Study of copper electrodeposition mechanism from a strike alkaline bath prepared with 1-hydroxyethane-1,1-diphosphonic acid through cyclic voltammetry technique

Copper strike baths are extensively used in metal plating industry as they present the ability to plate adherent copper layers on less-noble metal substrates such as steel and zinc die castings. However, in the last few years, due to environmental controls and safety policies for operators, the plating industry has been interested in replacing the toxic cyanide copper strike baths with environmentally friendly baths. A broad bibliographic review showed that the published papers, referring to the new nontoxic copper strike baths, are patents, having little or no emphasis focused on electrodeposition mechanisms. Therefore, it was decided to study the copper electrodeposition mechanism from a strike alkaline bath prepared with one of the most nontoxic chelating agents cited in many patents which is the 1-hydroxyethane-1,1-diphosphonic acid, known as HEDP. This acid forms very stable water soluble complexes with Cu(2+) ions, thus cupric sulfate was used for preparing the plating bath. The results obtained through a cyclic voltammetry technique showed that Cu(2+) ion reduction to Cu from an HEDP electrodeposition bath occurs via a direct reduction reaction without a formation of Cu(+) intermediates. (C) 2010 Elsevier Ltd. All rights reserved.

Copper electrodeposition on glassy carbon and highly oriented pyrolytic graphite substrates from perchlorate solutions

In present work, we analyzed the copper electrodeposition onto GCE (System I) and HOPGE (System II) from perchlorate solutions. The current density transients obtained from system I and II were well described through a kinetic mechanism that involves four different contributions: (a) a Langmuir type adsorption process, b) an electron transfer from Cu2+→Cu+, (c) a 3D nucleation limited by a mass transfer reaction and (d) a proton reduction process. It was observed that the values of the nucleation rate, the number of active nucleation sites were increased with the overpotential and they are bigger onto GCE in comparison with HOPGE.

In Situ Quantification of Cu(II) during an Electrodeposition Reaction Using Time-Domain NMR Relaxometry

The use of a low-cost benchtop time-domain NMR (TD-NMR) spectrometer to monitor copper electrodeposition in situ is presented. The measurements are based on the strong linear correlation between the concentration of paramagnetic ions and the transverse relaxation rates (R-2) of the solvent protons Two electrochemical NMR (EC-NMR) cells were constructed and applied to monitor the Cu2+ concentration during the electrodeposition reaction. The results show that TD-NMR relaxometry using the Carr-Purcell-Meiboom-Gill pulse sequence can be a very fast, simple, and efficient technique to monitor, in real time, the variation in the Cu2+ concentration during an electrodeposition reaction. This methodology can also be applied to monitor the electrodeposition of other paramagnetic ions, such as Ni2+ and Cr3+, which are commonly used in electroplating.

Influence of an inert electrolyte on the morphology of quasi-two-dimensional electrodeposits

The influence of an inert electrolyte (sodium sulfate) on quasi-two-dimensional copper electrodeposition from a nondeaerated aqueous copper sulfate solution has been analyzed. The different morphologies for a fixed concentration of CuSO4 have been classified in a diagram in terms of the applied potential and the inert electrolyte concentration. The main conclusion is the extension of the well-known Ohmic model for the homogeneous growth regime for copper sulfate solutions with small amounts of sodium sulfate. Moreover, we have observed the formation of fingerlike deposits at large applied potential and inert electrolyte concentration values, before hydrogen evolution becomes the main electrode reaction.

DESENVOLVIMENTO DE EXPERIMENTO DIDÁTICO DE ELETROGRAVIMETRIA DE BAIXO CUSTO UTILIZANDO PRINCÍPIOS DA QUÍMICA VERDE

In this paper, we describe the development of low-cost teaching experiments of electrogravimetry for undergraduate students using principles of green chemistry. Copper was electrochemically deposited on brass under an electrical current density of 50 mA cm−2 from acidic solutions containing nitrate anions. Color changes at the brass electrode and of the solution were observed, indicating that the reduction of copper ions had occurred. The deposition efficiency values were between 92.8% and 93.8%, and the electrochemical efficiency values were between 85.6% and 86.5%. There was no significant contribution from parallel reactions. These experimental conditions facilitated the didactic exploration of gravimetric and electrochemical concepts. Following the principles of green chemistry, the experiments produced no toxic substances, all the materials could be recycled, and the energy consumption was the lowest. For this reason, this experiment was considered to be very interesting for didactical purposes.

Magnetic nanohydrometallurgy: A promising nanotechnological approach for metal production and recovery using functionalized superparamagnetic nanoparticles

We report on a new, promising nanotechnological approach for hydrometallurgy based on recyclable, chemically functionalized superparamagnetic nanoparticles. In this process, the metal ions (e.g. Cu2+) are captured by the nanoparticles and confined at the electrode surface by means of an external magnet. Due to the pre-concentration effect the electrodeposition process is greatly improved, yielding the pure metal in a much shorter time in comparison with the conventional electrodeposition process. After the electrolysis, the magnetic nanoparticles are ready to return to the process. The proposed strategy can advantageously be incorporated in hydrometallurgy, reducing the number of steps associated with complexation, organic solvent extraction, metal release and diffusional electroprocessing, leading to a more sustainable technology. (C) 2012 Elsevier B.V. All rights reserved.

Electrochemical deposition of cupric ions for the determination of mass transfer rates to a stepped rotating cylinder electrode

The stepped rotating cylinder electrode (SRCE) geometry has been developed as a simple aid to the practical study of the flow-enhanced corrosion and applied electrochemistry problems commonly observed under conditions of disturbed, turbulent flow. The electrodeposition of cupric ions from an acid sulphate plating bath has been used to characterise differential rates of mass transfer to the SRCE. The variation in thickness of electrodeposited copperfilms has allowed the mapping of local rates of mass transfer over the active surface of this geometry. Both optical and scanning electron microscopy were used for the examination of metallographic sections to provide a high resolution evaluation of the distribution of mass transfer coefficient. Results are also discussed using the convective-diffusion model in combination with the existing direct numerical flow simulation (DNS) data for this geometry.

Electrodeposition of copper on titanium wires: Taguchi experimental design approach

Electrodeposition of thin copper layer was carried out on titanium wires in acidic sulphate bath. The influence of titanium surface preparation, cathodic current density, copper sulphate and sulphuric acid concentrations, electrical charge density and stirring of the solution on the adhesion of the electrodeposits was studied using the Taguchi statistical method. A L(16) orthogonal array with the six factors of control at two levels each and three interactions was employed. The analysis of variance of the mean adhesion response and signal-to-noise ratio showed the great influence of cathodic current density on adhesion. on the contrary, the other factors as well as the three investigated interactions revealed low or no significant effect. From this study optimized electrolysis conditions were defined. The copper electrocoating improved the electrical conductivity of the titanium wire. This shows that copper electrocoated titanium wires could be employed for both electrical purpose and mechanical reinforcement in superconducting magnets. (C) 2008 Elsevier B.V. All rights reserved.

Electrodeposition and characterization of nikel-copper metallic foams for application as electrodes for supercapacitors

Nickel-copper metallic foams were electrodeposited from an acidic electrolyte, using hydrogen bubble evolution as a dynamic template. Their morphology and chemical composition was studied by scanning electron microscopy and related to the deposition parameters (applied current density and deposition time). For high currents densities (above 1 A cm(-2)) the nickel-copper deposits have a three-dimensional foam-like morphology with randomly distributed nearly-circular pores whose walls present an open dendritic structure. The nickel-copper foams are crystalline and composed of pure nickel and a copper-rich phase containing nickel in solid solution. The electrochemical behaviour of the material was studied by cyclic voltammetry and chronopotentiometry (charge-discharge curves) aiming at its application as a positive electrode for supercapacitors. Cyclic voltammograms showed that the Ni-Cu foams have a pseudocapacitive behaviour. The specific capacitance was calculated from charge-discharge data and the best value (105 F g(-1) at 1 mA cm(-2)) was obtained for nickel-copper foams deposited at 1.8 A cm(-2) for 180 s. Cycling stability of these foams was also assessed and they present a 90 % capacitance retention after 10,000 cycles at 10 mA cm(-2).

Electrodeposition of copper on titanium wires: Taguchi experimental design approach

Electrodeposition of thin copper layer was carried out on titanium wires in acidic sulphate bath. The influence of titanium surface preparation, cathodic current density, copper sulphate and sulphuric acid concentrations, electrical charge density and stirring of the solution on the adhesion of the electrodeposits was studied using the Taguchi statistical method. A L(16) orthogonal array with the six factors of control at two levels each and three interactions was employed. The analysis of variance of the mean adhesion response and signal-to-noise ratio showed the great influence of cathodic current density on adhesion. on the contrary, the other factors as well as the three investigated interactions revealed low or no significant effect. From this study optimized electrolysis conditions were defined. The copper electrocoating improved the electrical conductivity of the titanium wire. This shows that copper electrocoated titanium wires could be employed for both electrical purpose and mechanical reinforcement in superconducting magnets. (C) 2008 Elsevier B.V. All rights reserved.

The Electrodeposition of Copper-Cobalt Alloys

An attempt was made to deposit a 50:50 copper-cobalt alloy from various sulfate electrolytes. No true 50:50 alloy was obtained but various mixtures of cobalt and copper rich crystals were deposited.

Electrodeposition of composite copper/liquid-containing microcapsule coatings

This paper presents results on the preparation of microcapsules containing liquid organosilica, and their co-deposition with copper in an acidic copper electrolyte onto a carbon steel cathode to form a copper/microcapsule composite coating. Microscopic analyses of the surface and the cross-section of the coating confirm the incorporation of the liquid-containing microcapsules in the coating layer. The influence of microcapsules in the electrolyte on the cathode polarization, as well as that of process conditions on the microcapsule inclusion, is also discussed. (C) 2004 Kluwer Academic Publishers.

Effect of pulsed current on the electrodeposition of chromium and copper

This research was concerned with the effects of pulsed current on the electrodeposition of chromium and copper. In the case of the latter metal, a novel application has been studied and a theory proposed for the ability to improve throwing power by the joint use of organic additives and pulsed reverse current. During the course of the research, several improvements were made to the pulse plating unit.Chromium. A study was made of the effect of square wave pulsed current on various physical properties of deposits from three hard chromium plating electrolytes. The effect of varying frequency at a duty cycle of 50% on the mean bulk internal stress, visual appearance, hardness, crack characteristics and surface topography of the electrodeposits was determined. X-ray diffraction techniques were used to study the phases present in the deposits. The effect of varying frequency on the cathodic efficiencies of the electrolytes was also determined. It was found that pulsed current reduced the internal stress of deposits from the sulphate catalysed electrolyte. It also reduced or eliminated cracking of deposits and reduced deposit brightness. Under certain conditions, pulsed current was found to induce the co-deposition of hydrides of chromium. Deposit hardness was found to be reduced by the use of pulsed current. Cathodic efficiencies of the high efficiency electrolytes were reduced by use of pulsed current although this effect was minimised at high frequencies. The sulphate catalysed electrolyte showed an increase in efficiency over the frequency range where hydrides were co-deposited.Copper. The polarisation behaviour of acid copper solutions containing polyethers, sulphopropyl sulphides and chloride ions was studied using both direct and pulse reverse current. The effect of these additives on the rest potentials of copper deposits immersed in the electrolyte was also studied. Hole Throwing Power on printed circuit boards was determined using a specially designed test cell. The effect of pulsed reverse current on the hole throwing power of commercially produced printed circuit boards was also studied. Polyethers were found to have an inhibiting effect on the deposition of copper whereas the sulphopropyl sulphides produced a stimulating (i.e. depolarising) effect. Studies of rest potentials made when both additives were present indicated that the sulphopropyl sulphide was preferentially adsorbed. The use of pulsed reverse current in solutions containing both polyether and sulphopropyl sulphide was found to cause desorption of the sulphopropyl sulphide at the cathode surface. Thus, at higher current densities, the inhibiting effect of the polyether produced an increase in the cathodic polarisation potential. At lower current densities, the depolarisation effect of the sulphopropyl sulphide could still occur. On printed circuit boards, this effect was found to produce an increase in the `hole throwing power' due to depolarisation of the holes relative to the surface of the boards. Typically, using direct current, hole/surface thickness ratios of 40% were obtained when plating 0.6 mm holes in a 3.2 mm thick board at a current density of 3 A/dm2 whereas using pulsed reverse current, ratios of 80% could be obtained at an equivalent rate of deposition. This was observed both in laboratory tests and on commercially plated boards.

Electrodeposition and characterization of Cu-Nb composite coatings

Copper coatings containing well-distributed Nb particles were obtained by co-electrodeposition in an acidic sulfate bath. Nb particle concentration in the bath was the most significant factor for the incorporation of Nb particles in copper, followed by stirring rate, whereas current density presented low significance. High Nb particle concentration and low stirring rate led to a higher incorporated Nb particle content. The microhardness of the composite layers was higher than that of pure copper deposits obtained under the same conditions due to copper matrix grain refinement and increased with the increase of both current density and incorporated Nb particle volume fraction. The corrosion resistance of Cu-Nb composites in 0.5 wt.% H(2)SO(4) solution at room temperature was higher than that of pure copper and increased with the increase of the Nb content. (C) 2010 Elsevier B.V. All rights reserved.

Characterization of copper-silicon nitride composite electrocoatings

Silicon nitride particles were incorporated to electrolytic copper by co-electrodeposition in acidic sulfate bath, aiming the improvement of its mechanical resistance. Smooth deposits containing well-distributed silicon nitride particles were obtained. The current density did not show significant influence on incorporated particle volume fraction, whereas the variation of particle concentration in the bath had a more pronounced effect. The microhardness of the composite layers was higher than that of pure copper deposits obtained under the same conditions and increased with the increase of incorporated particle volume fraction. The microhardness of composites also increased with the increase of current density due to copper matrix grain refining. The composite coatings were slightly more corrosion resistant than pure copper deposits in 3.5% NaCl solutions.