Millimeter-wave printed circuit board characterization using substrate integrated waveguide resonators

This paper proposes a substrate integrated waveguide
(SIW) cavity-based method that is compliant with
ground-signal–ground (GSG) probing technology for dielectric
characterization of printed circuit board materials at millimeter
wavelengths. This paper presents the theory necessary to retrieve
dielectric parameters from the resonant characteristics of SIW
cavities with particular attention placed on the coupling scheme
and means for obtaining the unloaded resonant frequency. Different
sets of samples are designed and measured to address the
influence of the manufacturing process on the method. Material
parameters are extracted at - and -band from measured data
with the effect of surface roughness of the circuit metallization
taken into account.

Electronic Circuit Packages

This invention relates to electronic circuit packages designed to hold high frequency circuits operating particularly, but not exclusively, in the microwave, millimeter wave, and sub-millimeter wave bands. The invention provides a package incorporating a cavity in a material for containment of the circuits, wherein the package further incorporates at least one conductive surface mounted on an inner surface extending into the cavity, the conductivity thereof being adapted to be at least partially absorbent to electromagnetic radiation. The conductive surface according to the present invention will tend to attenuate electromagnetic radiation present within the cavity, and so help to prevent undesired coupling from one point to another within the cavity. The conductivity of the conductive material is preferably arranged to match the impedance of the radiation mode estimated or computed to be present within the cavity.

IMPLEMENTATION OF SIGNAL PROCESSING FUNCTIONS USING 1-BIT SYSTOLIC ARRAYS.

The use of systolic arrays of 1-bit cells to implement a range of important signal processing functions is demonstrated. Two examples, a pipelined multiplier and a pipelined bit-slice transform circuit, are given. This approach has many important implications for silicon technology, and these are outlined.

BIT-LEVEL SYSTOLIC ARRAY CIRCUIT FOR MATRIX VECTOR MULTIPLICATION.

A bit-level systolic array for computing matrix x vector products is described. The operation is carried out on bit parallel input data words and the basic circuit takes the form of a 1-bit slice. Several bit-slice components must be connected together to form the final result, and authors outline two different ways in which this can be done. The basic array also has considerable potential as a stand-alone device, and its use in computing the Walsh-Hadamard transform and discrete Fourier transform operations is briefly discussed.