In Situ Quantification of Cu(II) during an Electrodeposition Reaction Using Time-Domain NMR Relaxometry
| Contribuinte(s) |
UNIVERSIDADE DE SÃO PAULO |
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| Data(s) |
04/11/2013
04/11/2013
2012
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| Resumo |
The use of a low-cost benchtop time-domain NMR (TD-NMR) spectrometer to monitor copper electrodeposition in situ is presented. The measurements are based on the strong linear correlation between the concentration of paramagnetic ions and the transverse relaxation rates (R-2) of the solvent protons Two electrochemical NMR (EC-NMR) cells were constructed and applied to monitor the Cu2+ concentration during the electrodeposition reaction. The results show that TD-NMR relaxometry using the Carr-Purcell-Meiboom-Gill pulse sequence can be a very fast, simple, and efficient technique to monitor, in real time, the variation in the Cu2+ concentration during an electrodeposition reaction. This methodology can also be applied to monitor the electrodeposition of other paramagnetic ions, such as Ni2+ and Cr3+, which are commonly used in electroplating. FAPESP FAPESP CNPq CNPq FINEP (Brazilian agencies) FINEP (Brazilian agencies) |
| Identificador |
ANALYTICAL CHEMISTRY, WASHINGTON, v. 84, n. 15, supl. 2, Part 3, pp. 6351-6354, AUG 7, 2012 0003-2700 http://www.producao.usp.br/handle/BDPI/37830 10.1021/ac3012889 |
| Idioma(s) |
eng |
| Publicador |
AMER CHEMICAL SOC WASHINGTON |
| Relação |
ANALYTICAL CHEMISTRY |
| Direitos |
closedAccess Copyright AMER CHEMICAL SOC |
| Palavras-Chave | #ELECTROCHEMICAL REACTIONS #SPECTROSCOPY #CHEMISTRY, ANALYTICAL |
| Tipo |
article original article publishedVersion |
