995 resultados para Boron trifluoride


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A semi-insulating GaAs single crystal ingot was grown in a recoverable satellite, within a specially designed pyrolytic boron nitride crucible, in a power-traveling furnace under microgravity. The characteristics of a compound semiconductor single crystal depends fundamentally on its stoichiometry, i.e. the ration of two types of atoms in the crystal. a practical technique for nondestructive and quantitative measuring stoichiometry in GaAs single crystal was used to analyze the space-grown GaAs single crystal. The distribution of stoichiometry in a GaAs wafer was measured for the first time. The electrical, optical and structural properties of the space-grown GaAs crystal were studied systematically, Device fabricating experiments prove that the quality of field effect transistors fabricated from direct ion-implantation in semi-insulating GaAs wafers has a close correlation with the crystal's stoichiometry. (C) 2000 Elsevier Science S.A. All rights reserved.

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Experimental results have shown the fact that the deep-level centers in semi-insulating GaAs decrease with the improvement in stoichiometry. The electrical resistivity doubles when the concentration of EL2 centers decreases to a half. The microgravity-growth experiments also show that improved crystal stoichiometry results in a decrease of deep-level centers. (C) 1998 American Institute of Physics. [S0021-8979(98)04921-4].

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Homoepitaxial growth of 4H-SiC p(+)/pi/n(-) multi-epilayer on n(+) substrate and in-situ doping of p(+) and pi-epilayer have been achieved in the LPCVD system with SiH4+C2H4+H-2. The surface morphologies, homogeneities and doping concentrations of the n(-)-single-epilayers and the p(+)/pi/n(-) multi-epilayers were investigated by Nomarski, AFM, Raman and SIMS, respectively. AFM and Raman investigation showed that both single- and,multi-epilayers have good surface morphologies and homogeneities, and the SIMS analyses indicated the boron concentration in p+ layer was at least 100 times higher than that in pi layer. The UV photodetectors fabricated on 4H-SiC p(+)/pi/n(-) multi-epilayers showed low dark current and high detectivity in the UV range.

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本文以调控发光颜色、提高发光效率为目的,通过改变配体、中心金属离子、取代基等进行颜色调节;通过引入电子或空穴传输单元,实现发光分子的功能化进而改善载流子传输提高发光效率。文中主要以有机小分子和金属配合物为研究对象,它们本身都具有良好的发光性质。工作集中围绕以下几个问题展开:1、PPV齐聚物是一类高效发光的分子体系,如果在其中嵌入8一取代的哇琳单元对发光会有什么影响?2、使用含噁二唑(具有电子传输功能)的配体得到的金属配合物是否能同时拥有双重功能,即高效发光(金属配合物的特点)和优良的电子传输?3、由N2O-双齿配体转变成N,N-双齿配体,配合物的发光又会如何?4、稀土配合物具有高的光致发光效率,但电致发光效率非常低,能否通过咔哇或呛二吟功能化来改善载流子传输,提高电致发光效率?主要工作及取得的结果概述如下:1、经由Knoevenagel缩合反应合成了一系列共骊的2,21-(1,4-芳二乙烯基)双-8-取代喹啉。单晶X-射线衍射研究表明固态下存在分子间,π…π堆积相互作用,这对于载流子传输是比较有利的。喹啉8-位于的取代基的变化对发光影响不大,表明刚性共扼骨架对发光起主要贡献。改变中心的芳核,明显可以调控发光颜色。当存在分子内电荷转移时,与不存在的相比,发光显著红移。电致发光性质表明这些含双喳琳的PPV齐聚物是良好的发光和电子传输材料。2、存在分子内氢键的化合物2-(2-羟基苯基)-5-苯基-1,3,4-噁二唑(HOXD),具有激发态分子内质子转移(ESIPT)特性。在室温下,用365脚的紫外灯照射时表现强的兰色荧光。室温和低温(77K)下的磷光光谱表明它在固态下具有较强的磷光发射,与理论预测完全一致。多层电致发光器件ITO加PB/HOXD/BCP/Alq3/Mg:Ag最大亮度达到656cd/m2,电流效率为0.37cd/A。当把HoxD掺在cBP中时,亮度和效率都有一定程度的提高,达到870cd/m2和0.82cd/A。3、合成了含有德二哩配体(HOXD)的碱金属配合物MOxD(M=Li,Na,K)。我们发现配合物的发光颜色取决于中心金属离子,LiOXD是一个优良的蓝光材料,半峰宽是65nm,发射峰位在478nm,它也可以作为界面材料使用,起到和LIF相同的作用,即改善电子注入。同时作者首次报道了钠和钾的配合物可以用作发光材料。电致发光性质表明这些配合物是优良的蓝/绿色发光和电子注入/传输材料。4、使用从N双齿配体代替N,O-双齿配体(比如8-羟基喹啉),合成了含有2-(2-羟基喹啉)苯并咪唑的锌、铍和硼配合物。用硼配合物作为发光层的三层器件ITO/NPB/boron-complex/Alq3/LiF/A1所得到的光谱覆盖了从400到750nm的区域,表明获得了一个很好的白色发光。白光分别源于激子和激基复合物发光,由三种成分构成:来自于硼配合物的兰色发光(490nm);来自于Alq3的发光(535nln);NPB和BPh2(Pybm)界面形成的激基复合物发光(610nm)。器件最大亮度是110cd/m2最大效率是0.8cd/A。5、设计、合成了咔唑、噁二唑功能化的稀土馆配合物,期望通过改善空穴和电子传输来提高发光效率。含咔哇的配合物的双层器件发光光谱较宽,包括三价铺的特征发射和一个宽峰,可能是咔唑的发光。当使用TPD做空穴传输层时,噁二唑铺配合物的电致发光器件得到纯正明亮的红色发光,器件结构为ITO/TPD(40nm)/(OXD-PyBM)Eu(DBM)3(SOnm)/LiF(Inm)/Al(200m),启动电压为7.8V,在21v时达到最大亮度322cd/m2。亮度为57cd/m2和13.sv时电流效率最大,为1.9cd/A,对应外量子效率是1.7%。高的效率表明通过引入噁二唑基团,配合物的电子传输能力得到明显改善。6、初步研究了三线态发光的铱的金属有机配合物,得到了高亮度、高效率的绿色发光;对8-羟基喹啉锌配合物的高分子化也做了初步探讨。

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Solid films containing phosphorus impurities were formed on p-type silicon wafer surface by traditional spin-on of commercially available dopants. The doping process is accomplished by irradiating the sample with a 308 nm XeCl pulsed excimer laser. Shallow junctions with a high concentration of doped impurities were obtained. The measured impurity profile was ''box-like'', and is very suitable for use in VLSI devices. The characteristics of the doping profile against laser fluence (energy density) and number of laser pulses were studied. From these results, it is found that the sheet resistance decreases with the laser fluence above a certain threshold, but it saturates as the energy density is further increased. The junction depth increases with the number of pulses and the laser energy density. The results suggest that this simple spin-on dopant pre-deposition technique can be used to obtain a well controlled doping profile similar to the technique using chemical vapor in pulsed laser doping process.

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Infrared absorption experiments have been performed on hydrogenated and deuterated bulk boron- and aluminum-doped-Si and implanted P, As, and Sb donors in silicon. A first evidence of complex formation in bulk p-type Si is obtained and the spectra confirm the anomalous 3.3-cm-1 deuterium frequency shift with respect to boron isotopes. The ratio of the D-B-11 and D-B-10 peak areas is found to be the same as that of the two boron isotopes natural abundance. In donor-implanted silicon, a quantitative analysis of the obtained data has allowed a rough estimate of the passivating rate due to diffusing deuterium. While the frequencies of the various vibrational lines are found to be in agreement with those reported in the literature, the data on the broad line at 1660 cm-1 (H) or 1220 cm-1 (D) seem to suggest an assignment of this peak to a complex in the bulk involving some type of defect due to the implantation process.

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This paper investigates the effects of the diphasic structure on the optoelectronic properties of hydrogenated microcrystalline silicon (mu c-Si:H) films prepared in a triode three-chamber plasma-enhanced chemical vapor deposition (PECVD) system. The influences of boron-compensation doping on the dark-and photo-conductivity of mu c-Si:H films are also described. A tandem solar cell with an entirely mu c-Si:H p-i-n bottom cell and an a-Si:H top cell has been prepared with an initial conversion efficiency of 8.91% (0.126 cm(2), AM1.5, 100 mW/cm(2)).

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50mm SiC films with high electrical uniformity are grown on Si(111) by a newly developed vertical low-pressure chemical vapor deposition (LPCVD) reactor.Both in-situ n- and p-type doping of 3C-SiC are achieved by intentional introduction of ammonia and boron into the precursor gases.The dependence of growth rate and surface morphology on the C/Si ratio and optimized growth conditions is obtained.The best electrical uniformity of 50mm 3C-SiC films obtained by non-contact sheet resistance measurement is ±2.58%.GaN films are grown atop the as-grown 3C-SiC/Si(111) layers using molecular beam epitaxy (MBE).The data of both X-ray diffraction and low temperature photoluminescence of GaN/3C-SiC/Si(111) show that 3C-SiC is an appropriate substrate or buffer layer for the growth of Ⅲ-nitrides on Si substrates with no cracks.

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A semi-insulating GaAs single crystal ingot was grown in a recoverable satellite, within a specially designed pyrolytic boron nitride crucible, in a power-travelling furnace under microgravity. The crystal was characterized systematically and was used in fabricating low noise field effect transistors and analogue switch integrated circuits by the direct ion-implantation technique. All key electrical properties of these transistors and integrated circuits have surpassed those made from conventional earth-grown gallium arsenide. This result shows that device-grade space-grown semiconducting single. crystal has surpassed the best. terrestrial counterparts. Studies on the correlation between SI-GaAs wafers and the electronic devices and integrated circuits indicate that the characteristics of a compound semiconductor single crystal depends fundamentally on its stoichiometry.

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High quality hydrogenated amorphous silicon (a-Si:H) films have been prepared by a simple "uninterrupted growth/annealing" plasma enhanced chemical vapor deposition (PECVD) technique, combined with a subtle boron-compensated doping. These a-Si:H films possess a high photosensitivity over 10(6), and exhibit no degradation in photoconductivity and a low light-induced defect density after prolonged illumination. The central idea is to control the growth conditions adjacent to the critical point of phase transition from amorphous to crystalline state, and yet to locate the Fermi level close to the midgap. Our results show that the improved stability and photosensitivity of a-Si:H films prepared by this method can be mainly attributed to the formation of a more robust network structure and reduction in the precursors density of light-induced metastable defects.

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The heteroepitaxial growth of n-type and p-type 3C-SiC on (0001) sapphire substrates has been performed with a supply of SiH4+C2H4+H-2 system by introducing ammonia (NH3) and diborane (B2H6) precursors, respectively, into gas mixtures. Intentionally incorporated nitrogen impurity levels were affected by changing the Si/C ratio within the growth reactor. As an acceptor, boron can be added uniformly into the growing 3C-SiC epilayers. Nitrogen-doped 3C-SiC epilayers were n-type conduction, and boron-doped epilayers were p-type and probably heavily compensated.

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A semi-insulating GaAs single crystal ingot was grown in a recoverable satellite, within a specially designed pyrolytic boron nitride crucible, in a power-traveling furnace under microgravity. The characteristics of a compound semiconductor single crystal depends fundamentally on its stoichiometry, i.e. the ration of two types of atoms in the crystal. a practical technique for nondestructive and quantitative measuring stoichiometry in GaAs single crystal was used to analyze the space-grown GaAs single crystal. The distribution of stoichiometry in a GaAs wafer was measured for the first time. The electrical, optical and structural properties of the space-grown GaAs crystal were studied systematically, Device fabricating experiments prove that the quality of field effect transistors fabricated from direct ion-implantation in semi-insulating GaAs wafers has a close correlation with the crystal's stoichiometry. (C) 2000 Elsevier Science S.A. All rights reserved.

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The modifications induced in silicon samples by helium implantation before and after isothermal annealing at 673 K have been investigated. The surface morphology has been detected by atomic force microscopy. A hillock structure is observed on the sample surface before and after annealing for 5-10 min. Surface blister formation is observed with an increasing annealing time. The variation of crystal damage with annealing time has been investigated by Rutherford backscattering/channeling. The intensity of the damage peak first increases with annealing time, reaches maximum at an annealing time of 60 min and then decreases. Helium-induced bubbles and residual defects have been observed by transmission electron microscopy, which shows that dislocations are close to the bubbles. (C) 2010 Elsevier B.V. All rights reserved.