936 resultados para Photonics packaging
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The 24-mer DNA aptamer of Harada and Frankel ( Harada, K.; Frankel, A. D. EMBO J. 1995, 14, 5798-5811) that binds L-argininamide (L-Arm) was studied by electrospray ionization Fourier transform mass spectrometry (ESI-FTMS). This DNA folds into a stem and loop such that the loop is able to engulf L-Arm. As controls, two derivatives of the same base composition, one with the same stem but a scrambled loop and the other with no ability to form a secondary structure, were studied. The two DNAs that could fold into stem-loop structures showed a more negatively charged distribution of ions than the linear control. This tendency was preserved in the presence of ligand; complexes expected to have more secondary structure had ions with more negative charges. Distinct species corresponding to no, one, and two bound L-Arm molecules were observed for each DNA. The fractional peak intensities were fit to a straightforward binding model and binding constants were obtained. Thus, ESI-FTMS can provide both qualitative and quantitative data regarding the structure of DNA and its interactions with noncovalent ligands.
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Many efforts have been made in fabricating three-dimensional (3D) ordered zinc oxide (ZnO) nanostructures due to their growing applications in separations, sensors, catalysis, bioscience, and photonics. Here, we developed a new synthetic route to 3D ZnO-based hollow microspheres by a facile solution-based method through a water-soluble biopolymer (sodium alginate) assisted assembly from ZnO nanorods. The products were characterized by X-ray diffraction, field emission scanning electron microscopy, transmission electron microscopy, selected area electron diffraction, and X-ray photoelectron spectroscopy. Raman and photoluminescence spectra of the ZnO-based hollow microspheres were obtained at room temperature to investigate their optical properties. The hollow microspheres exhibit exciting emission features with a wide band covering nearly all the visible region. The calculated CIE (Commission Internationale d'Eclairage) coordinates are 0.24 and 0.31, which fall at the edge of the white region (the 1931 CIE diagram). A possible growth mechanism of the 3D ZnO superstructures based on typical biopolymer-crystal interactions in aqueous solution is tentatively proposed, which might be really interesting because of the participation of the biopolymer.
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为了避免人眼对产品外观质量检测时,人眼视觉疲劳所产生的产品错检、漏检,提出了基于机器视觉的烟支条盒包装质量检测系统的设计。该系统由光源、相机、图像采集卡和工业控制计算机组成视觉系统处理单元,应用定位配准、边缘检测和斑点分析等图像处理算法完成对产品缺陷的检测。该视觉检测系统已经在烟厂得到了实际应用,对今后开发类似的基于机器视觉的产品外观质量检测系统具有一定的参考价值和指导意义。
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Atualmente, no Brasil, a embalagem mais usada para tomate continua sendo a caixa de madeira que era usada para transportar querosene na Segunda Guerra Mundial, há meio século, conhecida por caixa ´K´. Os aspectos desejáveis da caixa 'K' incluem o fato de ser retornável e resistente. Os aspectos indesejáveis incluem o fato de possuir superfície áspera; alojar patógenos, funcionando como fonte de inóculo; aberturas laterais cortantes; profundidade excessiva, que comporta grande número de camadas de produtos; ser tampada. Essas características favorecem às injúrias mecânicas e comprometem a durabilidade e qualidade das hortaliças. Sabendo-se que as necessidades de proteção dos produtos vegetais são diferentes, torna-se necessário que as embalagens para protegê-los sejam específicas. Assim, o objetivo deste trabalho é desenvolver uma embalagem apropriada para tomate. O protótipo foi testado em relação à caixa 'K' e caixa de plástico já existente no mercado. Logo após a colheita os mesmos tratamentos foram deixados no sol ou na sombra, durante duas horas, para observar se influenciariam os frutos. As características avaliadas foram: variação de matéria fresca, aferida através de balança; vida útil, pelo período em que o vegetal esteve em perfeitas condições de ser comercializado; cor, pela escala com quatro classes para pimentão; variação da firmeza, medida por "push-pull"; teor relativo de água; deterioração, pelo número e peso de frutos deteriorados. Devido à grande influência dos danos mecânicos sobre as perdas pós-colheita, provavelmente este seja o fator mais importante na avaliação do protótipo. Houve diferença estatística entre os tratamentos, sendo que o protótipo apresentou as menores porcentagens de danos mecânicos, o que é desejável. Também houve diferença estatística para deterioração. Nas demais características, o protótipo não diferiu estatisticamente dos outros tratamentos.
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As multiprocessor system size scales upward, two important aspects of multiprocessor systems will generally get worse rather than better: (1) interprocessor communication latency will increase and (2) the probability that some component in the system will fail will increase. These problems can prevent us from realizing the potential benefits of large-scale multiprocessing. In this report we consider the problem of designing networks which simultaneously minimize communication latency while maximizing fault tolerance. Using a synergy of techniques including connection topologies, routing protocols, signalling techniques, and packaging technologies we assemble integrated, system-level solutions to this network design problem.
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This thesis describes the design and implementation of an integrated circuit and associated packaging to be used as the building block for the data routing network of a large scale shared memory multiprocessor system. A general purpose multiprocessor depends on high-bandwidth, low-latency communications between computing elements. This thesis describes the design and construction of RN1, a novel self-routing, enhanced crossbar switch as a CMOS VLSI chip. This chip provides the basic building block for a scalable pipelined routing network with byte-wide data channels. A series of RN1 chips can be cascaded with no additional internal network components to form a multistage fault-tolerant routing switch. The chip is designed to operate at clock frequencies up to 100Mhz using Hewlett-Packard's HP34 $1.2\\mu$ process. This aggressive performance goal demands that special attention be paid to optimization of the logic architecture and circuit design.
Using an Outdoor Learning Space to Teach Sustainability and Material Processes in HE product Design.
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The world is facing environmental changes that are increasingly affecting how we think about manufacturing, the consumption of products and use of resources. Within the HE product design community, thinking and designing sustainability’ has evolved to become a natural part of the curriculum. Paradoxical as the rise in awareness of sustainability increases there is growing concern within HE product design of the loss of workshop facilities and as a consequence a demise in teaching traditional object-making skills and material experimentation. We suggest the loss of workshops and tangible ‘learning by making skills’ also creates a lost opportunity for a rich learning resource to address sustainable thinking, design and manufacture ‘praxis’ within HE design education. Furthermore, as learning spaces are frequently discussed in design research, there seems to be little focus on how the use of an outdoor environment might influence learning outcomes particularly with regard to material teaching and sustainability. This 'case study' of two jewellery workshops, used outdoor learning spaces to explore both its impact on learning outcomes and to introduce some key principles of sustainable working methodologies and practices. Academics and students mainly from Norway and Scotland collaborated on this international research project. Participants made models from disposable packaging materials, which were cast in tin, in the sand on a local beach, using found timber to create a heat source for melting the metal. This approach of using traditional making skills, materials and nature was found to be a relevant contribution to a sustainable discourse.
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Ellis, D. I., Broadhurst, D., Kell, D. B., Rowland, J. J., Goodacre, R. (2002). Rapid and quantitative detection of the microbial spoilage of meat by Fourier Transform Infrared Spectroscopy and machine learning. ? Applied and Environmental Microbiology, 68, (6), 2822-2828 Sponsorship: BBSRC
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The influence of process variables (pea starch, guar gum and glycerol) on the viscosity (V), solubility (SOL), moisture content (MC), transparency (TR), Hunter parameters (L, a, and b), total color difference (ΔE), yellowness index (YI), and whiteness index (WI) of the pea starch based edible films was studied using three factors with three level Box–Behnken response surface design. The individual linear effect of pea starch, guar and glycerol was significant (p < 0.05) on all the responses. However, a value was only significantly (p < 0.05) affected by pea starch and guar gum in a positive and negative linear term, respectively. The effect of interaction of starch × glycerol was also significant (p < 0.05) on TR of edible films. Interaction between independent variables starch × guar gum had a significant impact on the b and YI values. The quadratic regression coefficient of pea starch showed a significant effect (p < 0.05) on V, MC, L, b, ΔE, YI, and WI; glycerol level on ΔE and WI; and guar gum on ΔE and SOL value. The results were analyzed by Pareto analysis of variance (ANOVA) and the second order polynomial models were developed from the experimental design with reliable and satisfactory fit with the corresponding experimental data and high coefficient of determination (R2) values (>0.93). Three-dimensional response surface plots were established to investigate the relationship between process variables and the responses. The optimized conditions with the goal of maximizing TR and minimizing SOL, YI and MC were 2.5 g pea starch, 25% glycerol and 0.3 g guar gum. Results revealed that pea starch/guar gum edible films with appropriate physical and optical characteristics can be effectively produced and successfully applied in the food packaging industry.
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Projeto de Pós-Graduação/Dissertação apresentado à Universidade Fernando Pessoa como parte dos requisitos para obtenção do grau de Mestre em Ciências Farmacêuticas
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In this paper, a prototype of miniaturized, low power, bi-directional wireless sensor node for wireless sensor networks (WSN) was designed for doors and windows building monitoring. The capacitive pressure sensors have been developed particularly for such application, where packaging size and minimization of the power requirements of the sensors are the major drivers. The capacitive pressure sensors have been fabricated using a 2.4 mum thick strain compensated heavily boron doped SiGeB diaphragm is presented. In order to integrate the sensors with the wireless module, the sensor dice was wire bonded onto TO package using chip on board (COB) technology. The telemetric link and its capabilities to send information for longer range have been significantly improved using a new design and optimization process. The simulation tool employed for this work was the Designerreg tool from Ansoft Corporation.
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Two complementary wireless sensor nodes for building two-tiered heterogeneous networks are presented. A larger node with a 25 mm by 25 mm size acts as the backbone of the network, and can handle complex data processing. A smaller, cheaper node with a 10 mm by 10 mm size can perform simpler sensor-interfacing tasks. The 25mm node is based on previous work that has been done in the Tyndall National Institute that created a modular wireless sensor node. In this work, a new 25mm module is developed operating in the 433/868 MHz frequency bands, with a range of 3.8 km. The 10mm node is highly miniaturised, while retaining a high level of modularity. It has been designed to support very energy efficient operation for applications with low duty cycles, with a sleep current of 3.3 μA. Both nodes use commercially available components and have low manufacturing costs to allow the construction of large networks. In addition, interface boards for communicating with nodes have been developed for both the 25mm and 10mm nodes. These interface boards provide a USB connection, and support recharging of a Li-ion battery from the USB power supply. This paper discusses the design goals, the design methods, and the resulting implementation.
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The objective of this paper is to investigate the effect of the pad size ratio between the chip and board end of a solder joint on the shape of that solder joint in combination with the solder volume available. The shape of the solder joint is correlated to its reliability and thus of importance. For low density chip bond pad applications Flip Chip (FC) manufacturing costs can be kept down by using larger size board pads suitable for solder application. By using “Surface Evolver” software package the solder joint shapes associated with different size/shape solder preforms and chip/board pad ratios are predicted. In this case a so called Flip-Chip Over Hole (FCOH) assembly format has been used. Assembly trials involved the deposition of lead-free 99.3Sn0.7Cu solder on the board side, followed by reflow, an underfill process and back die encapsulation. During the assembly work pad off-sets occurred that have been taken into account for the Surface Evolver solder joint shape prediction and accurately matched the real assembly. Overall, good correlation was found between the simulated solder joint shape and the actual fabricated solder joint shapes. Solder preforms were found to exhibit better control over the solder volume. Reflow simulation of commercially available solder preform volumes suggests that for a fixed stand-off height and chip-board pad ratio, the solder volume value and the surface tension determines the shape of the joint.