4 resultados para RTCVD
Resumo:
报道了快速热化学气相沉积(RTCVD)工艺制备多晶硅(poly -Si)薄膜及电池的实验和结果。采用SiH_2Co_2作为原料气体,衬底温度为1030℃时,薄膜的生长速率为10nm/s。发现薄膜的平均晶粒度及载流子迁移率与衬底温度和材料有关。用该薄膜在未抛光重掺杂磷的硅衬底上制备1cm~2的p~+n结样品电池,无减反射涂层,其转换效率为4.54%(AM1.5,100mW/cm~2,25℃)。
Resumo:
Polycrystalline silicon (poly-Si) films(similar to 10 mu m) were grown from dichlorosilane by a rapid thermal chemical vapor deposition (RTCVD) technique, with a growth rate up to 100 Angstrom/s at the substrate temperature (T-s) of 1030 degrees C. The average grain size and carrier mobility of the films were found to be dependent on the substrate temperature and material. By using the poly-Si films, the first model pn(+) junction solar cell without anti-reflecting (AR) coating has been prepared on an unpolished heavily phosphorus-doped Si wafer, with an energy conversion efficiency of 4.54% (AM 1.5, 100 mW/cm(2), 1 cm(2)).