55 resultados para uncorrected refractive error


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多层介质反射镜在非正入射的时候,两个不同的偏振态之间会产生不同的相移.根据空气与膜层、膜层之间的实际情况,建立了界面层和表面吸附层模型,并运用它分析相位延迟产生误差的原因.通过优化设计,入射角为54°,在1285~1345nm之间p,s波获得了270±1°的相移,同时也使反射率在99.5%以上.用离子束溅射技术制备相位延迟膜,用分光光度计测试了光谱特性和用椭偏仪测试了相位特性,在相应波段获得了262.4±1.8°的相移,同时也使反射率在99.6%以上.误差的主要来源是离子源工作特性会产生不均匀的过渡层和最

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多层介质反射镜在非正入射的时候,两个不同的偏振态之间会产生不同的相移。利用矩阵法,根据菲涅耳公式和电磁场边界条件,推导出p,s波的相移。通过优化设计.入射角为54°,在1285~1345nm之间p,s波获得了270°±1°的相移,同时也使反射率在99.5%以上。用离子束溅射技术制备相位延迟膜,用分光光度计测试了光谱特性和用椭偏仪测试了相位特性,在相应波段获得了262.4°±1.8°的相移,同时也使反射率在99.6%以上。误差的主要来源是离子源工作特性会产生不均匀的过渡层和最外层会吸收一些水气、灰尘等也产生

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多层介质反射镜在非正入射的时候,两个不同的偏振态之间会产生不同的相移。通过优化设计,入射角为45°,在1285~1345nm之间p,s波获得了270°±0.15°的相移和99.5%以上的反射率。对使用的膜系进行了每层光学厚度的误差分析。用离子柬溅射技术制备相位延迟膜,在大气中对样品进行不同温度的退火,用分光光度计测试了光谱特性和用椭偏仪测试了相位特性。结果表明,未退火的样品在相应波段获得了267.5°±0.5°的相移和99.6%以上的反射率;根据拟合分析,最外层的误差和折射率与设计值的偏差是发生相移偏小的

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对双源线性共蒸法制备的非均匀薄膜折射率分布与光学特性的关系作了探讨,并与均匀介质膜的光学特性作了对比;从折射率正变和负变两个方面.讨论了混合介质膜折射率不同变化规律对光学性能带来的影响;讨论了厚度误差和折射率极值误差对非均匀膜光学性能的影响。结果发现:折射率变化规律误差主要对非均匀膜的应用波段范围产生影响,而膜层厚度误差和折射率极值误差超过一定值时,将对薄膜光学特性产生重要影响。

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采用矢量法设计了三硼酸锂晶体上1064 nm、532 nm和355 nm三倍频增透膜,结果表明1064 nm、532 nm和355 nm波长的剩余反射率分别为0.0017%、0.0002%和0.0013%。根据误差分析,薄膜制备时沉积速率精度控制在+5.5%时,1064 nm、532 nm和355 nm波长的剩余反射率分别增加至0.20%、0.84%和1.89%。当材料折射率的变化控制在+3%时,1064 nm处的剩余反射率增大为0.20%,532 nm和355 nm处分别达0.88%和0.24%。与薄膜

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在4H-SiC基底上设计并制备了Al2O3/SiO2紫外双层减反射膜,通过扫描电镜(SEM)和实测反射率谱来验证理论设计的正确性。利用编程计算得到Al2O3和SiO2的最优物理膜厚分别为42.0nm和96.1nm以及参考波长λ=280nm处最小反射率为0.09%。由误差分析可知,实际镀膜时保持双层膜厚度之和与理论值一致有利于降低膜系反射率。实验中应当准确控制SiO2折射率并使Al2O3折射率接近1.715。用电子束蒸发法在4H-SiC基底上淀积Al2O3/SiO2双层膜,厚度分别为42nm和96nm。SEM截面图表明淀积的薄膜和基底间具有较强的附着力。实测反射率极小值为0.33%,对应λ=276nm,与理论结果吻合较好。与传统SiO2单层膜相比,Al2O3/SiO2双层膜具有反射率小,波长选择性好等优点,从而论证了其在4H-SiC基紫外光电器件减反射膜上具有较好的应用前景。

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精确的光学常数对于设计和制备高品质的光学薄膜非常重要,尤其是那些光学性能对折射率变化敏感的薄膜。SiO_2是一种常用的低折射率材料,因与常用基底折射率相近使其准确拟合有一定难度。实验通过离子束溅射制备了SiO_2单层膜。考虑测量时的误差和基底折射率的影响,采用透射率包络和反射率包络得到了SiO_2的折射率,并用所得折射率进行反演来对这两种途径在实际测量拟合过程中的准确性进行比对。分析表明,剩余反射率在实际的测量过程中误差更小,直接用测量镀膜前后基片的剩余反射率值可以更简便更准确地得到SiO_2的折射率,能达到10~(-2)的精度。

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The well known 'crystal seed' theory is first applied in this work to prepare TiO2 film: a high refractive index rutile TiO2 film is grown by electron beam evaporation on the rutile seed formed by 1100 degrees C annealing. The average n is larger than 2.4, by far the highest in all the authors' TiO2 films. The films are characterised by optical properties, microstructure and surface morphologies. It is found that the refractive index shows positive relation with the crystal structure, grain size, and packing density and roughness of the film. The film has lower density of granularity and nodule defects on the surface than those of the film deposited by magnetron sputtering. The result shows attractive application in complex filter and laser coatings.

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The third-order optical nonlinear refractive properties of InAs/GaAs quantum dots grown by molecular beam epitaxy have been measured using the reflection Z-scan technique at above-bandgap energy. The nonlinear refractive index and nonlinear absorption index of the InAs/GaAs quantum dots were determined for wavelengths from 740 to 777 nm. The measured results are compared with the nonlinear refractive response of several typical III-V group semiconductor materials. The corresponding mechanisms responsible for the large nonlinear response are discussed.

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The alternate combinational approach of genetic algorithm and neural network (AGANN) has been presented to correct the systematic error of the density functional theory (DFT) calculation. It treats the DFT as a black box and models the error through external statistical information. As a demonstration, the AGANN method has been applied in the correction of the lattice energies from the DFT calculation for 72 metal halides and hydrides. Through the AGANN correction, the mean absolute value of the relative errors of the calculated lattice energies to the experimental values decreases from 4.93% to 1.20% in the testing set. For comparison, the neural network approach reduces the mean value to 2.56%. And for the common combinational approach of genetic algorithm and neural network, the value drops to 2.15%. The multiple linear regression method almost has no correction effect here.

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Large-area concave refractive microlens arrays, or concave template structures, and then the non-refractive-index-gradient type of planar refractive microlens arrays in InP and quartz substrates, are fabricated utilizing the method consisting of conventional UV photolithography, thermal shaping of concave photoresist microlenses, etching with an argon ion beam of large diameter, and filling or growing optical medium structures onto the curved surfaces of preshaped concave templates. Several key conditions for fabricating concave and also planar microlenses are discussed in detail. The concave structures obtained are characterized by scanning electron microscope and surface profile measurements. The far-field optical characteristics of quartz/ZrO2 planar refractive microlens arrays have been acquired experimentally. (c) 2008 Society of Photo-Optical Instrumentation Engineers.

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A new method to measure reciprocal four-port structures, using a 16-term error model, is presented. The measurement is based on 5 two-port calibration standards connected to two of the ports, while the network analyzer is connected to the two remaining ports. Least-squares-fit data reduction techniques are used to lower error sensitivity. The effect of connectors is deembedded using closed-form equations. (C) 2007 Wiley Periodicals, Inc.

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Formulation of a 16-term error model, based on the four-port ABCD-matrix and voltage and current variables, is outlined. Matrices A, B, C, and D are each 2 x 2 submatrices of the complete 4 x 4 error matrix. The corresponding equations are linear in terms of the error parameters, which simplifies the calibration process. The parallelism with the network analyzer calibration procedures and the requirement of five two-port calibration measurements are stressed. Principles for robust choice of equations are presented. While the formulation is suitable for any network analyzer measurement, it is expected to be a useful alternative for the nonlinear y-parameter approach used in intrinsic semiconductor electrical and noise parameter measurements and parasitics' deembedding.