On The Thermally Induced Cracking Of A Segmented Coating Deposited On The Outer Surface Of A Hollow Cylinder

In this work, the thermally induced cracking behavior of a segmented coating has been investigated. The geometry under consideration is a hollow cylinder with a segmented coating deposited onto its outer surface. The segmentation cracks are modeled as a periodic array of axial edge cracks. The finite element method is utilized to obtain the solution of the multiple crack problem and the Thermal Stress Intensity Factors (TSIFs) are calculated. Based on dimensional analysis, the main parameters affecting TSIFs are identified. It has been found that the TSIF is a monotonically increasing function of segmentation crack spacing. This result confirms that a segmented coating exhibits much higher thermal shock resistance than an intact counterpart, if only the segmentation crack spacing is narrow enough. The dependence of TSIF on some other parameters, such as normalized time, segmentation crack depth, convection severity as well as material constants, has also been discussed. (C) 2008 Elsevier B.V. All rights reserved.

EVALUATION OF FILM-SUBSTRATE ADHESION VIA IMPACT USING COATED BULLETS

A method was devised to evaluate the adhesion between a film and a substrate. A front-end coated bullet is accelerated by a gas gun and hits the substrate of the specimen under test. The impact generates a compressive stress pulse that propagates toward the film. After transmission through the interface, part of the pulse is reflected on the free surface of the film, and tensile stress arises at the film-substrate interface, possibly inducing debonding of the film. This dynamic process was demonstrated analytically and simulated numerically by the finite element method. The results validate the initial concept and lay the foundation for further optimization of this method.

飞秒激光在石英玻璃中诱导微爆炸的理论研究

利用有限元方法建立了二维模型，研究了飞秒激光作用下石英玻璃中导带电子的产生、激光能量的沉积、导带电子和能量扩散等微观过程．计算了导带电子扩散引起的局部净电荷及其形成的静电场分布，初步揭示了微爆炸的演化过程．

大型干涉仪镜子的支承设计与温度变形分析

在星间激光通信中，涉及对大口径衍射极限激光波面的检测，为保证测量精度，必须严格控制波面十涉仪镜子的自重和温度变形。采用有限元方法对大型干涉仪镜子在不同支承方式下的表面变形进行了分析，结果表明，接触角为180°的钢带支承是较好的支承方式，反射镜表面变形峰-谷(P-V)值仅为1．35nm，均方根(RMS)值为0．363nm根据这一结论，设计了一个同定支承点与浮动支承相结合的超静定钢带支承结构。在该结构下，分析了镜子轴向、径向、周向的温度梯度效应，分析数据表明，镜子的热弹性变形远大于自重变形，建议采取一定的温控

飞秒激光辐射下微突起结构形成的超快热弹性模拟

本文结合有限元方法和超快热弹性模型对飞秒激光辐射下形成的微突起结构进行了数值模拟研究。模拟结果表明微突起结构的形成与入射飞秒激光的参数以及材料的热弹性质有关。在圆锥状微突起结构的形状和高度方面，实验结果与模拟结果呈现良好的一致性，这也从实验上表明了超快热弹性模型的有效性。本文的研究将有助于利用超快激光对薄膜材料进行纳米构造。

"神光-Ⅱ"装置第九路靶场终端光学组件的研制

针对“神光-Ⅱ”装置第九路系统主激光瞄准精度小于等于30μm和大焦斑辐照均匀性优于10％的要求，提出了靶场终端光学组件的设计结构。应用有限元法对组件关键机械元件和ICF靶室整体进行动静态分析，优化了设计参数。同时与聚焦透镜配合进行数值分析列阵透镜，确定了单元数、曲率和厚度以及单元长和宽等参数。经过实验测试，主激光瞄准精度达到28．9μm，大焦斑辐照的形状为1000μm×500μm，均匀性为12．0％。

神光Ⅱ装置中空间滤波器系统的稳定性设计与分析

考虑到空间滤波器系统在激光装置中的稳定性要求，分析了影响稳定性的各种因素。对现行装置中的SF4空间滤波器系统进行振动模态测试，初步确定系统的工作状况，并结合振动理论明确系统稳定性的设计参数。利用有限元软件ANSYS对空间滤波器系统及相关的设计进行仿真验证计算。结果表明：SF4系统的一阶固有频率达到83Hz，与实验结果相符合，满足系统稳定性的要求；在系统中引入支撑不但能有效增加系统的刚度，同时能转移系统的振型；系统基础支撑平台的选择要求平台独立，并且选择较低的高度以便于控制上层光学元件的变形；在系统中的引入

Optimization of thermal environment during crystal growth of large-sized Nd : YAG by Temperature Gradient Technique

A finite-element model is employed to analysis the thermal environments in Temperature Gradient Technique (TGT) furnace during the growth of large-sized Nd:YAG crystal. The obtained results show that when the crucible is located at the lower position inside of the heater, a flatter solid-liquid interface is established, which makes it easier to obtain the core-free Nd:YAG crystal. Meanwhile, the lower crucible position can induce higher axial temperature gradient, which is beneficial to the release of latent heat. (c) 2007 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Study of GaN growth on ultra-thin Si membranes

10 mu m-thick ultra-thin Si (111) membranes for GaN epi-layers growth were successfully fabricated on silicon-on-insulator (SOI) substrate by backside etching the handle Si and buried oxide (BOX) layer. Then 1 mu m-thick GaN layers were deposited on these Si membranes by metal-organic chemical vapor deposition (MOCVD). The crack-free areas of 250 mu m, x 250 mu m were obtained on the GaN layers due to the reduction of thermal stress by using these ultra-thin Si membranes, which was further confirmed by the photoluminescence (PL) spectra and the simulation results from the finite element method calculation by using the software of ANSYS. In this paper, a newly developed approach was demonstrated to utilize micromechanical structures for GaN growth, which would improve the material quality of the epi-layers and facilitate GaN-based micro electro-mechanical system (MEMS) fabrication, especially the pressure sensor, in the future applications. (C) 2008 Elsevier Ltd. All rights reserved.

Fabrication and analysis of 2x2 thermo-optic SOI waveguide switch with low power consumption and fast response by anisotropy chemical etching

A low power consumption 2 x 2 thermo-optic switch with fast response was fabricated on silicon-on-insulator by anisotropy chemical etching. Blocking trenches were etched on both sides of the phase-shifting arms to shorten device length and reduce power consumption. Thin top cladding layer was grown to reduce power consumption and switching time. The device showed good characteristics, including a low switching power of 145 mW and a fast switching speed of 8 +/- 1 mus, respectively. Two-dimensional finite element method was applied to simulate temperature field in the phase-shifting arm instead of conventional one-dimensional method. According to the simulated result, a new two-dimensional index distribution of phase-shifting arm was determined. Consequently finite-difference beam propagation method was employed to simulate the light propagation in the switch, and calculate the power consumption as well as the switching speed. The experimental results were in good agreement with the theoretical estimations. (C) 2004 Elsevier B.V. All rights reserved.

Thermal stress analysis for GaInAsP multiple quantum well wafer chemically bonded to Si (100)

An n-InP-based InGaAsP multiple-quantum-well wafer was bonded with p-Si by chemical surface activated bonding at 70 degrees C, and then annealed at 450 degrees C. Different thermal expansion coefficients between InP and Si will induce thermal stresses in the bonded wafer. Planar and cross-sectional distributions of thermal stress in the bonded InP-Si pairs were analyzed by a two-dimensional finite element method. In addition, the normal, peeling, and shear stresses were calculated by an analytic method. Furthermore, x-ray double crystalline diffraction was applied to measure the thermal strain and the strain caused by the mismatching of the crystalline orientation between InP (100) and Si (100). The wavelength redshift of the photoluminescence (PL) spectrum due to thermal strain was investigated via the calculation of the band structure, which is in agreement with the measured PL spectra.

Mechanisms of the sidewall facet evolution in lateral epitaxial overgrowth of GaN by MOCVD

The lateral epitaxial overgrowth of GaN was carried out by low-pressure metalorganic chemical vapor deposition, and the cross section shape of the stripes was characterized by scanning electron microscopy. Inclined {11-2n} facets (n approximate to 1-2.5) were observed in the initial growth, and they changed gradually into the vertical {11-20} sidewalls in accordance with the process of the lateral overgrowth. A model was proposed utilizing diffusion equations and boundary conditions to simulate the concentration of the Ga species constituent throughout the concentration boundary layer. Solutions to these equations are found using the two-dimensional, finite element method. We suggest that the observed evolution of sidewall facets results from the variation of the local V/III ratio during the process of lateral overgrowth induced by the lateral supply of the Ga species from the SiNx mask regions to the growing GaN regions.

Numerical analysis of LEC growth of GaAs with an axial magnetic field

A set of numerical analyses for momentum and heat transfer For a 3 in. (0.075 m) diameter Liquid Encapsulant Czochralski (LEC) growth of single-crystal GaAs with or without all axial magnetic field was carried Out using the finite-element method. The analyses assume a pseudosteady axisymmetric state with laminar floats. Convective and conductive heat transfers. radiative heat transfer between diffuse surfaces and the Navier-Stokes equations for both melt and encapsulant and electric current stream function equations Cor melt and crystal Lire considered together and solved simultaneously. The effect of the thickness of encapsulant. the imposed magnetic field strength as well as the rotation rate of crystal and crucible on the flow and heat transfer were investigated. (C) 2002 Published by Elsevier Science Ltd.

Impact of symmetrized and Burt-Foreman Hamiltonians on spurious solutions and energy levels of InAs/GaAs quantum dots

We present a systematic investigation of calculating quantum dots (QDs) energy levels using finite element method in the frame of eight-band k . p method. Numerical results including piezoelectricity, electron and hole levels, as yell as wave functions are achieved. In the calculation of energy levels, we do observe spurious solutions (SSs) no matter Burt-Foreman or symmetrized Hamiltonians are used. Different theories are used to analyse the SSs, we find that the ellipticity theory can give a better explanation for the origin of SSs and symmetrized Hamiltonian is easier to lead to SSs. The energy levels simulated with the two Hamiltonians are compared to each other after eliminating SSs, different Hamiltonians cause a larger difference on electron energy levels than that on hole energy levels and this difference decreases with the increase of QD size.

Effects of multistage coupling and disk flexibility on mistuned bladed disk dynamics

The effects ofdisk flexibility and multistage coupling on the dynamics of bladed disks with and without blade mistuning are investigated. Both free and forced responses are examined using finite element representations of example single and two-stage rotor models. The reported work demonstrates the importance of proper treatment of interstage (stage-to-stage) boundaries in order to yield adequate capture of disk-blade modal interaction in eigenfrequency veering regions. The modified disk-blade modal interactions resulting from interstage-coupling-induced changes in disk flexibility are found to have a significant impact on (a) tuned responses due to excitations passing through eigenfrequency veering regions, and (b) a design's sensitivity to blade mistuning. Hence, the findings in this paper suggest that multistage analyses may be required when excitations are expected to fall in or near eigenfrequency veering regions or when the sensitivity to blade mistuning is to be accounted for Conversely, the observed sensitivity to disk flexibility also indicates that the severity of unfavorable structural interblade coupling may be reduced significantly by redesigning the disk(s) and stage-to-stage connectivity. The relatively drastic effects of such modifications illustrated in this work indicate that the design modifications required to alleviate veering-related response problems may be less comprehensive than what might have been expected.