A Detailed Look at Scale and Translation Invariance in a Hierarchical Neural Model of Visual Object Recognition

The HMAX model has recently been proposed by Riesenhuber & Poggio as a hierarchical model of position- and size-invariant object recognition in visual cortex. It has also turned out to model successfully a number of other properties of the ventral visual stream (the visual pathway thought to be crucial for object recognition in cortex), and particularly of (view-tuned) neurons in macaque inferotemporal cortex, the brain area at the top of the ventral stream. The original modeling study only used ``paperclip'' stimuli, as in the corresponding physiology experiment, and did not explore systematically how model units' invariance properties depended on model parameters. In this study, we aimed at a deeper understanding of the inner workings of HMAX and its performance for various parameter settings and ``natural'' stimulus classes. We examined HMAX responses for different stimulus sizes and positions systematically and found a dependence of model units' responses on stimulus position for which a quantitative description is offered. Interestingly, we find that scale invariance properties of hierarchical neural models are not independent of stimulus class, as opposed to translation invariance, even though both are affine transformations within the image plane.

A Multi-scale Model for Copper Dishing in Chemical-Mechanical Polishing

The present success in the manufacture of multi-layer interconnects in ultra-large-scale integration is largely due to the acceptable planarization capabilities of the chemical-mechanical polishing (CMP) process. In the past decade, copper has emerged as the preferred interconnect material. The greatest challenge in Cu CMP at present is the control of wafer surface non-uniformity at various scales. As the size of a wafer has increased to 300 mm, the wafer-level non-uniformity has assumed critical importance. Moreover, the pattern geometry in each die has become quite complex due to a wide range of feature sizes and multi-level structures. Therefore, it is important to develop a non-uniformity model that integrates wafer-, die- and feature-level variations into a unified, multi-scale dielectric erosion and Cu dishing model. In this paper, a systematic way of characterizing and modeling dishing in the single-step Cu CMP process is presented. The possible causes of dishing at each scale are identified in terms of several geometric and process parameters. The feature-scale pressure calculation based on the step-height at each polishing stage is introduced. The dishing model is based on pad elastic deformation and the evolving pattern geometry, and is integrated with the wafer- and die-level variations. Experimental and analytical means of determining the model parameters are outlined and the model is validated by polishing experiments on patterned wafers. Finally, practical approaches for minimizing Cu dishing are suggested.

A Multi-scale Model for Copper Dishing in Chemical-Mechanical Polishing

The present success in the manufacture of multi-layer interconnects in ultra-large-scale integration is largely due to the acceptable planarization capabilities of the chemical-mechanical polishing (CMP) process. In the past decade, copper has emerged as the preferred interconnect material. The greatest challenge in Cu CMP at present is the control of wafer surface non-uniformity at various scales. As the size of a wafer has increased to 300 mm, the wafer-level non-uniformity has assumed critical importance. Moreover, the pattern geometry in each die has become quite complex due to a wide range of feature sizes and multi-level structures. Therefore, it is important to develop a non-uniformity model that integrates wafer-, die- and feature-level variations into a unified, multi-scale dielectric erosion and Cu dishing model. In this paper, a systematic way of characterizing and modeling dishing in the single-step Cu CMP process is presented. The possible causes of dishing at each scale are identified in terms of several geometric and process parameters. The feature-scale pressure calculation based on the step-height at each polishing stage is introduced. The dishing model is based on pad elastic deformation and the evolving pattern geometry, and is integrated with the wafer- and die-level variations. Experimental and analytical means of determining the model parameters are outlined and the model is validated by polishing experiments on patterned wafers. Finally, practical approaches for minimizing Cu dishing are suggested.

The agreement between ipsative and normative questionnaires using compositional data analysis techniques

The main instrument used in psychological measurement is the self-report questionnaire. One of its major drawbacks however is its susceptibility to response biases. A known strategy to control these biases has been the use of so-called ipsative items. Ipsative items are items that require the respondent to make between-scale comparisons within each item. The selected option determines to which scale the weight of the answer is attributed. Consequently in questionnaires only consisting of ipsative items every respondent is allotted an equal amount, i.e. the total score, that each can distribute differently over the scales. Therefore this type of response format yields data that can be considered compositional from its inception. Methodological oriented psychologists have heavily criticized this type of item format, since the resulting data is also marked by the associated unfavourable statistical properties. Nevertheless, clinicians have kept using these questionnaires to their satisfaction. This investigation therefore aims to evaluate both positions and addresses the similarities and differences between the two data collection methods. The ultimate objective is to formulate a guideline when to use which type of item format. The comparison is based on data obtained with both an ipsative and normative version of three psychological questionnaires, which were administered to 502 first-year students in psychology according to a balanced within-subjects design. Previous research only compared the direct ipsative scale scores with the derived ipsative scale scores. The use of compositional data analysis techniques also enables one to compare derived normative score ratios with direct normative score ratios. The addition of the second comparison not only offers the advantage of a better-balanced research strategy. In principle it also allows for parametric testing in the evaluation

Composición factorial de la versión española de la Spence Children Anxiety Scale (SCAS).

Resumen tomado de la publicación

An??lisis de la estructura factorial de las puntuaciones de la 'Preschool and Kindergarten Behavior Scale' en poblaci??n espa??ola

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Evaluación de la equivalencia factorial y métrica de la Sexual Assertiveness Scale (SAS) por sexo.

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A Spanish adaptation of the Parental Stress Scale

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Validaci??n de la versi??n modificada de la Conflicts Tactics Scale (M-CTS) en poblaci??n juvenil espa??ola

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Spanish adaptation of the Adolescents' Perceived Collective Family Efficacy Scale

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Adaptaci??n de la Sydney Attribution Scale en poblaci??n universitaria espa??ola

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Development and validation of the Statistical Anxiety Scale. 'Desarrollo y validaci??n de la Escala de Ansiedad ante la Estad??stica'

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Local map update for large scale SLAM

A technique for simultaneous localisation and mapping (SLAM) for large scale scenarios is presented. This solution is based on the use of independent submaps of a limited size to map large areas. In addition, a global stochastic map, containing the links between adjacent submaps, is built. The information in both levels is corrected every time a loop is closed: local maps are updated with the information from overlapping maps, and the global stochastic map is optimised by means of constrained minimisation

The Liebowitz Social Anxiety Scale for Children and Adolescents. 'La Escala de Ansiedad Social de Liebowitz para Ni??os y Adolescentes'

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