An algorithm for the inclusion of RC compact models of packages into board level thermal simulation tools
| Contribuinte(s) |
Technical University of Budapest ; Un iversity of Budapest Techniques of Informatics and Microelectronics for integrated systems Architecture (TIMA) ; Université Joseph Fourier - Grenoble 1 (UJF) - Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP) - Institut National Polytechnique de Grenoble (INPG) - Centre National de la Recherche Scientifique (CNRS) - Université Grenoble Alpes (UGA) |
|---|---|
| Cobertura |
San Juan, Puerto Rico, United States |
| Data(s) |
22/04/2002
|
| Resumo |
International audience The paper presents an algorithm for the co-simulation of packages, given with the RC compact models, and the printed circuit boards. This enables beyond the correct detailed consideration of the heat transfer in the board the calculation of the exact junction temperatures within the packages. Considering individual heat transfer coefficients for each package, or even to each side of the packages, depending on the compact models, is possible. The main advantage is that the methodology keeps the exreme fastness and user friendliness of the board level solvers. |
| Identificador |
hal-01392539 |
| Idioma(s) |
fr |
| Publicador |
HAL CCSD IEEE |
| Direitos |
http://creativecommons.org/licenses/by-nc/ |
| Fonte |
International Conference on Computational Nanoscience and Nanotechnology - Fifth International Conference on Modeling and Simulation of Microsystems (ICCN-MSM'02) https://hal.archives-ouvertes.fr/hal-01392539 International Conference on Computational Nanoscience and Nanotechnology - Fifth International Conference on Modeling and Simulation of Microsystems (ICCN-MSM'02), Apr 2002, San Juan, Puerto Rico, États-Unis. IEEE |
| Palavras-Chave | #PACS 8542 #[SPI.NANO] Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics |
| Tipo |
info:eu-repo/semantics/conferenceObject Conference papers |
