Logoplaste: Internationalization to South Africa through flexible packaging

A Work Project, presented as part of the requirements for the Award of a Masters Degree in Management from the NOVA – School of Business and Economics

Logoplaste: Implementation of flexible packaging technology and internationalization to Nigeria

A Work Project, presented as part of the requirements for the Award of a Masters Degree in Management from the NOVA – School of Business and Economics

Strategy of Logoplaste in Mozambique's flexible plastic packaging industry

Logoplaste is a specialist in operating in-house industrial sites for manufacturing rigid plastic packaging containers. In developing countries, especially in Africa, the low income of consumers does not allow a widespread adoption of products typically sold in rigid plastic containers. In these countries the flexible packages are usually adopted as they allow for better ratios of cost/litter of product, particularly in smaller packages. Should Logoplaste offer this type of technology in order to expand into developing countries?

Packaging materials for shrimp, fish and fish products, their properties, selection and effect of different packaging materials on their shelf life

Packaging is important not only in extending the shellife of fish and fishery products but also improving their marketability. In the recent years, significant development have taken place in the packaging industry. During the past decade in India, there is almost a packaging revolution with the availability of variety packaging materials, thus generating better packaging consciousness in other producer/manufacturing industries. But unfortunately, such realisation is not forthcoming in the fisheries sector and packaging techniques for local and export trade continues to be on traditional lines with their inherent drawbacks and limitations. Better packaging ensures improved quality and presentation of the products and ensures higher returns to the producer. Among several packaging materials used in fishery industry, ISI specifications had been formulated only for corrugated fibre board boxes for export of seafoods and froglegs. This standard was formulated before containersiation came into existance in the export of marine products. Before containerisation, the standards were stringent in view of the rough handling, transportation and storage. Two of the common defects reported in the master cartons exported from India are low mechanical strength and tendency to get wet. They are weakened by the deposits of moisture caused by temperature fluctuations during loading, unloading and other handling stages. It is necessary to rectify the above defects in packaging aquatic products and hence in the present study extensive investigations are carried out to find out the reasons for the damage of master cartons, to evolve code of practice for the packaging oi frozen shrimp for exports, development of alternative style of packaging for the shipping container, development of suitable consumer packaging materials for fish soup powder, cured dried mackeral, fish pickles in oil and frozen shrimp. For the development of suitable packaging materials, it is absolutely essential to know the properties of packaging materials, effect of different packaging materials on theirshelf life and their suitability for food contact applications.

Embalagens Flexíveis: estudo do processo de reticulação de adesivos e do coeficiente de atrito

A dissertação foi realizada em ambiente industrial, mais precisamente na empresa Monteiro, Ribas – Embalagens Flexíveis, S.A.. Esta empresa dedica-se à impressão e laminagem de filmes, assim como à confeção de sacos. Os seus produtos são direcionados na sua maioria para a indústria alimentar, exportando mais de 50% da sua produção, e dizem respeito a complexos (dois ou mais filmes unidos pela presença de um adesivo) que podem possuir impressão ou não. Estes complexos podem ser enviados para o cliente em bobina ou já em saco. Os objetivos propostos pela empresa diziam respeito a estudos relacionados com a força de laminagem dos complexos, com o coeficiente de atrito dos mesmos e com a identificação dos espetros dos componentes dos adesivos, assim como o estudo do processo de reticulação dos mesmos por espetrofotometria de Infravermelho. Relativamente aos resultados obtidos verificou-se que tanto a tinta como os metalizados influenciam negativamente a força de laminagem. Por sua vez o coeficiente de atrito é afetado por vários fatores. Através dos ensaios experimentais verificou-se que o adesivo, a tinta e o verniz mate favorecem o aumento do valor do COF. Além disso, nos complexos em que se utilizaram filmes de polietileno de maior espessura obtiveram-se valores de COF mais baixos, e no que diz respeito à temperatura e à tensão de enrolamento, verificou-se que valores mais elevados e muito baixos da primeira traduzem-se num aumento do valor do COF e uma tensão de enrolamento maior também tem o mesmo efeito. Relativamente ao tipo de filme impresso, substratos com maior energia superficial atraem mais o agente de deslizamento (slip). Por último, não se conseguiu perceber qual o tipo de adesivo (com ou sem solvente) que tem maior impacto no COF uma vez que em 55% dos casos o valor do COF é superior nas amostras que foram complexadas com adesivo sem solvente e em 45% o COF era superior nas amostras complexadas com adesivo base solvente. No que diz respeito aos espetros obtidos verificou-se que a reticulação dos adesivos é identificada pela diminuição da extensão do pico correspondente à ligação N=C=O.

Avaliação das melhores técnicas disponíveis relativas à refrigeração industrial e às emissões resultantes da armazenagem

Esta dissertação foi realizada em colaboração com o grupo empresarial Monteiro, Ribas e teve como principais objetivos efetuar uma avaliação das melhores técnicas disponíveis relativas à refrigeração industrial e às emissões resultantes da armazenagem. O primeiro objetivo teve como alvo todas as instalações da Monteiro, Ribas enquanto que o segundo objetivo se debruçou sobre Monteiro, Ribas, Embalagens Flexíveis, S.A.. Para cumprir estes objetivos, inicialmente efetuou-se um levantamento das melhores técnicas disponíveis apresentadas nos respetivos documentos de referência. Em seguida selecionaram-se as técnicas que se adequavam às condições e às instalações em estudo e procedeu-se a uma avaliação de forma a verificar o grau de implementação das medidas sugeridas no BREF (Best Available Techniques Reference Document). Relativamente aos sistemas de refrigeração industrial verificou-se que estão implementadas quase todas as medidas referenciadas no respetivo documento de referência. Isto prende-se com o facto dos sistemas de refrigeração existentes no complexo industrial Monteiro, Ribas serem relativamente recentes. Foram implementados no ano de 2012, e são caracterizados por apresentarem uma conceção moderna com elevada eficiência. No que diz respeito à armazenagem de produtos químicos perigosos, a instalação em estudo, apresenta algumas inconformidades, uma vez que a maioria das técnicas mencionadas no BREF não se encontram implementadas, pelo que foi necessário efetuar uma avaliação de riscos ambientais, com recurso à metodologia proposta pela Norma Espanhola UNE 150008:2008 – Análise e Avaliação do Risco Ambiental. Para isso procedeu-se então à formulação de vários cenários de riscos e à quantificação de riscos para à Monteiro, Ribas Embalagens Flexíveis S.A., tendo-se apurado que os riscos estavam avaliados como moderados a altos. Por fim foram sugeridas algumas medidas de prevenção e de minimização do risco que a instalação deve aplicar, como por exemplo, o parque de resíduos perigosos deve ser equipado com kits de contenção de derrames (material absorvente), procedimentos a realizar em caso de emergência, fichas de dados de segurança e o extintor deve ser colocado num local de fácil visualização. No transporte de resíduos perigosos, para o respetivo parque, é aconselhável utilizar bacias de contenção de derrames portáteis e kits de contenção de derrames. Relativamente ao armazém de produtos químicos perigosos é recomendado que se proceda a sua reformulação tendo em conta as MTD apresentadas no subcapítulo 5.2.3 desta dissertação.

Algunas aplicaciones de los plásticos en las industrias del empaque y automotriz

The role of plastic materials in the packaging and automotive industries is commented. Specific applications such as poly(ethylene-terephtalate) as gas barrier on the soft-drink bottle industry and low density polyethylene on the flexible packaging industry are presented. The use of polypropylene, high density polyethylene and polyamides are also mentioned.

Development of a high-speed sensing and detection system for automatic removal of packages with leaky seals from a high-speed food processing and packaging line

Contamination of packaged foods due to micro-organisms entering through air leaks can cause serious public health issues and cost companies large amounts of money due to product recalls, consumer impact and subsequent loss of market share. The main source of contamination is leaks in packaging which allow air, moisture and microorganisms to enter the package. In the food processing and packaging industry worldwide, there is an increasing demand for cost effective state of the art inspection technologies that are capable of reliably detecting leaky seals and delivering products at six-sigma. The new technology will develop non-destructive testing technology using digital imaging and sensing combined with a differential vacuum technique to assess seal integrity of food packages on a high-speed production line. The cost of leaky packages in Australian food industries is estimated close to AUD $35 Million per year. Contamination of packaged foods due to micro-organisms entering through air leaks can cause serious public health issues and cost companies large sums of money due to product recalls, compensation claims and loss of market share. The main source of contamination is leaks in packaging which allow air, moisture and micro-organisms to enter the package. Flexible plastic packages are widely used, and are the least expensive form of retaining the quality of the product. These packets can be used to seal, and therefore maximise, the shelf life of both dry and moist products. The seals of food packages need to be airtight so that the food content is not contaminated due to contact with microorganisms that enter as a result of air leakage. Airtight seals also extend the shelf life of packaged foods, and manufacturers attempt to prevent food products with leaky seals being sold to consumers. There are many current NDT (non-destructive testing) methods of testing the seal of flexible packages best suited to random sampling, and for laboratory purposes. The three most commonly used methods are vacuum/pressure decay, bubble test, and helium leak detection. Although these methods can detect very fine leaks, they are limited by their high processing time and are not viable in a production line. Two nondestructive in-line packaging inspection machines are currently available and are discussed in the literature review. The detailed design and development of the High-Speed Sensing and Detection System (HSDS) is the fundamental requirement of this project and the future prototype and production unit. Successful laboratory testing was completed and a methodical design procedure was needed for a successful concept. The Mechanical tests confirmed the vacuum hypothesis and seal integrity with good consistent results. Electrically, the testing also provided solid results to enable the researcher to move the project forward with a certain amount of confidence. The laboratory design testing allowed the researcher to confirm theoretical assumptions before moving into the detailed design phase. Discussion on the development of the alternative concepts in both mechanical and electrical disciplines enables the researcher to make an informed decision. Each major mechanical and electrical component is detailed through the research and design process. The design procedure methodically works through the various major functions both from a mechanical and electrical perspective. It opens up alternative ideas for the major components that although are sometimes not practical in this application, show that the researcher has exhausted all engineering and functionality thoughts. Further concepts were then designed and developed for the entire HSDS unit based on previous practice and theory. In the future, it would be envisaged that both the Prototype and Production version of the HSDS would utilise standard industry available components, manufactured and distributed locally. Future research and testing of the prototype unit could result in a successful trial unit being incorporated in a working food processing production environment. Recommendations and future works are discussed, along with options in other food processing and packaging disciplines, and other areas in the non-food processing industry.

Packaging of Polyvinylidene fluoride nasal sensor for biomedical applications

This paper presents the design technique that has been adopted for packaging of Polyvinylidene fluoride (PVDF) nasal sensor for biomedical applications. The PVDF film with the dimension of length 10mm, width 5mm and thickness 28 mu m was firmly adhered on one end of plastic base (8mmx5mmx30 mu m) in such a way that it forms a cantilever configuration leaving the other end free for deflection. Now with the leads attached on the surface of the PVDF film, the cantilever configuration becomes the PVDF nasal sensor. For mounting a PVDF nasal sensor, a special headphone was designed, that can fit most of the human head sizes. Two flexible strings are soldered on either side of the headphone. Two identical PVDF nasal sensors were then connected to either side of flexible string of the headphone in such a way that they are placed below the right and left nostrils respectively without disturbing the normal breathing. When a subject wares headphone along with PVDF nasal sensors, two voltage signals due to the piezoelectric property of the PVDF film were generated corresponding to his/her nasal airflow from right and left nostril. The entire design was made compact, so that PVDF nasal sensors along with headphone can be made portable. No special equipment or machines are needed for mounting the PVDF nasal sensors. The time required for packaging of PVDF nasal sensors was less and the approximate cost of the entire assembly (PVDF nasal sensors + headphone) was very nominal.

Modelling the Performance of Flexible Substrates for Lead-Free Applications

In this paper, the performance of flexible substrates for lead-free applications was studied using finite element method (FEM). Firstly, the thermal induced stress in the flex substrate during the lead free solder reflow process was predicted. The shear stress at the interface between the copper track and flex was plotted. This shear stress increases with the thickness of the copper track. Secondly, an ACF flip chip was taken as a typical lead-free application of the flex substrate. The reflow effect on the reliability of ACF interconnections was analyzed. Higher stress was identified along the interface between the conductive particle and the metallization, and the interfacial stress increases with the reflow peak temperature and the coefficient of thermal expansion (CTE) of the adhesive. The moisture effect on the reliability of ACF joints were studied using a macro-micro modeling technique, the predominantly tensile stress found at the interface between the conductive particle and metallization could reduce the contact area and even cause the electrical failure. Modeling results are consistent with the findings in the experimental work

Modeling the effect of lead-free soldering on flexible substrates

Flexible Circuit Boards (FPCs) are now being widely used in the electronic industries especially in the areas of electronic packages. Due to European lead-free legislation which has been implemented since July 2006, electronic packaging industries have to switch to use in the lead-free soldering technology. This change has posed a number of challenges in terms of development of lead-free solders and compatible substrates. An increase of at least 20-50 degrees in the reflow temperature is a concern and substantial research is required to investigate a sustainable design of flexible circuit boards as carrier substrates. This paper investigates a number of design variables such as copper conductor width, type of substrate materials, effect of insulating materials, etc. Computer modeling has been used to investigate thermo-mechanical behavior, and reliability, of flexible substrates after they have been subjected to a lead- free solder processing. Results will show particular designs that behave better for a particular rise in peak reflow temperature. Also presented will be the types of failures that can occur in these substrates and what particular materials are more reliable.

Performance and reliability of flexible substrates when subjected to lead-free processing

The use of flexible substrates is growing in many applications such as computer peripherals, hand held devices, telecommunications, automotive, aerospace, etc. The drive to adopt flexible circuits is due to their ability to reduce size, weight, assembly time and cost of the final product.They also accommodate flexibility by allowing relative movement between component parts and provide a route for three dimensional packaging. This paper will describe some of the current research results from the Flex-No-Lead project, a European Commission sponsored research program. The principle aim of this project is to investigate the processing, performance, and reliability of flexible substrates when subjected to new environmentally friendly, lead-free soldering technologies. This paper will discuss the impact of specific design variables on performance and reliability. In particular the paper will focus on copper track designs, substrate material, dielectric material and solder-mask defined joints.

Modelling the reliability of components on flexible substrates

The use of flexible substrates is growing in many applications such as computer peripherals, hand held devices, telecommunications, automotive, aerospace, etc. The drive to adopt flexible circuits is due to their ability to reduce size, weight, assembly time and cost of final product. they also accommodate flexibility by allowing relative movement between component parts and provide a route for three dimensional packaging. This paper will describe some of the current research results from the Flex-No-Lead project, European Commission sponsored programme. The principle aim of this project is to investigate the processing, performance and reliability of flexible substrates when subjected to new environmentally friendly, lead-free soldering technologies. This paper will discuss the impact of specific design variables on performance and reliability. In particular the paper will focus on copper track designs, substrate material, dielectric material and solder mask defined joints

Impact of assembly process technologies on electronic packaging materials

Assembly processes used to bond components to printed circuit boards can have a significant impact on these boards and the final packaged component. Traditional approaches to bonding components to printed circuit boards results in heat being applied across the whole board assembly. This can lead to board warpage and possibly high residual stresses. Another approach discussed in this paper is to use Variable Frequency Microwave (VFM) heating to cure adhesives and underfills and bond components to printed circuit boards. In terms of energy considerations the use of VFM technology is much more cost effective compared to convection/radiation heating. This paper will discuss the impact of traditional reflow based processes on flexible substrates and it will demonstrate the possible advantages of using localised variable frequency microwave heating to cure materials in an electronic package.