salts

The treatment of electric and electronic waste (WEEE) is a problem which receives ever more attention. An inadequate treatment results in harmful products ending up in the environment. This project intends to investigate the possibilities of an alternative route for recycling of metals from printed circuit boards (PCBs) obtained from rejected computers. The process is based on aqueous solutions composed of an etchant, either 0.2 M CuCl2.2H2O or 0.2 M FeCl3.6H2O, and a quaternary ammonium salt (quat) such as choline chloride or chlormequat. These solutions are reminiscent of deep eutectic solvents (DES) based on quats. DES are quite similar to ionic liquids (ILs) and are used as well as alternative solvents with a great diversity of physical properties, making them attractive for replacement of hazardous, volatile solvents (e.g. VOCs). A remarkable difference between genuine DES and ILs with the solutions used in this project is the addition of rather large quantities of water. It is shown the presence of water has a lot of advantages on the leaching of metals, while the properties typical for DES still remain. The oxidizing capacities of Cu(II) stem from the existence of a stable Cu(I) component in quat based DES and thus the leaching stems from the activity of the Cu(II)/Cu(I) redox couple. The advantage of Fe(III) in combination with DES is the fact that the Fe(III)/Fe(II) redox couple becomes reversible, which is not true in pure water. This opens perspectives for regeneration of the etching solution. In this project the leaching of copper was studied as a function of gradual increasing water content from 0 - 100w% with the same concentration of copper chloride or iron(III) chloride at room temperature and 80ºC. The solutions were also tested on real PCBs. At room temperature a maximum leaching effect for copper was obtained with 30w% choline chloride with 0.2 M CuCl2.2H2O. The leaching effect is still stronger at 80°C, b ut of course these solutions are more energy consuming. For aluminium, tin, zinc and lead, the leaching was faster at 80ºC. Iron and nickel dissolved easily at room temperature. The solutions were not able to dissolve gold, silver, rhodium and platinum.

Melhoria da eficiência de amplificadores de potência para sinais RF com envolvente variável

Trabalho Final de Mestrado para obtenção do grau de Mestre em Engenharia Electrónica e Telecomunicações

Design and evaluation of multi-band RF energy harvesting circuits and antennas for WSNs

Radio frequency (RF) energy harvesting is an emerging technology that will enable to drive the next generation of wireless sensor networks (WSNs) without the need of using batteries. In this paper, we present RF energy harvesting circuits specifically developed for GSM bands (900/1800) and a wearable dual-band antenna suitable for possible implementation within clothes for body worn applications. Besides, we address the development and experimental characterization of three different prototypes of a five-stage Dickson voltage multiplier (with match impedance circuit) responsible for harvesting the RF energy. Different printed circuit board (PCB) fabrication techniques to produce the prototypes result in different values of conversion efficiency. Therefore, we conclude that if the PCB fabrication is achieved by means of a rigorous control in the photo-positive method and chemical bath procedure applied to the PCB it allows for attaining better values for the conversion efficiency. All three prototypes (1, 2 and 3) can power supply the IRIS sensor node for RF received powers of -4 dBm, -6 dBm and -5 dBm, and conversion efficiencies of 20, 32 and 26%, respectively. © 2014 IEEE.

Trends Of CPU, GPU and FPGA for high-performance computing

Floating-point computing with more than one TFLOP of peak performance is already a reality in recent Field-Programmable Gate Arrays (FPGA). General-Purpose Graphics Processing Units (GPGPU) and recent many-core CPUs have also taken advantage of the recent technological innovations in integrated circuit (IC) design and had also dramatically improved their peak performances. In this paper, we compare the trends of these computing architectures for high-performance computing and survey these platforms in the execution of algorithms belonging to different scientific application domains. Trends in peak performance, power consumption and sustained performances, for particular applications, show that FPGAs are increasing the gap to GPUs and many-core CPUs moving them away from high-performance computing with intensive floating-point calculations. FPGAs become competitive for custom floating-point or fixed-point representations, for smaller input sizes of certain algorithms, for combinational logic problems and parallel map-reduce problems. © 2014 Technical University of Munich (TUM).