快重离子辐照引起Ni/SiO_2界面原子混合及相变研究

在室温下用308 MeV的Xe离子和853 MeV的Pb离子辐照Ni/Si O2样品,用卢瑟福背散射和X射线衍射技术对样品进行了分析。通过分析Ni/SiO2样品中元素成分分布和结构随离子辐照剂量和电子能损的变化,探索了离子辐照在Ni/SiO2样品中引起的界面原子混合与结构相变现象。实验结果显示,Xe和Pb离子辐照均能引起明显的Ni原子向SiO2基体的扩散并导致界面附近Ni,Si和O原子的混合。实验观测到低剂量Xe离子辐照可产生NiSi2相,而高剂量Xe离子辐照则导致了Ni3Si和Ni O相的形成。根据热峰模型,Ni原子的扩散和新相的形成可能由沿离子入射路径强电子激发引起的瞬间热峰过程驱动。

高能重离子辐照制备SiOC复合材料的研究

用120keV碳离子注入非晶SiO2薄膜,再用高能Xe、Pb和U离子辐照。注碳剂量范围为2.0×1017—8.6×1017 cm-2,高能离子辐照剂量1.0×1010—3.8×1012 cm-2。辐照后的样品用傅里叶变换红外光谱仪进行系统分析。实验结果显示,高能离子辐照在注碳非晶SiO2薄膜中形成了大量的Si-O-C键和Si-C键。这些Si-O-C结构具有环链、开链和笼链等多种结构形式。随电子能损、辐照剂量或者沉积能量密度的增加,SiOC结构由类笼向环/开链结构演化。对高能重离子驱动产生SiOC结构的机理进行了简单的讨论。

高能Xe离子辐照引起的注碳a:SiO_2中新结构的形成

先用120 keV的碳离子注入非晶二氧化硅a:SiO2薄膜,再用能量为1 754 MeV的Xe离子辐照。注碳量为5.0×1016—8.6×1017ion/cm2,Xe离子辐照剂量为1.0×1011和5.0×1011ion/cm2。辐照后的样品中形成的新结构用显微傅立叶变换红外光谱仪进行测试分析。结果表明,Xe离子辐照引起了注碳a:SiO2中Si—C,C—C,Si—O—C键以及CO和CO2分子的形成与演化。在注碳量较高时,Xe离子辐照在样品中产生了大量的Si—C键。与注入未辐照和辐照的低注碳量样品比较,增强的Si—C键的形成,预示着辐照可引起注碳a:SiO2样品中的SiC结构相变。

高能Pb离子辐照注碳SiO_2的红外谱研究

室温下,先用120keV的C离子注入二氧化硅薄膜样品至剂量2.0×1017,5.0×1017或8.6×1017ions/cm2,再用950MeV的Pb离子分别辐照至剂量5.0×1011,1.0×1012或3.8×1012ions/cm2,然后测量样品的傅里叶变换红外(FTIR)光谱.通过分析测量得到的傅里叶变换红外谱,发现Pb离子辐照在注碳SiO2样品中可引起大量的Si—C和Si(C)—O—C等化学键的形成,大剂量Pb离子辐照可在大剂量注碳的SiO2中产生分子CO2.大量的Si—C键的存在和分子CO2的形成,预示着高能Pb离子辐照在注碳SiO2样品中有可能形成了纳米Si团簇和/或SiC晶粒.

离子辐照对单晶Si中预注入B原子扩散的影响

室温下使用MeV能量级Si,F和O离子对 5keVB离子预注入后的n -型单晶Si( 1 0 0 )进行了辐照 ,应用二次离子质谱仪测试分析了掺杂物B原子的分布剖面及其变化 .结果表明 ,高剂量Si,F和O离子的附加辐照可以抑制热激活退火中B原子发生的瞬间增强扩散 .在相同的辐照条件下 ,Si近表面区域中SiO2层的存在更有助于限制B原子的瞬间增强扩散 .结合卢瑟福沟道背散射分析和DICADA程序计算对实验结果进行了讨论

V5+-doped Bi3.4Yb0.6Ti3O12 fatigue resistant ferroelectric thin films

In this paper, a serial of Bi3.4Yb0.6Ti3-xVxO12 (BYTV) thin film with different V5+ contents were deposited on Pt/Ti/SiO2/Si substrates by chemical solution deposition (CSD). The crystallized phase and electrical properties of the films were investigated using X-ray diffraction, polarization hysteresis loops, leakage current-voltage, and fatigue test. From our experimental results, it can be found that the ferroelectric properties can be improved greatly using V5+-doped in Bi3.4Yb0.6Ti3O12 (BYT) thin film, compared with the reported BYT thin film. The remanent polarization was enhanced and excellent leakage current characteristic with 10(-11)A at the bias voltage of 4V, which is much lower than the BYT thin film or some reported bismuth layer-structure ferroelectric films. Fatigue test shows that the fabricated films have good anti-fatigue characteristic after 10(10) switching cycles. (c) 2008 Published by Elsevier B.V.

Effects of helium and oxygen common implantation in silicon wafer

Defect engineering for SiO2] precipitation is investigated using He-ion implantation as the first stage of separation by implanted oxygen (STMOX). Cavities are created in Si by implantation with helium ions. After thermal annealing at different temperatures, the sample is implanted with 120keV 8.0 x 10(16) cm(-2) O ions. The O ion energy is chosen such that the peak of the concentration distribution is centred at the cavity band. For comparison, another sample is implanted with O ions alone. Cross-sectional transmission electron microscopy (XTEM), Fourier transform infrared absorbance spectrometry (FTIR) and atomic force microscopy (AFM) measurements are used to investigate the samples. The results show that a narrow nano-cavity layer is found to be excellent nucleation sites that effectively assisted SiO2 formation and released crystal lattice strain associated with silicon oxidation.