Millimeter-wave printed circuit board characterization using substrate integrated waveguide resonators

This paper proposes a substrate integrated waveguide<br/>(SIW) cavity-based method that is compliant with<br/>ground-signal–ground (GSG) probing technology for dielectric<br/>characterization of printed circuit board materials at millimeter<br/>wavelengths. This paper presents the theory necessary to retrieve<br/>dielectric parameters from the resonant characteristics of SIW<br/>cavities with particular attention placed on the coupling scheme<br/>and means for obtaining the unloaded resonant frequency. Different<br/>sets of samples are designed and measured to address the<br/>influence of the manufacturing process on the method. Material<br/>parameters are extracted at - and -band from measured data<br/>with the effect of surface roughness of the circuit metallization<br/>taken into account.