Electrodeposition of composite copper/liquid-containing microcapsule coatings


Autoria(s): Liqun, Zhu; Wei, Zhang; Feng, Liu; He, Yinghe
Data(s)

01/01/2004

Resumo

This paper presents results on the preparation of microcapsules containing liquid organosilica, and their co-deposition with copper in an acidic copper electrolyte onto a carbon steel cathode to form a copper/microcapsule composite coating. Microscopic analyses of the surface and the cross-section of the coating confirm the incorporation of the liquid-containing microcapsules in the coating layer. The influence of microcapsules in the electrolyte on the cathode polarization, as well as that of process conditions on the microcapsule inclusion, is also discussed. (C) 2004 Kluwer Academic Publishers.

Identificador

http://espace.library.uq.edu.au/view/UQ:72658

Idioma(s)

eng

Publicador

Kluwer Academic Publishers

Palavras-Chave #Materials Science, Multidisciplinary #Coatings #Electrodeposition #Electrolytes #Emulsions #Energy dispersive spectroscopy #Lubricants #Polarization #Scanning electron microscopy #Wear of materials #C1 #291301 Process Metallurgy #780199 Other #0904 Chemical Engineering #0912 Materials Engineering #0913 Mechanical Engineering
Tipo

Journal Article