Possibility of press forming wood films into primary packaging

In recent times the packaging industry is finding means to maximize profit. Wood used to be the most advantageous and everyday material for packaging, worktables, counters, constructions, interiors, tools and as materials and utensils in the food companies in the world. The use of wood has declined vigorously, and other materials like plastic, ceramic, stainless steel, concrete, and aluminum have taken its place. One way that the industry could reduce its cost is by finding possibilities of using wood for primary packaging after which it can be safely recycled or burned as a carbon source for energy. Therefore, the main objective of this thesis is to investigate the possibility of press-forming a wood film into primary packaging. In order to achieve the stated objectives, discussion on major characteristics of wood in terms of structure, types and application were studied. Two different wood species, pine and birch were used for the experimental work. These were provided by a local carpentry workshop in Lappeenranta and a workshop in Ruokolahti supervised by Professor Timo Kärki. Laboratory tests were carried out at Lappeenranta University of Technology FMS workshop on Stenhøj EPS40 M hydraulic C-frame press coupled with National Instruments VI Logger and on the Adjustable packaging line machine at LUT Packaging laboratory. The tests succeeded better on the LUT packaging line than on the Stenhoj equipment due to the integrated heating system in the machine. However, there is much work to be done before the quality of a tray produced from the wood film is comparable to that of the wood plastic composite tray.

Reading films through political classics : genres of politics in popular cultures

Abstract: Readin films through political classics

Preparation, properties and applications of wheat gluten edible films

Selostus: Syötävien gluteenikalvojen valmistus, ominaisuudt ja eräät käyttösovellukset

A study of electromagnetic shielding properties of Ni79Fe16Mo5/copper films

The plane wave electromagnetic interference (EMI) shielding properties of DC sputtered Ni79Fe16Mo5 and copper layers were studied according to ASTM D 4935-89 on frequency range of 50 MHz – 2.5 GHz and RF magnetic shielding effectiveness by shielded magnetic loop probes. Results show that Ni79Fe16Mo5 provides better RF magnetic shielding above the layer thickness of approximately 120 nm. Copper provides better plane wave shielding effectiveness. The effect of shield internal interfaces was studied by depositing thin multilayer structures with and without a dielectric spacer layer.