1000 resultados para Packaging Technology
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A Work Project, presented as part of the requirements for the Award of a Masters Degree in Management from the NOVA – School of Business and Economics
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Organising the PT- programme for full-time working adult students is a challenging task as it is an international programme with both domestic and foreign students with different educational background. The purpose of this project work is to provide both student and lecturer feedback for improving Master Of Science Degree Programme in Packaging Technology to meet better the requirements of part-time studying. The objective of this work is in accordance with the Lappeenranta University of Technology’s strategy to improve continuously degree programmes and courses and to use student feedback in this development work of education. Matters, such as lecture schemes, distance material distribution, distance assignment handling, course assessments, and guidance of thesis work will be under scrutiny.
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Mode of access: Internet.
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A Work Project, presented as part of the requirements for the Award of a Masters Degree in Management from the NOVA – School of Business and Economics
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This paper presents a thermal modeling for power management of a new three-dimensional (3-D) thinned dies stacking process. Besides the high concentration of power dissipating sources, which is the direct consequence of the very interesting integration efficiency increase, this new ultra-compact packaging technology can suffer of the poor thermal conductivity (about 700 times smaller than silicon one) of the benzocyclobutene (BCB) used as both adhesive and planarization layers in each level of the stack. Thermal simulation was conducted using three-dimensional (3-D) FEM tool to analyze the specific behaviors in such stacked structure and to optimize the design rules. This study first describes the heat transfer limitation through the vertical path by examining particularly the case of the high dissipating sources under small area. First results of characterization in transient regime by means of dedicated test device mounted in single level structure are presented. For the design optimization, the thermal draining capabilities of a copper grid or full copper plate embedded in the intermediate layer of stacked structure are evaluated as a function of the technological parameters and the physical properties. It is shown an interest for the transverse heat extraction under the buffer devices dissipating most the power and generally localized in the peripheral zone, and for the temperature uniformization, by heat spreading mechanism, in the localized regions where the attachment of the thin die is altered. Finally, all conclusions of this analysis are used for the quantitative projections of the thermal performance of a first demonstrator based on a three-levels stacking structure for space application.
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This report investigates adaptations of electronic packaging methods used to create stacks of these sensors. Four methods were developed and tested to determine the best option in terms of mechanical stability and electrical conductivity of the system. For the first method, a stack is created by way of through paper vias (TPVs), a hole that is cut in the pads of the sensors and then filled with electrically conductive adhesive through the openings on the two sensors to be joined. The second method is called mechanical caulking and connects sensors through pads which have been lined with copper tape backed with conductive adhesive. The connection is created with a small copper rivet which is flattened in place by compressive force. The third method is the stitching method which is inspired by sewing of fabric. A pattern of thin copper wire is stitched on the pad of a sensor that is lined with copper tape backed with conductive adhesive. The wire is then stitched through a second sensor that is treated similarly with copper tape and the stack receives the same pattern through the two layers as was applied to the first sensor alone. The final method is the collapsed daisy chain which is the linear connection of sensors to their neighboring sensors via copper tape backed with conductive adhesive. The row of sensors is then collapsed in an alternating orientation into a single stack.
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Objective: To design, introduce, and evaluate STD syndrome packets containing recommended drugs for each syndrome, four condoms, a partner treatment card, and a patient information leaflet, with the goal of improving sexually transmitted disease (STD) case management. Methods: Packet design evolved around available packaging technology, informed by pilot testing with nurses working in primary care clinics, doctors in private medical practices, and patients with an STD, in Hlabisa, South Africa. Evaluation 1 year later included analysis of distribution records and interviews with 16 nurses and 61 patients. Results: A cheap packet (2 U, S, cents each, excluding contents) compatible with current legislation was designed and introduced to six public sector clinics and as a short pilot to five private medical practices, Four thousand eighty-five packets were distributed to the clinics, equivalent to approximately 115% of the STDs reported over that period. All 16 nurses reported using the packets, but only 63% did so all the time because of occasional supply problems, All believed the packets improved treatment by saving time (75%), improving supply of condoms and partner cards (44%), and making treatment easier (56%), Patients also responded positively, and most said they would buy a packet (up to $5) at a pharmacy (84%) or store (63%) if available. Conclusions: The STD syndrome packets have the potential to improve STD syndromic management by standardizing therapy and improving the supply of condoms, partner cards, and information leaflets. Packets are popular with practitioners and patients, but consistent supply is essential for maximal impact, There may be scope for social marketing of the packets, which could further increase use.
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Nos últimos anos a indústria de semicondutores, nomeadamente a produção de memórias, tem sofrido uma grande evolução. A necessidade de baixar custos de produção, assim como de produzir sistemas mais complexos e com maior capacidade, levou à criação da tecnologia WLP (Wafer Level Packaging). Esta tecnologia permite a produção de sistemas mais pequenos, simplificar o fluxo do processo e providenciar uma redução significativa do custo final do produto. A WLP é uma tecnologia de encapsulamento de circuitos integrados quando ainda fazem parte de wafers (bolachas de silício), em contraste com o método tradicional em que os sistemas são individualizados previamente antes de serem encapsulados. Com o desenvolvimento desta tecnologia, surgiu a necessidade de melhor compreender o comportamento mecânico do mold compound (MC - polímero encapsulante) mais especificamente do warpage (empeno) de wafers moldadas. O warpage é uma característica deste produto e deve-se à diferença do coeficiente de expansão térmica entre o silício e o mold compound. Este problema é observável no produto através do arqueamento das wafers moldadas. O warpage de wafers moldadas tem grande impacto na manufatura. Dependendo da quantidade e orientação do warpage, o transporte, manipulação, bem como, a processamento das wafers podem tornar-se complicados ou mesmo impossíveis, o que se traduz numa redução de volume de produção e diminuição da qualidade do produto. Esta dissertação foi desenvolvida na Nanium S.A., empresa portuguesa líder mundial na tecnologia de WLP em wafers de 300mm e aborda a utilização da metodologia Taguchi, no estudo da variabilidade do processo de debond para o produto X. A escolha do processo e produto baseou-se numa análise estatística da variação e do impacto do warpage ao longo doprocesso produtivo. A metodologia Taguchi é uma metodologia de controlo de qualidade e permite uma aproximação sistemática num dado processo, combinando gráficos de controlo, controlo do processo/produto, e desenho do processo para alcançar um processo robusto. Os resultados deste método e a sua correta implementação permitem obter poupanças significativas nos processos com um impacto financeiro significativo. A realização deste projeto permitiu estudar e quantificar o warpage ao longo da linha de produção e minorar o impacto desta característica no processo de debond. Este projecto permitiu ainda a discussão e o alinhamento entre as diferentes áreas de produção no que toca ao controlo e a melhoria de processos. Conseguiu–se demonstrar que o método Taguchi é um método eficiente no que toca ao estudo da variabilidade de um processo e otimização de parâmetros. A sua aplicação ao processo de debond permitiu melhorar ou a fiabilidade do processo em termos de garantia da qualidade do produto, como ao nível do aumento de produção.
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The objectives of the study were to introduce current issues of chilled and frozen food packaging, priorize certain customer needs and review brand owners’ opinions and ways of actions. Packaging industry and packaged food markets were reviewed. Interviews of food industry brand owners are used as data sources. Analytic hierarchy process was used to prioritize the customer needs. Food packaging, special features of ready meals, chilled and frozen food packaging, packaging industry and packaged food markets in Europe are approached using literature and market reviews and forecasts. In empirical part the customer needs of paperboard trays are prioritized. The most important features for brand owners are related in product safety and environmental issues. Paperboard trays have benefits compared to its competing packaging solutions. Paperboard is recyclable, from renewable source and it has good printability. Emerging issues of packaging technology are biodegradable package, elderly friendly features such as easiness of opening and re-closing possibility, brand protection and tamper evident solutions.
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Proteins contain hydrophilic groups, which can bind to water molecules through hydrogen bridges, resulting in water vapour adsorption. An increase in the degree of cross-linking can be a method to improve the cohesiveness force and functional properties of protein-based films. Thus, the objective of this work was to evaluate the effect of chemical treatment of gelatin with formaldehyde and glyoxal on the mechanical properties, water vapour permeability (WVP) and water vapour sorption characteristics of gelatin-based films. Films were produced using gelatin, with and without chemical treatment. The formaldehyde treatments caused a significant increase in the tensile strength and a reduction in the WVP of films. The Guggenheim-Anderson-De Boer and Halsey models could be used to model the sorption isotherms of films. It was observed that an increase in temperature produced a decrease in water sorption, and the chemical modifications did not affect the monolayer moisture content. Copyright (c) 2007 John Wiley & Sons, Ltd.
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The aim of this work was to investigate the effect of glycerol contents on physical properties of cassava starch films. The films were prepared from film-forming solutions (FFS) with 2g cassava starch/100g water and 0, 15, 30 and 45g glycerol/100g starch, and were analysed to determine its mechanical properties by tensile tests, the glass-transition temperature (T-g) by differential scanning calorimetry (DSC) and the crystallinity by X-ray diffraction (XRD). The infrared spectra of the films were also recorded. The resistance values of the films decreased, while those of the elasticity increased with an increase in glycerol concentration due to the plasticizer effect of glycerol, which was also observed in DSC curves. The T-g of the films prepared decreased with the glycerol content. However, for samples with 30 and 45g glycerol/100g starch, two T-g curves were observed, probably due to a phase separation phenomenon. According to the XRD diffractograms, the films with 0 and 15gglycerol/100g starch presented an amorphous character, but some tendency to show crystalline peaks were observed for films with 30 and 45g glycerol/100g starch. The results obtained with Fourier transform infrared (FTIR) corroborated these observations. Copyright (C) 2007 John Wiley & Sons, Ltd.
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Tinuvin P migration from Polyethyleneterephthalate (PET) bottles was investigated using several fatty-food simulants such as olive oil, soybean oil, n-heptane and iso-octane, at exposure conditions of 2-10 days at 40 degrees C (total immersion). The stability of several UV stabilizers (BHT, Cyasorb UV 5411, Tinuvin P, Tinuvin 326 and Tinuvin 327) in n-heptane and iso-octane was also studied. After 10 days at 40 degrees C, losses of 6% and 20% in iso-octane and n-heptane respectively, were verified for Tinuvin P. Other UV stabilizers at the same experimental conditions showed higher losses (up to 30% for Tinuvin 327). These results confirm that, when carrying out specific migration studies, the stability of the substance of interest should be established in the food simulant to avoid underestimating the real migration behaviour. In order to quantify UV stabilizer migration, n-heptane and iso-octane solutions were concentrated and directly analysed by SIM mode GC-MS. For olive and soybean oils, Tinuvin P was isolated using size-exclusion chromatography and quantified by SIM mode GC-MS. Iso-octane proved to be a move suitable fatty-food simulant than n-heptane for the migration study of Tinuvin P from PET. Higher levels of Tinuvin P migrated to olive and soybean oils rather than to n-heptane. These results suggest that the MERCOSUL recommended official methods for specific migration studies should be revised since the migration levels using n-heptane as a fatty-food simulant could be underestimated when compared to edible oils. Copyright (C) 1999 John Wiley & Sons, Ltd.
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Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)
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Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)