948 resultados para Thermal resistance


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Thermal resistance and thermal rise-time are two basic parameters that affect most of the performances of a laser diode greatly. By measuring waveforms received after a spectroscope at wavelengths varied step-by-step, the spectrally resolved waveforms can be converted to calculate the thermal rise-time. Basic formulas for the spectrum variation of a laser diode and the measurement set-up by using a Boxcar are described in the paper. As an example, the thermal rise-time of a p-side up packaged short-pulse laser diode was measured by the method to be 390 mu s. The method will be useful in characterizing diode lasers and LID modules in high-power applications. (c) 2005 Elsevier B.V. All rights reserved.

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Under high concentration the temperature of photovoltaic solar cells is very high. It is well known that the efficiency and performance of photovoltaic solar cells decrease with the increase of temperature. So cooling is indispensable for a concentrator photovoltaic solar cell at high concentration. Usually passive cooling is widely considered in a concentrator system. However, the thermal conduction principle of concentrator solar cells under passive cooling is seldom reported. In this paper, GaInP/GaAs/Ge triple junction solar cells were fabricated using metal organic chemical vapor deposition technique. The thermal conductivity performance of monolithic concentrator GaInP/GaAs/Ge cascade solar cells under 400X concentration with a heat sink were studied by testing the surface and backside temperatures of solar cells. The tested result shows that temperature difference between both sides of the solar cells is about 1K. A theoretical model of the thermal conductivity and thermal resistance of the GaInP/GaAs/Ge triple junction solar cells was built, and the calculation temperature difference between both sides of the solar cells is about 0.724K which is consistent with the result of practical test. Combining the theoretical model and the practical testing with the upper surface temperature of tested 310K, the temperature distribution of the solar cells was researched.

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This paper investigated the thermal design of the light emitting diode (LED)onto the board and its packaging. The LED was a 6-lead MultiLED with three chips designed for LCD backlighting and other lighting purposes. A 3D finite element model of this LED was built up and thermal analysis was carried out using the multi physics software package PHYSICA. The modeling results were presented as temperature distributions in each LED, and the predicted junction temperature was used for thermal resistance calculation. The results for the board structure indicated that (1) removing the foil attach decreased the thermal resistance, (2) Increasing the copper foil thickness reduced the thermal resistance. package design indicated that the SMT designed LED with integrated slug gave lower thermal resistance. Pb-free solder material gave lower thermal resistance and junction temperature when compared with conductive adhesive

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This paper provides a comprehensive analysis of thermal resistance of trench isolated bipolar transistors on SOI substrates based on 3D electro-thermal simulations calibrated to experimental data. The impact of emitter length, width, spacing and number of emitter fingers on thermal resistance is analysed in detail. The results are used to design and optimise transistors with minimum thermal resistance and minimum transistor area. (c) 2007 Elsevier Ltd. All rights reserved.

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The buried oxide (BOX) layer in silicon on insulator (SOI) was replaced by a compound buried layer (CBL) containing layers of SiO2, polycrystalline silicon (polysilicon), and SiO2. The undoped polysilicon in the CBL acted as a dielectric with a higher thermal conductivity than SiO2. CBL provides a reduced thermal resistance with the same equivalent oxide thickness as a standard SiO2 buried layer. Thermal resistance was further reduced by lateral heat flow through the polysilicon. Reduction in thermal resistance by up to 68% was observed, dependent on polysilicon thickness. CBL SOI substrates were designed and manufactured to achieve a 40% reduction in thermal resistance compared with an 1.0-μm SiO2 BOX. Power bipolar transistors with an active silicon layer thickness of 13.5 μm manufactured on CBL SOI substrates showed a 5%-17% reduction in thermal resistance compared with the standard SOI. This reduction was dependent on transistor layout geometry. Between 65% and 90% of the heat flow from these power transistors is laterally through the thick active silicon layer. Analysis confirmed that CBL SOI provided a 40% reduction in the vertical path thermal resistance. Devices employing thinner active silicon layers will achieve the greater benefit from reduction in vertical path thermal resistance offered by CBL SOI.

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Insulated-gate bipolar transistor (IGBT) power modules find widespread use in numerous power conversion applications where their reliability is of significant concern. Standard IGBT modules are fabricated for general-purpose applications while little has been designed for bespoke applications. However, conventional design of IGBTs can be improved by the multiobjective optimization technique. This paper proposes a novel design method to consider die-attachment solder failures induced by short power cycling and baseplate solder fatigue induced by the thermal cycling which are among major failure mechanisms of IGBTs. Thermal resistance is calculated analytically and the plastic work design is obtained with a high-fidelity finite-element model, which has been validated experimentally. The objective of minimizing the plastic work and constrain functions is formulated by the surrogate model. The nondominated sorting genetic algorithm-II is used to search for the Pareto-optimal solutions and the best design. The result of this combination generates an effective approach to optimize the physical structure of power electronic modules, taking account of historical environmental and operational conditions in the field.

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This paper presents a novel real-time power-device temperature estimation method that monitors the power MOSFET's junction temperature shift arising from thermal aging effects and incorporates the updated electrothermal models of power modules into digital controllers. Currently, the real-time estimator is emerging as an important tool for active control of device junction temperature as well as online health monitoring for power electronic systems, but its thermal model fails to address the device's ongoing degradation. Because of a mismatch of coefficients of thermal expansion between layers of power devices, repetitive thermal cycling will cause cracks, voids, and even delamination within the device components, particularly in the solder and thermal grease layers. Consequently, the thermal resistance of power devices will increase, making it possible to use thermal resistance (and junction temperature) as key indicators for condition monitoring and control purposes. In this paper, the predicted device temperature via threshold voltage measurements is compared with the real-time estimated ones, and the difference is attributed to the aging of the device. The thermal models in digital controllers are frequently updated to correct the shift caused by thermal aging effects. Experimental results on three power MOSFETs confirm that the proposed methodologies are effective to incorporate the thermal aging effects in the power-device temperature estimator with good accuracy. The developed adaptive technologies can be applied to other power devices such as IGBTs and SiC MOSFETs, and have significant economic implications. 

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Hemp-lime concrete is a sustainable alternative to standard building wall materials, with low associated embodied energy. It exhibits good hygric, acoustic and thermal properties, making it an exciting, sustainable building envelope material. When cast in temporary shuttering around a timber frame, it exhibits lower thermal conductivity than concrete, and consequently achieves low U-values in a primarily mono-material wall construction. Although cast relatively thick hemp-lime walls do not generally achieve the low U-values stipulated in building regulations. However assessment of its thermal performance through evaluation of its resistance to thermal transfer alone, underestimates its true thermal quality. The thermal inertia, or reluctance of the wall to change its temperature when exposed to changing environmental temperatures, also has a significant impact on the thermal quality of the wall, the thermal comfort of the interior space and energy consumption due to space heating. With a focus on energy reduction in buildings, regulations emphasise thermal resistance to heat transfer with only less focus on thermal inertia or storage benefits due to thermal mass. This paper investigates dynamic thermal responsiveness in hemp-lime concrete walls. It reports the influence of thermal conductivity, density and specific heat through analysis of steady state and transient heat transfer, in the walls. A novel hot-box design which isolates the conductive heat flow is used, and compared with tests in standard hot-boxes. Thermal diffusivity and effusivity are evaluated, using experimentally measured conductivity, based on analytical relationships. Experimental results evident that hemp-lime exhibits high thermal inertia. They show the thermal inertia characteristics compensate for any limitations in the thermal resistance of the construction material. When viewed together the thermal resistance and mass characteristics of hemp-lime are appropriate to maintain comfortable thermal indoor conditions and low energy operation.

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:ofiedian lethal temperatures ( LT50' s ) were determined for rainbow trout, Salmo gairdnerii, acclimated for a minimum of 21 days at 5 c onstant temperatures between 4 and 20 0 C. and 2 diel temperature fluctuations ( sinewave curves of amplitudes ± 4 and ± 7 0 C. about a mean temperature of 12 0 C. ) . Twenty-four-, 48-, and 96-hour LT50 estimates were c alculated f ollowing standard flow-through aquatic bioassay techniques and probi t transformation of mortality data. The phenomenon of delayed thermal mortality was also investigated. Shifts in upper incipient lethal temperature occurred as a result of previous thermal conditioning. It was shown that increases in constant acclimation temperature result in proportional l inear increases in thermal tolerances. The increase i n estimated 96-hour LT50's was approximately 0.13 0 c. X 1 0 C:1 between 8 and 20 0 C. The effect of acclimation to both cyclic temperature regimes was an increase in LT50 to values between the mean and maximum constant equivalent daily temperatures of the cycles. Twenty-four-, 48-, and 96-hour LT50 estimates of both cycles corresponded approximately to the LT50 values of the 16 0 C. c onstant temperature equivalent . This increase i n thermal tolerance was further demonstrated by the delayed thermal mortality experiments . Cycle amplitudes appeared to i nfluence thermal resistance through alterations in initi al mortality since mortality patterns characteristic of base temperature acclimations re-appeared after approximately 68 hours exposure to test temperatures for the 12 + 4 0 C. group, whereas mortality patterns stabilized and remained constant for a period greater than 192 hours with the larger therma l cycle ( 12 + 7 0 C. ). NO s ignificant corre lations between s pecimen weight and time-to-death was apparent. Data are discussed in relation to the establishment of thermal criteria for important commercial and sport fishes , such as the salmonids , as is the question whether previously reported values on lethal temperature s may have been under estimated.

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A laser-induced photoacoustic technique was employed to investigate thermal transport through nanocrystalline CePO4 samples prepared via the sol–gel route. Evaluation of thermal diffusivity was carried out using the one-dimensional model of Rosencwaig and Gersho for the reflection configuration of the photoacoustic method. Structural analyses of samples revealed that they are nanoporous in nature, possessing micron-sized grains. Analysis of results shows that thermal diffusivity value varies with sintering temperature. Results are explained in terms of the variation in porosity with sintering temperature and the effects of various scattering mechanisms on the propagation of phonons through the nanoporous ceramic matrix. Further analyses confirm that apart from porosity, grain boundary resistance and interface thermal resistance influence the effective value of thermal diffusivity of the samples under investigation.

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This study investigates the utilisation of a simplified model in the transient analysis of a thermal cooling process. In such process the external thermal resistance between the surface and the surroundings is high compared to the system internal thermal resistance, so that the first controls the heat transfer process. In this case the Biot number is lower than 0.1. Aluminium reels were utilised, which, with proper internal instrumentation, furnished experimental results for the thermal cooling process. Based on experimental data, a simplified model for the determination of the process film coefficient was used. Subsequently, experimental and theoretical results were compared. The change of the airflow direction was also investigated for the cooling process, aiming at process time optimisation. (C) 2001 Elsevier B.V. Ltd.

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The stagnant effective thermal conductivities (K0) of sugar cane bagasse (SCB), wheat bran (WB), orange pulp and peel (OPP) and their combination (weight proportion 1:2:2 SCB/OPP/WB) were obtained using the line heat source method. These solid materials were applied to pectinase production via solid-state fermentation. The moisture content ranged from 4 to 80% (w.b.). A conduction mechanism through the porous media was observed, along with conduction through a liquid film and contact thermal resistance between the samples and the probe. K0 was low for intermediate moisture contents and approached the molecular conductivity of water for high moisture contents. © 2013 Copyright Taylor and Francis Group, LLC.

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Thermal characterization of Concentrating Photovoltaics (CPV) modules and Arrays is needed to determine their performance and modelling of energy forecast. Module-ambient thermal resistance is easily obtained from its definition but the cell-module thermal resistant needs to be estimated from indirect procedures, two of them are presented in this paper. In addition, an equivalent parameter is defined, the Concentrator Nominal Operating Module/Cell Temperature (CNOMT/CNOCT), the temperature at Concentrator Standard Operating Conditions (CSOC). Definitions and expression to relate (CNOMT/CNOCT) to thermal resistances are presented, plus several examples of estimations from real operating arrays.

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The use of vegetal systems in facades affects the reduction of the buildings' energy demand, the attenuation of the urban heat island (UHI) and the filtration of pollutants present in the air. Even so, up to now the knowledge about the effect of this type of systems on the thermal performance of insulated facades is limited. This article presents the results of an experimental study carried out in a vegetal facade located in a continental Mediterranean climate zone. The objective is to study the effect of a vegetal finishing, formed by plants and substrate, on the thermal-energy performance of an insulated facade under summer conditions. To this effect, the thermal data obtained from two full-scale experimental mock-ups of the same dimensions and composition of the enclosure and only different in the south facade's enclosure where one incorporates a vegetation layer are compared and analysed. The results show that, in spite of the high thermal resistance of the enclosure, the effect of the vegetation is very positive, particularly in the warmer hours of the day. Therefore, vegetal facades can be used as a passive cooling strategy, reducing the consumption of energy for refrigeration and improving the comfort conditions of the users. (C) 2014 Elsevier Ltd. All rights reserved.

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The geothermal regime of the western margin of the Great Bahama Bank was examined using the bottom hole temperature and thermal conductivity measurements obtained during and after Ocean Drilling Program (ODP) Leg 166. This study focuses on the data from the drilling transect of Sites 1003 through 1007. These data reveal two important observational characteristics. First, temperature vs. cumulative thermal resistance profiles from all the drill sites show significant curvature in the depth range of 40 to 100 mbsf. They tend to be of concave-upward shape. Second, the conductive background heat-flow values for these five drill sites, determined from deep, linear parts of the geothermal profiles, show a systematic variation along the drilling transect. Heat flow is 43-45 mW/m**2 on the seafloor away from the bank and decreases upslope to ~35 mW/m**2. We examine three mechanisms as potential causes for the curved geothermal profiles. They are: (1) a recent increase in sedimentation rate, (2) influx of seawater into shallow sediments, and (3) temporal fluctuation of the bottom water temperature (BWT). Our analysis shows that the first mechanism is negligible. The second mechanism may explain the data from Sites 1004 and 1005. The temperature profile of Site 1006 is most easily explained by the third mechanism. We reconstruct the history of BWT at this site by solving the inverse heat conduction problem. The inversion result indicates gradual warming throughout this century by ~1°C and is agreeable to other hydrographic and climatic data from the western subtropic Atlantic. However, data from Sites 1003 and 1007 do not seem to show such trends. Therefore, none of the three mechanisms tested here explain the observations from all the drill sites. As for the lateral variation of the background heat flow along the drill transect, we believe that much of it is caused by the thermal effect of the topographic variation. We model this effect by obtaining a two-dimensional analytical solution. The model suggests that the background heat flow of this area is ~43 mW/m**2, a value similar to the background heat flow determined for the Gulf of Mexico in the opposite side of the Florida carbonate platform.